JPH03117838U - - Google Patents
Info
- Publication number
- JPH03117838U JPH03117838U JP2671090U JP2671090U JPH03117838U JP H03117838 U JPH03117838 U JP H03117838U JP 2671090 U JP2671090 U JP 2671090U JP 2671090 U JP2671090 U JP 2671090U JP H03117838 U JPH03117838 U JP H03117838U
- Authority
- JP
- Japan
- Prior art keywords
- lid
- semiconductor device
- conductive film
- stem
- mesh
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005219 brazing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Description
第１図は本考案の第１実施例の縦方向の断面を
表わしている斜視図、第２図は本考案の第２実施
例の斜視図、第３図は従来の半導体装置の斜視図
である。
１，１１……ステム、１ａ……金属ベース、１
ｂ……セラミツク側壁、２……半導体素子、３…
…端子、４，５，１４……蓋、４ａ，５ａ……網
目状の金属膜、６……ＡｕＳｎろう材。
FIG. 1 is a perspective view showing a vertical cross section of a first embodiment of the present invention, FIG. 2 is a perspective view of a second embodiment of the present invention, and FIG. 3 is a perspective view of a conventional semiconductor device. be. 1, 11...Stem, 1a...Metal base, 1
b... Ceramic side wall, 2... Semiconductor element, 3...
...terminal, 4,5,14...lid, 4a, 5a...mesh-like metal film, 6...AuSn brazing material.
Claims (1)
、蓋をして封止してなる半導体装置において、前
記蓋は透明な板材で、かつその一面に網目状の導
体膜が形成され、さらにこの導体膜が接地電極に
接続されていることを特徴とする半導体装置。 In a semiconductor device in which a semiconductor element is attached to a stem having an upper opening and sealed with a lid, the lid is a transparent plate material, and a mesh-like conductive film is formed on one surface of the lid, and the conductive film is A semiconductor device characterized by being connected to a ground electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2671090U JPH03117838U (en) | 1990-03-15 | 1990-03-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2671090U JPH03117838U (en) | 1990-03-15 | 1990-03-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03117838U true JPH03117838U (en) | 1991-12-05 |
Family
ID=31529591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2671090U Pending JPH03117838U (en) | 1990-03-15 | 1990-03-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03117838U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010087469A (en) * | 2008-09-08 | 2010-04-15 | Toshiba Corp | High frequency package device and manufacturing method thereof |
-
1990
- 1990-03-15 JP JP2671090U patent/JPH03117838U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010087469A (en) * | 2008-09-08 | 2010-04-15 | Toshiba Corp | High frequency package device and manufacturing method thereof |