JPS6436978U - - Google Patents
Info
- Publication number
- JPS6436978U JPS6436978U JP13291487U JP13291487U JPS6436978U JP S6436978 U JPS6436978 U JP S6436978U JP 13291487 U JP13291487 U JP 13291487U JP 13291487 U JP13291487 U JP 13291487U JP S6436978 U JPS6436978 U JP S6436978U
- Authority
- JP
- Japan
- Prior art keywords
- circuit formed
- flexible substrate
- adhesive
- circuit
- hard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
Landscapes
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Combinations Of Printed Boards (AREA)
Description
第１図は、本考案の接続構造体の断面図である
。
符号の説明、１……可撓性基板、２……可撓性
基板に形成された回路、３……硬質基板に形成さ
れた回路、４……硬質基板、５……接着剤Ａ、６
……接着剤Ｂ、７……硬質板。
FIG. 1 is a sectional view of the connection structure of the present invention. Explanation of symbols, 1... Flexible substrate, 2... Circuit formed on flexible substrate, 3... Circuit formed on hard substrate, 4... Hard substrate, 5... Adhesive A, 6
...Adhesive B, 7...Hard board.
Claims (1)
に形成された回路とを異方導電性を有する接着剤
により接続し導通させ、さらに該可撓性基板の上
に接着剤を介して硬質板を積層してなる回路の接
続構造。 A circuit formed on a hard substrate and a circuit formed on a flexible substrate are connected and electrically connected using an adhesive having anisotropic conductivity, and then a circuit formed on the flexible substrate is connected to the circuit formed on the flexible substrate via the adhesive. A circuit connection structure made of laminated hard plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13291487U JPS6436978U (en) | 1987-08-31 | 1987-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13291487U JPS6436978U (en) | 1987-08-31 | 1987-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6436978U true JPS6436978U (en) | 1989-03-06 |
Family
ID=31390311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13291487U Pending JPS6436978U (en) | 1987-08-31 | 1987-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6436978U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004335844A (en) * | 2003-05-09 | 2004-11-25 | Nec Corp | Circuit board device and method for manufacturing the same |
-
1987
- 1987-08-31 JP JP13291487U patent/JPS6436978U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004335844A (en) * | 2003-05-09 | 2004-11-25 | Nec Corp | Circuit board device and method for manufacturing the same |
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