JPH0310543U - - Google Patents
Info
- Publication number
- JPH0310543U JPH0310543U JP7135489U JP7135489U JPH0310543U JP H0310543 U JPH0310543 U JP H0310543U JP 7135489 U JP7135489 U JP 7135489U JP 7135489 U JP7135489 U JP 7135489U JP H0310543 U JPH0310543 U JP H0310543U
- Authority
- JP
- Japan
- Prior art keywords
- accommodating
- sealing material
- insulating base
- semiconductor element
- rectangular frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000003566 sealing material Substances 0.000 claims description 3
Description
第１図は本考案の半導体素子収納用パツケージ
の一実施例を示す断面図、第２図は第１図に示す
パツケージの蓋体の平面図、第３図は従来の半導
体素子収納用パツケージの断面図、第４図は第３
図の蓋体の平面図である。
１……絶縁基体、２……蓋体、８……封止材、
８ａ……切欠部。
Fig. 1 is a sectional view showing an embodiment of the package for storing semiconductor elements of the present invention, Fig. 2 is a plan view of the lid of the package shown in Fig. 1, and Fig. 3 is a view of a conventional package for storing semiconductor elements. Cross-sectional view, Figure 4 is the 3rd
It is a top view of the lid body of a figure. 1... Insulating base, 2... Lid, 8... Sealing material,
8a... Notch.
Claims (1)
る絶縁基体と蓋体とから成り、絶縁基体上に蓋体
を矩形枠状の封止材を介し取着することによつて
内部空所を気密に封止するようになした半導体素
子収納用パツケージにおいて、前記矩形枠状の封
止材はその少なくとも１つの角部近傍に切欠部が
形成されていることを特徴とする半導体素子収納
用パツケージ。 It consists of an insulating base body and a lid body, each having a cavity for accommodating a semiconductor element inside, and the interior cavity is made airtight by attaching the lid body to the insulating base via a rectangular frame-shaped sealing material. 1. A package for accommodating a semiconductor element, characterized in that the rectangular frame-shaped sealing material has a notch formed in the vicinity of at least one corner thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7135489U JPH0310543U (en) | 1989-06-19 | 1989-06-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7135489U JPH0310543U (en) | 1989-06-19 | 1989-06-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0310543U true JPH0310543U (en) | 1991-01-31 |
Family
ID=31608306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7135489U Pending JPH0310543U (en) | 1989-06-19 | 1989-06-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0310543U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007170353A (en) * | 2005-12-26 | 2007-07-05 | Denso Corp | Intake device |
-
1989
- 1989-06-19 JP JP7135489U patent/JPH0310543U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007170353A (en) * | 2005-12-26 | 2007-07-05 | Denso Corp | Intake device |
| JP4546394B2 (en) * | 2005-12-26 | 2010-09-15 | 株式会社デンソー | Intake device |