JPH0363939U - - Google Patents

Info

Publication number
JPH0363939U
JPH0363939U JP1989125453U JP12545389U JPH0363939U JP H0363939 U JPH0363939 U JP H0363939U JP 1989125453 U JP1989125453 U JP 1989125453U JP 12545389 U JP12545389 U JP 12545389U JP H0363939 U JPH0363939 U JP H0363939U
Authority
JP
Japan
Prior art keywords
brazed
metal layer
metal base
hole
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989125453U
Other languages
Japanese (ja)
Other versions
JPH083009Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989125453U priority Critical patent/JPH083009Y2/en
Publication of JPH0363939U publication Critical patent/JPH0363939U/ja
Application granted granted Critical
Publication of JPH083009Y2 publication Critical patent/JPH083009Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の半導体素子収納用パツケージ
の一実施例を示す断面図、第２図は第１図に示す
半導体素子収納用パツケージの絶縁枠体の平面図
、第３図は従来の半導体素子収納用パツケージの
断面図である。 １……金属基体、１ａ……貫通孔、２……絶縁
枠体、４……金属層、４ａ……凸部、５……ロウ
材。 FIG. 1 is a sectional view showing an embodiment of the package for storing semiconductor elements of the present invention, FIG. 2 is a plan view of the insulating frame of the package for storing semiconductor elements shown in FIG. FIG. 3 is a cross-sectional view of a package for housing an element. DESCRIPTION OF SYMBOLS 1...Metal base, 1a...Through hole, 2...Insulating frame, 4...Metal layer, 4a...Protrusion, 5...Brazing material.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 中央部に半導体素子を収容する貫通孔を有し、
下面の略全面に金属層が被着されている絶縁枠体
を金属基体に、該金属基体の上面外周部と絶縁枠
体に被着させた金属層の貫通孔周縁部とをロウ付
けすることによつて取着して成る半導体素子収納
用パツケージにおいて、前記金属層は金属基体の
ロウ付け部周囲に枠状の凸部が形成されているこ
とを特徴とする半導体素子収納用パツケージ。 It has a through hole in the center that accommodates the semiconductor element,
An insulating frame having a metal layer adhered to substantially the entire lower surface thereof is brazed to a metal base, and an outer peripheral portion of the upper surface of the metal base and a peripheral edge of a through-hole in the metal layer adhered to the insulating frame are brazed. 1. A package for accommodating a semiconductor element, wherein the metal layer has a frame-shaped protrusion formed around a brazed portion of the metal base.
JP1989125453U 1989-10-26 1989-10-26 Package for storing semiconductor devices Expired - Lifetime JPH083009Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989125453U JPH083009Y2 (en) 1989-10-26 1989-10-26 Package for storing semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989125453U JPH083009Y2 (en) 1989-10-26 1989-10-26 Package for storing semiconductor devices

Publications (2)

Publication Number Publication Date
JPH0363939U true JPH0363939U (en) 1991-06-21
JPH083009Y2 JPH083009Y2 (en) 1996-01-29

Family

ID=31673323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989125453U Expired - Lifetime JPH083009Y2 (en) 1989-10-26 1989-10-26 Package for storing semiconductor devices

Country Status (1)

Country Link
JP (1) JPH083009Y2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002131164A (en) * 2000-10-27 2002-05-09 Kyocera Corp Package for pressure detection device
JP2003007885A (en) * 2001-06-26 2003-01-10 Kyocera Corp Package for storing semiconductor element
JP2009144295A (en) * 2007-12-17 2009-07-02 Gunze Ltd Garment with solid knitted part

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5576463B2 (en) * 2012-12-13 2014-08-20 第一ゴム株式会社 Footwear, boots and boots

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002131164A (en) * 2000-10-27 2002-05-09 Kyocera Corp Package for pressure detection device
JP4557406B2 (en) * 2000-10-27 2010-10-06 京セラ株式会社 Package for pressure detection device
JP2003007885A (en) * 2001-06-26 2003-01-10 Kyocera Corp Package for storing semiconductor element
JP2009144295A (en) * 2007-12-17 2009-07-02 Gunze Ltd Garment with solid knitted part

Also Published As

Publication number Publication date
JPH083009Y2 (en) 1996-01-29

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term