JPS6312874U - - Google Patents

Info

Publication number
JPS6312874U
JPS6312874U JP9283886U JP9283886U JPS6312874U JP S6312874 U JPS6312874 U JP S6312874U JP 9283886 U JP9283886 U JP 9283886U JP 9283886 U JP9283886 U JP 9283886U JP S6312874 U JPS6312874 U JP S6312874U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
sealed container
resin filling
filling part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9283886U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9283886U priority Critical patent/JPS6312874U/ja
Publication of JPS6312874U publication Critical patent/JPS6312874U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の実施例を示す断面図、第2図
及び第3図は従来例を示す断面図である。 1……封止容器、2……混成集積回路基板、3
……回路素子、4……封止蓋部、5……外部導出
リード、6……樹脂充填部枠、7……スリツト。
FIG. 1 is a sectional view showing an embodiment of the present invention, and FIGS. 2 and 3 are sectional views showing a conventional example. 1... sealed container, 2... hybrid integrated circuit board, 3
...Circuit element, 4...Sealing lid part, 5...External lead-out lead, 6...Resin filling part frame, 7...Slit.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 混成集積回路基板の一側辺から導出された外部
導出リードを囲み奥行方向にテーパー形状の肉厚
部を有する樹脂充填部枠とを備えた混成集積回路
の封止容器において、前記樹脂充填部枠の前記テ
ーパー形状の前記肉厚部にスリツトを設けること
を特徴とする混成集積回路の封止容器。
In a sealed container for a hybrid integrated circuit, the resin filling part frame includes a resin filling part frame that surrounds an external lead led out from one side of the hybrid integrated circuit board and has a thick part that is tapered in the depth direction. A sealed container for a hybrid integrated circuit, characterized in that a slit is provided in the thick walled portion of the tapered shape.
JP9283886U 1986-06-18 1986-06-18 Pending JPS6312874U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9283886U JPS6312874U (en) 1986-06-18 1986-06-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9283886U JPS6312874U (en) 1986-06-18 1986-06-18

Publications (1)

Publication Number Publication Date
JPS6312874U true JPS6312874U (en) 1988-01-27

Family

ID=30954892

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9283886U Pending JPS6312874U (en) 1986-06-18 1986-06-18

Country Status (1)

Country Link
JP (1) JPS6312874U (en)

Similar Documents

Publication Publication Date Title
JPS6312874U (en)
JPS58154151U (en) Cap for sealed containers
JPH0310542U (en)
JPS6234481U (en)
JPS59133460U (en) container
JPS5935376U (en) Synthetic resin container
JPS6343482U (en)
JPH01115082U (en)
JPS59129709U (en) Paper-based sealed container
JPS5948085U (en) Sealed containers for electrical equipment
JPS6084554U (en) Simple package
JPS6429127U (en)
JPH0310543U (en)
JPS63180937U (en)
JPS63105644U (en)
JPS6078712U (en) Composite can-shaped container
JPS58109923U (en) Easy-open lid for cylindrical containers
JPS59126919U (en) Paper-based sealed container
JPH01103545U (en)
JPS60150945U (en) packaging container
JPS63165854U (en)
JPS6316450U (en)
JPS6132053U (en) Sealed packaging container
JPS58171873U (en) packaging equipment
JPS59129707U (en) Paper-based sealed container