JPS635647U - - Google Patents
Info
- Publication number
- JPS635647U JPS635647U JP1986099507U JP9950786U JPS635647U JP S635647 U JPS635647 U JP S635647U JP 1986099507 U JP1986099507 U JP 1986099507U JP 9950786 U JP9950786 U JP 9950786U JP S635647 U JPS635647 U JP S635647U
- Authority
- JP
- Japan
- Prior art keywords
- conductive layer
- lead frame
- mounting portion
- element mounting
- land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Description
第１図は、本考案に係る電子回路装置の縦断面
図、第２図は、従来の電子回路装置の縦断面図で
ある。
２１…絶縁板、２２…導電層、２３…素子取付
部、２４…ランド部、２４…リード部、２８…素
子、２９…電極、３２…樹脂。
FIG. 1 is a longitudinal sectional view of an electronic circuit device according to the present invention, and FIG. 2 is a longitudinal sectional view of a conventional electronic circuit device. DESCRIPTION OF SYMBOLS 21... Insulating plate, 22... Conductive layer, 23... Element mounting part, 24... Land part, 24... Lead part, 28... Element, 29... Electrode, 32... Resin.
Claims (1)
板を、リードフレームのランド部に接着し、前記
素子取付部に、素子を取付けるとともに、素子の
電極と前記導電層、及び、導電層と前記リードフ
レームのリードとを接続し、全体を樹脂モールド
してなる電子回路装置において、ランド部への接
着を局部的としたことを特徴とする電子回路装置
。 An insulating plate having a conductive layer and an element mounting portion formed on its surface is adhered to the land portion of the lead frame, and an element is attached to the element mounting portion, and the electrode of the element and the conductive layer are connected to each other, and the conductive layer and the 1. An electronic circuit device formed by connecting leads of a lead frame and molding the entire body with a resin, characterized in that adhesiveness to land portions is localized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986099507U JPS635647U (en) | 1986-06-27 | 1986-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986099507U JPS635647U (en) | 1986-06-27 | 1986-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS635647U true JPS635647U (en) | 1988-01-14 |
Family
ID=30968444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986099507U Pending JPS635647U (en) | 1986-06-27 | 1986-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS635647U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0555440A (en) * | 1991-08-29 | 1993-03-05 | Hitachi Cable Ltd | Resin-sealed semiconductor device |
| US7230320B2 (en) | 2003-02-18 | 2007-06-12 | Hitachi, Ltd. | Electronic circuit device with reduced breaking and cracking |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5766655A (en) * | 1980-10-09 | 1982-04-22 | Mitsubishi Electric Corp | Lead frame for semiconductor device |
| JPS59194443A (en) * | 1983-04-19 | 1984-11-05 | Toshiba Corp | Semiconductor device |
-
1986
- 1986-06-27 JP JP1986099507U patent/JPS635647U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5766655A (en) * | 1980-10-09 | 1982-04-22 | Mitsubishi Electric Corp | Lead frame for semiconductor device |
| JPS59194443A (en) * | 1983-04-19 | 1984-11-05 | Toshiba Corp | Semiconductor device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0555440A (en) * | 1991-08-29 | 1993-03-05 | Hitachi Cable Ltd | Resin-sealed semiconductor device |
| US7230320B2 (en) | 2003-02-18 | 2007-06-12 | Hitachi, Ltd. | Electronic circuit device with reduced breaking and cracking |