JPS62131436U - - Google Patents
Info
- Publication number
- JPS62131436U JPS62131436U JP2066686U JP2066686U JPS62131436U JP S62131436 U JPS62131436 U JP S62131436U JP 2066686 U JP2066686 U JP 2066686U JP 2066686 U JP2066686 U JP 2066686U JP S62131436 U JPS62131436 U JP S62131436U
- Authority
- JP
- Japan
- Prior art keywords
- sealing
- sealing cover
- resin
- airtightly
- platen side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 3
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 230000002950 deficient Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
第1図はこの発明の一実施例による封止装置を
示す断面図、第2図は従来の装置を示す斜視図、
第3図は外観形状不良の封止製品を示す斜視図で
ある。図中、5は下型、10は上型、13は下型
用密閉カバー、14は上型用密閉カバー、15は
シール材、16は真空排気ダクト、17は真空室
を示す。なお図中同一符号は同一、又は相当部分
を示す。
FIG. 1 is a sectional view showing a sealing device according to an embodiment of the present invention, FIG. 2 is a perspective view showing a conventional device,
FIG. 3 is a perspective view showing a sealed product with a defective appearance. In the figure, 5 is a lower mold, 10 is an upper mold, 13 is a sealing cover for the lower mold, 14 is a sealing cover for the upper mold, 15 is a sealing material, 16 is a vacuum exhaust duct, and 17 is a vacuum chamber. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
空中にて熱硬化性樹脂により封止成形する半導体
装置の樹脂封止装置において、上部プラテン側に
気密に係合された筒状の上部密閉カバー、下部プ
ラテン側に気密に結合された筒状の下部密閉カバ
ー、及びこの下部密閉カバーと上部密閉カバーと
の間を気密に封止する封止部材を備えた半導体装
置の樹脂封止装置。 In a resin sealing device for a semiconductor device that seals and molds a semiconductor element mounted on a lead frame with a thermosetting resin in a vacuum, a cylindrical upper sealing cover and a lower portion are airtightly engaged with the upper platen side. A resin sealing device for a semiconductor device, comprising a cylindrical lower sealing cover hermetically coupled to a platen side, and a sealing member for airtightly sealing between the lower sealing cover and the upper sealing cover.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2066686U JPS62131436U (en) | 1986-02-13 | 1986-02-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2066686U JPS62131436U (en) | 1986-02-13 | 1986-02-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62131436U true JPS62131436U (en) | 1987-08-19 |
Family
ID=30816387
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2066686U Pending JPS62131436U (en) | 1986-02-13 | 1986-02-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62131436U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013146827A1 (en) * | 2012-03-28 | 2013-10-03 | コニカミノルタ株式会社 | Method for producing optical element, optical element, molding device, and extraction device |
-
1986
- 1986-02-13 JP JP2066686U patent/JPS62131436U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013146827A1 (en) * | 2012-03-28 | 2013-10-03 | コニカミノルタ株式会社 | Method for producing optical element, optical element, molding device, and extraction device |
JPWO2013146827A1 (en) * | 2012-03-28 | 2015-12-14 | コニカミノルタ株式会社 | Optical element manufacturing method, optical element, molding apparatus, and take-out apparatus |
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