JPH0436235U - - Google Patents
Info
- Publication number
- JPH0436235U JPH0436235U JP7838290U JP7838290U JPH0436235U JP H0436235 U JPH0436235 U JP H0436235U JP 7838290 U JP7838290 U JP 7838290U JP 7838290 U JP7838290 U JP 7838290U JP H0436235 U JPH0436235 U JP H0436235U
- Authority
- JP
- Japan
- Prior art keywords
- recess
- insulating base
- semiconductor device
- package
- lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000013078 crystal Substances 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Die Bonding (AREA)
Description
第１図は本考案に係る半導体素子収納用パツケ
ージの一実施例を示す断面図である。
１……絶縁基体、１ａ……凹部、２……蓋体、
４……金属層、５……接着材、６，６……封止用
ガラス部材。
FIG. 1 is a sectional view showing an embodiment of a package for housing semiconductor elements according to the present invention. 1... Insulating base, 1a... Recess, 2... Lid,
4... Metal layer, 5... Adhesive material, 6, 6... Glass member for sealing.
Claims (1)
る絶縁基体と蓋体とから成る半導体素子収納用パ
ツケージにおいて、前記絶縁基体の凹部底面に結
晶粒径が８．０乃至１４．０μｍの銀から成る金
属層を被着させたことを特徴とする半導体素子収
納用パツケージ。 In a semiconductor device storage package comprising an insulating base and a lid having a recess on the upper surface for accommodating the semiconductor device, a metal made of silver having a crystal grain size of 8.0 to 14.0 μm is provided on the bottom of the recess of the insulating base. A package cage for storing semiconductor elements characterized by having a layer applied thereto.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7838290U JPH0436235U (en) | 1990-07-24 | 1990-07-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7838290U JPH0436235U (en) | 1990-07-24 | 1990-07-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0436235U true JPH0436235U (en) | 1992-03-26 |
Family
ID=31621613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7838290U Pending JPH0436235U (en) | 1990-07-24 | 1990-07-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0436235U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4948266A (en) * | 1972-09-13 | 1974-05-10 |
-
1990
- 1990-07-24 JP JP7838290U patent/JPH0436235U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4948266A (en) * | 1972-09-13 | 1974-05-10 |