JPH0247050U - - Google Patents
Info
- Publication number
- JPH0247050U JPH0247050U JP1988126173U JP12617388U JPH0247050U JP H0247050 U JPH0247050 U JP H0247050U JP 1988126173 U JP1988126173 U JP 1988126173U JP 12617388 U JP12617388 U JP 12617388U JP H0247050 U JPH0247050 U JP H0247050U
- Authority
- JP
- Japan
- Prior art keywords
- recess
- metal base
- insulating frame
- frame
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Die Bonding (AREA)
Description
第1図は本考案の半導体素子収納用パツケージ
の一実施例を示す断面図、第2図は従来の半導体
素子収納用パツケージの断面図である。
1……金属基体、1a……凹部、1b……金属
層、2……絶縁枠体、4……メタライズ金属層、
5……ロウ材。
FIG. 1 is a cross-sectional view showing an embodiment of a package for housing semiconductor elements of the present invention, and FIG. 2 is a cross-sectional view of a conventional package for housing semiconductor elements. DESCRIPTION OF SYMBOLS 1... Metal base, 1a... Recessed part, 1b... Metal layer, 2... Insulating frame, 4... Metallized metal layer,
5... Wax wood.
Claims (1)
る金属基体と、該基体上にロウ付けされた絶縁枠
体とを有し、前記絶縁枠体に、前記金属基体の凹
部中央部上を開放し且つ該枠体が凹部の周縁より
内方近傍部上を覆うように貫通孔を形成したこと
を特徴とする半導体素子収納用パツケージ。 A metal base having a recess on the upper surface for accommodating a semiconductor element, and an insulating frame brazed onto the base, the insulating frame having a central part of the recess of the metal base open, and 1. A package for housing a semiconductor device, characterized in that the frame has a through hole formed so as to cover an area near the inner side of the periphery of the recess.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988126173U JPH0247050U (en) | 1988-09-26 | 1988-09-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988126173U JPH0247050U (en) | 1988-09-26 | 1988-09-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0247050U true JPH0247050U (en) | 1990-03-30 |
Family
ID=31377445
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988126173U Pending JPH0247050U (en) | 1988-09-26 | 1988-09-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0247050U (en) |
-
1988
- 1988-09-26 JP JP1988126173U patent/JPH0247050U/ja active Pending