JPH01127239U - - Google Patents
Info
- Publication number
- JPH01127239U JPH01127239U JP2255388U JP2255388U JPH01127239U JP H01127239 U JPH01127239 U JP H01127239U JP 2255388 U JP2255388 U JP 2255388U JP 2255388 U JP2255388 U JP 2255388U JP H01127239 U JPH01127239 U JP H01127239U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- opening
- semiconductor
- wiring conductor
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
Landscapes
- Die Bonding (AREA)
Description
第１図ａは、本考案の第１の実施例を示す平面
図、第１図ｂは第１図ａのＸ―Ｘ′線断面図、第
２図は第２の実施例を示す断面図である。
１…第一の基板、２…第二の基板、３…開孔、
４…配線導体、５…空間、６…半導体素子搭載部
、７…枠、８…連結部、９…導電性素材、１０…
スルーホール、１１…半導体素子。
Fig. 1a is a plan view showing the first embodiment of the present invention, Fig. 1b is a sectional view taken along the line XX' of Fig. 1a, and Fig. 2 is a sectional view showing the second embodiment. It is. 1...First substrate, 2...Second substrate, 3...Open hole,
4... Wiring conductor, 5... Space, 6... Semiconductor element mounting part, 7... Frame, 8... Connecting part, 9... Conductive material, 10...
Through hole, 11... semiconductor element.
Claims (1)
た配線導体を備えた絶縁性の第１の基板に第２の
基板を接合してなり、前記開孔部の第２の基板表
面を半導体搭載部とすることを特徴とする半導体
装置搭載基板。 A second substrate is bonded to an insulating first substrate having an opening of a predetermined shape and a wiring conductor provided around the opening, and the surface of the second substrate at the opening is covered with a semiconductor. A semiconductor device mounting board characterized by having a mounting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2255388U JPH01127239U (en) | 1988-02-22 | 1988-02-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2255388U JPH01127239U (en) | 1988-02-22 | 1988-02-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01127239U true JPH01127239U (en) | 1989-08-31 |
Family
ID=31240775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2255388U Pending JPH01127239U (en) | 1988-02-22 | 1988-02-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01127239U (en) |
-
1988
- 1988-02-22 JP JP2255388U patent/JPH01127239U/ja active Pending