JPH0252337U - - Google Patents
Info
- Publication number
- JPH0252337U JPH0252337U JP12867388U JP12867388U JPH0252337U JP H0252337 U JPH0252337 U JP H0252337U JP 12867388 U JP12867388 U JP 12867388U JP 12867388 U JP12867388 U JP 12867388U JP H0252337 U JPH0252337 U JP H0252337U
- Authority
- JP
- Japan
- Prior art keywords
- support link
- copper foil
- semiconductor element
- foil lead
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
Landscapes
- Wire Bonding (AREA)
Description
第１図及び第２図はこの考案の一実施例に係り
、第１図は第２図に示すテープからフイルムを切
除して形成した半導体装置の一部を示す拡大平面
図、第２図はフイルム上に半導体素子を搭載した
テープを示す平面図、第３図は及び第４図は従来
例を示す平面図である。
１２……デバイスホール、１４……ベースフイ
ルム、１５……銅箔リード、１５ａ……屈曲部、
１６……テープ、１７……サポートリンク、１８
……半導体素子、２０……半導体装置。
1 and 2 relate to an embodiment of this invention; FIG. 1 is an enlarged plan view showing a part of a semiconductor device formed by cutting a film from the tape shown in FIG. 2; A plan view showing a tape with semiconductor elements mounted on a film, and FIGS. 3 and 4 are plan views showing conventional examples. 12... Device hole, 14... Base film, 15... Copper foil lead, 15a... Bent part,
16...Tape, 17...Support link, 18
...Semiconductor element, 20...Semiconductor device.
Claims (1)
ルムに形成されたデバイスホール上に半導体素子
を搭載する一方、前記フイルム上に形成された銅
箔リードと半導体素子とを接続し、前記デバイス
ホールの周囲にサポートリンクを残してフイルム
を切除すると共に、前記半導体素子に接続して外
側に延設される銅箔リードをサポートリンクにて
支持するものであつて、このサポートリンク内に
位置する銅箔リードを該サポートリンクとの接触
面積が大きくなるよう屈曲して配線したことを特
徴とする半導体装置。 A semiconductor element is mounted on a device hole formed in a film for tape automated bonding, while a copper foil lead formed on the film is connected to the semiconductor element, and a support link is provided around the device hole. At the same time, the copper foil lead connected to the semiconductor element and extending outward is supported by a support link, and the copper foil lead located within the support link is connected to the support link. A semiconductor device characterized in that the wiring is bent to increase the contact area with the semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988128673U JPH0625008Y2 (en) | 1988-09-30 | 1988-09-30 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988128673U JPH0625008Y2 (en) | 1988-09-30 | 1988-09-30 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0252337U true JPH0252337U (en) | 1990-04-16 |
| JPH0625008Y2 JPH0625008Y2 (en) | 1994-06-29 |
Family
ID=31382233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988128673U Expired - Lifetime JPH0625008Y2 (en) | 1988-09-30 | 1988-09-30 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0625008Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5073382U (en) * | 1973-11-07 | 1975-06-27 |
-
1988
- 1988-09-30 JP JP1988128673U patent/JPH0625008Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5073382U (en) * | 1973-11-07 | 1975-06-27 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0625008Y2 (en) | 1994-06-29 |