JPS635648U - - Google Patents
Info
- Publication number
- JPS635648U JPS635648U JP9950886U JP9950886U JPS635648U JP S635648 U JPS635648 U JP S635648U JP 9950886 U JP9950886 U JP 9950886U JP 9950886 U JP9950886 U JP 9950886U JP S635648 U JPS635648 U JP S635648U
- Authority
- JP
- Japan
- Prior art keywords
- conductive layer
- lead frame
- mounting portion
- land portion
- element mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は、本考案に係る電子回路装置の縦断面
図、第２図は、従来の電子回路装置の縦断面図で
ある。
２１……絶縁板、２２……導電層、２３……素
子取付部、２４……ランド部、２５……リード、
２８……素子、２９……電極、３２……樹脂。
FIG. 1 is a longitudinal sectional view of an electronic circuit device according to the present invention, and FIG. 2 is a longitudinal sectional view of a conventional electronic circuit device. 21... Insulating plate, 22... Conductive layer, 23... Element mounting portion, 24... Land portion, 25... Lead,
28...Element, 29...Electrode, 32...Resin.
Claims (1)
板を、リードフレームのランド部に接着し、前記
素子取付部に、素子を取付けるとともに、素子の
電極と前記導電層、及び、導電層と前記リードフ
レームのリードとを接続し、全体を樹脂モールド
してなる電子回路装置において、前記リードフレ
ームのランド部を肉厚としたことを特徴とする電
子回路装置。 An insulating plate having a conductive layer and an element mounting portion formed on its surface is adhered to the land portion of the lead frame, and an element is attached to the element mounting portion, and the electrode of the element and the conductive layer are connected to each other, and the conductive layer and the 1. An electronic circuit device formed by connecting leads of a lead frame and molding the entire body with a resin, characterized in that a land portion of the lead frame is made thick.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9950886U JPS635648U (en) | 1986-06-27 | 1986-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9950886U JPS635648U (en) | 1986-06-27 | 1986-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS635648U true JPS635648U (en) | 1988-01-14 |
Family
ID=30968446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9950886U Pending JPS635648U (en) | 1986-06-27 | 1986-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS635648U (en) |
-
1986
- 1986-06-27 JP JP9950886U patent/JPS635648U/ja active Pending