JPS62131436U - - Google Patents

Info

Publication number
JPS62131436U
JPS62131436U JP2066686U JP2066686U JPS62131436U JP S62131436 U JPS62131436 U JP S62131436U JP 2066686 U JP2066686 U JP 2066686U JP 2066686 U JP2066686 U JP 2066686U JP S62131436 U JPS62131436 U JP S62131436U
Authority
JP
Japan
Prior art keywords
sealing
sealing cover
resin
airtightly
platen side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2066686U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2066686U priority Critical patent/JPS62131436U/ja
Publication of JPS62131436U publication Critical patent/JPS62131436U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の一実施例による封止装置を
示す断面図、第2図は従来の装置を示す斜視図、
第3図は外観形状不良の封止製品を示す斜視図で
ある。図中、5は下型、10は上型、13は下型
用密閉カバー、14は上型用密閉カバー、15は
シール材、16は真空排気ダクト、17は真空室
を示す。なお図中同一符号は同一、又は相当部分
を示す。
FIG. 1 is a sectional view showing a sealing device according to an embodiment of the present invention, FIG. 2 is a perspective view showing a conventional device,
FIG. 3 is a perspective view showing a sealed product with a defective appearance. In the figure, 5 is a lower mold, 10 is an upper mold, 13 is a sealing cover for the lower mold, 14 is a sealing cover for the upper mold, 15 is a sealing material, 16 is a vacuum exhaust duct, and 17 is a vacuum chamber. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リードフレーム上に装着された半導体素子を真
空中にて熱硬化性樹脂により封止成形する半導体
装置の樹脂封止装置において、上部プラテン側に
気密に係合された筒状の上部密閉カバー、下部プ
ラテン側に気密に結合された筒状の下部密閉カバ
ー、及びこの下部密閉カバーと上部密閉カバーと
の間を気密に封止する封止部材を備えた半導体装
置の樹脂封止装置。
In a resin sealing device for a semiconductor device that seals and molds a semiconductor element mounted on a lead frame with a thermosetting resin in a vacuum, a cylindrical upper sealing cover and a lower portion are airtightly engaged with the upper platen side. A resin sealing device for a semiconductor device, comprising a cylindrical lower sealing cover hermetically coupled to a platen side, and a sealing member for airtightly sealing between the lower sealing cover and the upper sealing cover.
JP2066686U 1986-02-13 1986-02-13 Pending JPS62131436U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2066686U JPS62131436U (en) 1986-02-13 1986-02-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2066686U JPS62131436U (en) 1986-02-13 1986-02-13

Publications (1)

Publication Number Publication Date
JPS62131436U true JPS62131436U (en) 1987-08-19

Family

ID=30816387

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2066686U Pending JPS62131436U (en) 1986-02-13 1986-02-13

Country Status (1)

Country Link
JP (1) JPS62131436U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013146827A1 (en) * 2012-03-28 2013-10-03 コニカミノルタ株式会社 Method for producing optical element, optical element, molding device, and extraction device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013146827A1 (en) * 2012-03-28 2013-10-03 コニカミノルタ株式会社 Method for producing optical element, optical element, molding device, and extraction device
JPWO2013146827A1 (en) * 2012-03-28 2015-12-14 コニカミノルタ株式会社 Optical element manufacturing method, optical element, molding apparatus, and take-out apparatus

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