JPS6186944U - - Google Patents

Info

Publication number
JPS6186944U
JPS6186944U JP17288484U JP17288484U JPS6186944U JP S6186944 U JPS6186944 U JP S6186944U JP 17288484 U JP17288484 U JP 17288484U JP 17288484 U JP17288484 U JP 17288484U JP S6186944 U JPS6186944 U JP S6186944U
Authority
JP
Japan
Prior art keywords
frame
metal
semiconductor package
cutout portion
attachment member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17288484U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17288484U priority Critical patent/JPS6186944U/ja
Publication of JPS6186944U publication Critical patent/JPS6186944U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図aは本考案の半導体パツケージの一実施
例を示す斜視図、第1図bは同分解斜視図、第2
図は従来の半導体パツケージを示す斜視図である
。 1,11……金属基体、2,12……蓋体、3
,13……枠体、13a……切欠部、15……外
部リード端子取着部材、15a……メタライズ金
属層。
FIG. 1a is a perspective view showing an embodiment of the semiconductor package of the present invention, FIG. 1b is an exploded perspective view of the same, and FIG.
The figure is a perspective view showing a conventional semiconductor package. 1, 11... Metal base, 2, 12... Lid, 3
, 13... Frame body, 13a... Notch, 15... External lead terminal attachment member, 15a... Metallized metal layer.

Claims (1)

【実用新案登録請求の範囲】 (1) 金属基体上に切欠部を有する金属枠体を取
着するとともに該枠体の切欠部にメタライズ金属
層を埋設したセラミツクから成る入出力端子取着
部材を嵌着したことを特徴とする半導体パツケー
ジ。 (2) 前記金属板と枠体が一体に成形されている
ことを特徴とする実用新案登録請求の範囲第1項
に記載の半導体パツケージ。
[Claims for Utility Model Registration] (1) An input/output terminal attachment member made of ceramic, which has a metal frame having a cutout portion mounted on a metal base and a metallized metal layer embedded in the cutout portion of the frame. A semiconductor package cage characterized by being fitted. (2) The semiconductor package according to claim 1, wherein the metal plate and the frame are integrally formed.
JP17288484U 1984-11-13 1984-11-13 Pending JPS6186944U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17288484U JPS6186944U (en) 1984-11-13 1984-11-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17288484U JPS6186944U (en) 1984-11-13 1984-11-13

Publications (1)

Publication Number Publication Date
JPS6186944U true JPS6186944U (en) 1986-06-07

Family

ID=30730543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17288484U Pending JPS6186944U (en) 1984-11-13 1984-11-13

Country Status (1)

Country Link
JP (1) JPS6186944U (en)

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