JPH0256447U

JPH0256447U -

Info

Publication number: JPH0256447U
Application number: JP13463288U
Authority: JP
Priority date: 1988-10-14
Filing date: 1988-10-14
Publication date: 1990-04-24

Description

[Brief explanation of the drawing]

第１図は本考案にかかるシールリング付多層セ
ラミツクス基板の斜視図、第２図はその分解斜視
図、第３図はその断面図、第４図は従来例の断面
図である。図中、１……シールリング付多層セラミツクス
基板、２……多層セラミツクス基板、３……穴、
４……シールリング、５……薄板の銀ろう材、３
２……開口部、３３……小穴、４１……小突起、
５１……孔。 FIG. 1 is a perspective view of a multilayer ceramic substrate with a seal ring according to the present invention, FIG. 2 is an exploded perspective view thereof, FIG. 3 is a sectional view thereof, and FIG. 4 is a sectional view of a conventional example. In the figure, 1... multilayer ceramic substrate with seal ring, 2... multilayer ceramic substrate, 3... hole,
4... Seal ring, 5... Thin plate of silver brazing material, 3
2...Opening, 33...Small hole, 41...Small protrusion,
51... hole.

Claims

[Claim for Utility Model Registration] A hole is formed in the center of a multilayer ceramic substrate for mounting a semiconductor element forming an integrated circuit, and a seal ring surrounding the opening of the hole is bonded by silver brazing or the like. In the multilayer ceramic package with a seal ring, a plurality of small holes surrounding the opening of the hole are formed on the multilayer ceramic substrate, and a plurality of small protrusions corresponding to the plurality of small holes are formed on the seal ring. A multilayer ceramic spat cage with a seal ring, characterized in that the seal ring is joined to the multilayer ceramic base by using small holes and small protrusions for mutual positioning of the multilayer ceramic base and the seal ring.