JPH0375535U - - Google Patents
Info
- Publication number
- JPH0375535U JPH0375535U JP13776689U JP13776689U JPH0375535U JP H0375535 U JPH0375535 U JP H0375535U JP 13776689 U JP13776689 U JP 13776689U JP 13776689 U JP13776689 U JP 13776689U JP H0375535 U JPH0375535 U JP H0375535U
- Authority
- JP
- Japan
- Prior art keywords
- lid
- insulating base
- semiconductor device
- package
- accommodating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
Landscapes
- Packaging Frangible Articles (AREA)
Description
第１図は本考案の半導体素子収納用パツケージ
の一実施例を示す分解斜視図、第２図は第１図の
パツケージ内部に半導体素子を収容した状態を示
す断面図である。
１……絶縁基体、２……蓋体、３……絶縁容器
、６……外部リード端子、Ａ……標識。
FIG. 1 is an exploded perspective view showing an embodiment of a package for housing semiconductor elements of the present invention, and FIG. 2 is a sectional view showing a state in which semiconductor elements are housed inside the package of FIG. 1. 1... Insulating base, 2... Lid, 3... Insulating container, 6... External lead terminal, A... Label.
Claims (1)
を収容するための空所を有する半導体素子収納用
パツケージにおいて、前記絶縁基体もしくは蓋体
の外表面に底部の平坦度が５０μｍ以下の凹状標
識を設けたことを特徴とする半導体素子収納用パ
ツケージ。 In a semiconductor device storage package consisting of an insulating base and a lid and having a cavity for accommodating a semiconductor device inside, a recessed mark with a bottom flatness of 50 μm or less is provided on the outer surface of the insulating base or the lid. A package cage for storing semiconductor elements, characterized by the following:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13776689U JPH0375535U (en) | 1989-11-27 | 1989-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13776689U JPH0375535U (en) | 1989-11-27 | 1989-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0375535U true JPH0375535U (en) | 1991-07-29 |
Family
ID=31684909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13776689U Pending JPH0375535U (en) | 1989-11-27 | 1989-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0375535U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63175448A (en) * | 1987-01-16 | 1988-07-19 | Hitachi Ltd | Semiconductor device |
-
1989
- 1989-11-27 JP JP13776689U patent/JPH0375535U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63175448A (en) * | 1987-01-16 | 1988-07-19 | Hitachi Ltd | Semiconductor device |
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