JPH0242499U - - Google Patents
Info
- Publication number
- JPH0242499U JPH0242499U JP12255688U JP12255688U JPH0242499U JP H0242499 U JPH0242499 U JP H0242499U JP 12255688 U JP12255688 U JP 12255688U JP 12255688 U JP12255688 U JP 12255688U JP H0242499 U JPH0242499 U JP H0242499U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- electrode
- substrate
- insulating resin
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図は、本考案による半導体素子の実装構造
を示す断面図であり、第２図は従来の半導体素子
の実装構造を示す断面図である。
１……配線基板、２……配線パターン、３……
樹脂、４……金属突起、５……電極パツド、６…
…半導体素子、７……絶縁樹脂、８……導電性物
質、１０……シールド板。
FIG. 1 is a sectional view showing a semiconductor device mounting structure according to the present invention, and FIG. 2 is a sectional view showing a conventional semiconductor device mounting structure. 1... Wiring board, 2... Wiring pattern, 3...
Resin, 4... Metal protrusion, 5... Electrode pad, 6...
... Semiconductor element, 7 ... Insulating resin, 8 ... Conductive material, 10 ... Shield plate.
Claims (1)
電極と相対する配線パターンを有する基板と、前
記半導体素子と前記基板とがフエースダウンにて
実装されており、少くとも前記半導体素子の周囲
及び前記配線パターンの一部が絶縁樹脂にて覆わ
れている半導体素子の実装構造において、前記絶
縁樹脂の上に導電性を有する物質が直接存在する
ことを特徴とする半導体素子の実装構造。 A semiconductor element having a metal protrusion on an electrode, a substrate having a wiring pattern facing the electrode, the semiconductor element and the substrate being mounted face down, and at least the area around the semiconductor element and the wiring. 1. A semiconductor element mounting structure in which a part of a pattern is covered with an insulating resin, wherein a conductive substance exists directly on the insulating resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12255688U JPH0242499U (en) | 1988-09-19 | 1988-09-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12255688U JPH0242499U (en) | 1988-09-19 | 1988-09-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0242499U true JPH0242499U (en) | 1990-03-23 |
Family
ID=31370598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12255688U Pending JPH0242499U (en) | 1988-09-19 | 1988-09-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0242499U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003273571A (en) * | 2002-03-18 | 2003-09-26 | Fujitsu Ltd | High-frequency module for shielding inter-element radio wave interference |
| JP2004006973A (en) * | 2003-08-01 | 2004-01-08 | Kitagawa Ind Co Ltd | Structure and method for shielding electromagnetic wave |
| JP4743764B2 (en) * | 2005-02-02 | 2011-08-10 | セイコーインスツル株式会社 | Manufacturing method of semiconductor package |
| JP2018040816A (en) * | 2017-12-14 | 2018-03-15 | 株式会社東芝 | Sensor |
| WO2023074507A1 (en) * | 2021-10-25 | 2023-05-04 | 富士フイルム株式会社 | Method for producing electronic device |
-
1988
- 1988-09-19 JP JP12255688U patent/JPH0242499U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003273571A (en) * | 2002-03-18 | 2003-09-26 | Fujitsu Ltd | High-frequency module for shielding inter-element radio wave interference |
| JP2004006973A (en) * | 2003-08-01 | 2004-01-08 | Kitagawa Ind Co Ltd | Structure and method for shielding electromagnetic wave |
| JP4743764B2 (en) * | 2005-02-02 | 2011-08-10 | セイコーインスツル株式会社 | Manufacturing method of semiconductor package |
| JP2018040816A (en) * | 2017-12-14 | 2018-03-15 | 株式会社東芝 | Sensor |
| WO2023074507A1 (en) * | 2021-10-25 | 2023-05-04 | 富士フイルム株式会社 | Method for producing electronic device |