JPS63112354U - - Google Patents
Info
- Publication number
- JPS63112354U JPS63112354U JP418487U JP418487U JPS63112354U JP S63112354 U JPS63112354 U JP S63112354U JP 418487 U JP418487 U JP 418487U JP 418487 U JP418487 U JP 418487U JP S63112354 U JPS63112354 U JP S63112354U
- Authority
- JP
- Japan
- Prior art keywords
- resin plate
- conductive layers
- resin
- electronic circuit
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は、本考案に係る電子回路装置の要部の
みの拡大断面図、第２図は、従来の電子回路装置
の断面図、第３図は、第２図の要部の拡大断面図
である。
２４…樹脂板、２５…表裏面導電層、２６…素
子取付部、２７…樹脂、２８…素子。
FIG. 1 is an enlarged sectional view of only the main parts of the electronic circuit device according to the present invention, FIG. 2 is a sectional view of a conventional electronic circuit device, and FIG. 3 is an enlarged sectional view of the main parts of FIG. 2. It is. 24... Resin plate, 25... Front and back conductive layers, 26... Element mounting portion, 27... Resin, 28... Element.
Claims (1)
、裏面導電層を樹脂板に穿設した貫通孔を介して
表面に導出し、これら導電層と樹脂板表面の素子
取付部に固着した素子の電極とを、ボンデイング
結線するようにした電子回路装置において、前記
樹脂板の裏面導電層間に、樹脂を充填して平滑化
したことを特徴とする電子回路装置。 Conductive layers are formed on both the front and back sides of the resin plate, and the back conductive layer is led to the front surface through a through hole drilled in the resin plate, and these conductive layers and the element electrodes are fixed to the element mounting portion on the resin plate surface. 1. An electronic circuit device characterized in that the gap between the conductive layers on the back surface of the resin plate is filled with a resin to make the surface smooth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP418487U JPS63112354U (en) | 1987-01-14 | 1987-01-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP418487U JPS63112354U (en) | 1987-01-14 | 1987-01-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63112354U true JPS63112354U (en) | 1988-07-19 |
Family
ID=30784621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP418487U Pending JPS63112354U (en) | 1987-01-14 | 1987-01-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63112354U (en) |
-
1987
- 1987-01-14 JP JP418487U patent/JPS63112354U/ja active Pending
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