JPH0310541U - - Google Patents
Info
- Publication number
- JPH0310541U JPH0310541U JP7135189U JP7135189U JPH0310541U JP H0310541 U JPH0310541 U JP H0310541U JP 7135189 U JP7135189 U JP 7135189U JP 7135189 U JP7135189 U JP 7135189U JP H0310541 U JPH0310541 U JP H0310541U
- Authority
- JP
- Japan
- Prior art keywords
- lid
- notch
- sealing material
- package
- insulating base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000003566 sealing material Substances 0.000 claims description 4
Landscapes
- Packaging Frangible Articles (AREA)
Description
第1図は本考案の半導体素子収納用パツケージ
の一実施例を示す断面図、第2図aは第1図に示
すパツケージの蓋体の平面図、第2図bは第2図
aの拡大側面図、第3図は従来の半導体素子収納
用パツケージの断面図、第4図は第3図の蓋体の
平面図である。
1……絶縁基体、2……蓋体、8……封止材、
8a……切欠部、8b……封止材の切欠部近傍位
置。
Fig. 1 is a sectional view showing an embodiment of the package for storing semiconductor elements of the present invention, Fig. 2a is a plan view of the lid of the package shown in Fig. 1, and Fig. 2b is an enlarged view of Fig. 2a. 3 is a side view, FIG. 3 is a sectional view of a conventional package for housing semiconductor elements, and FIG. 4 is a plan view of the lid shown in FIG. 3. 1... Insulating base, 2... Lid, 8... Sealing material,
8a... Notch, 8b... Position near the notch of the sealing material.
Claims (1)
る絶縁基体と蓋体とから成り、絶縁基体上に蓋体
を枠状の封止材を介し取着することによつて内部
空所を気密に封止するようになした半導体素子収
納用パツケージにおいて、前記枠状封止材はその
一部に切欠部を有し、且つ該切欠部近傍の厚みが
他の部位より厚くなつていることを特徴とする半
導体素子収納用パツケージ。 It consists of an insulating base and a lid that has a cavity inside to accommodate a semiconductor element, and the interior cavity is made airtight by attaching the lid to the insulating base via a frame-shaped sealing material. A package for storing a semiconductor element that is sealed, wherein the frame-shaped sealing material has a notch in a part thereof, and the thickness near the notch is thicker than other parts. Package cage for storing semiconductor elements.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7135189U JPH0310541U (en) | 1989-06-19 | 1989-06-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7135189U JPH0310541U (en) | 1989-06-19 | 1989-06-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0310541U true JPH0310541U (en) | 1991-01-31 |
Family
ID=31608300
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7135189U Pending JPH0310541U (en) | 1989-06-19 | 1989-06-19 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0310541U (en) |
-
1989
- 1989-06-19 JP JP7135189U patent/JPH0310541U/ja active Pending