JPH0423326U - - Google Patents
Info
- Publication number
- JPH0423326U JPH0423326U JP1990064359U JP6435990U JPH0423326U JP H0423326 U JPH0423326 U JP H0423326U JP 1990064359 U JP1990064359 U JP 1990064359U JP 6435990 U JP6435990 U JP 6435990U JP H0423326 U JPH0423326 U JP H0423326U
- Authority
- JP
- Japan
- Prior art keywords
- vibrator
- piezoelectric
- lid
- sealing member
- insulating base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims 2
- 230000008018 melting Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/163—Connection portion, e.g. seal
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第1図は本考案にかかる圧電振動子収納用パツ
ケージの一実施例を示す断面図、第2図は従来の
圧電振動子収納用パツケージの断面図である。
1……絶縁基体、2……蓋体、4……圧電振動
子、5……接着材、7……封止部材、7a……内
部材、7b……外部材。
FIG. 1 is a cross-sectional view showing an embodiment of a package for housing a piezoelectric vibrator according to the present invention, and FIG. 2 is a cross-sectional view of a conventional package for housing a piezoelectric vibrator. DESCRIPTION OF SYMBOLS 1... Insulating base, 2... Lid, 4... Piezoelectric vibrator, 5... Adhesive, 7... Sealing member, 7a... Internal material, 7b... External material.
Claims (1)
基体と蓋体とから成り、絶縁基体に蓋体を封止部
材を介し接合させることによつて内部に圧電振動
子を封入するようになした圧電振動子収納用パツ
ケージにおいて、前記封止部材を内外材から成る
二重構造とし、内材を融点300℃以下の低融点
ロウ材で、外材を有機樹脂接着材で形成したこと
を特徴とする圧電振動子収納用パツケージ。 A piezoelectric device consisting of an insulating base having a recess for accommodating a piezoelectric vibrator and a lid, the piezoelectric vibrator being sealed inside by joining the lid to the insulating base through a sealing member. In the piezoelectric package for housing a vibrator, the sealing member has a double structure consisting of an inner and outer material, the inner material is made of a low-melting wax material with a melting point of 300° C. or less, and the outer material is made of an organic resin adhesive. Package cage for storing the vibrator.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990064359U JPH0423326U (en) | 1990-06-18 | 1990-06-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990064359U JPH0423326U (en) | 1990-06-18 | 1990-06-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0423326U true JPH0423326U (en) | 1992-02-26 |
Family
ID=31595233
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990064359U Pending JPH0423326U (en) | 1990-06-18 | 1990-06-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0423326U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011250227A (en) * | 2010-05-28 | 2011-12-08 | Nippon Dempa Kogyo Co Ltd | Piezoelectric device |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5598845A (en) * | 1979-01-19 | 1980-07-28 | Hascoe Norman | Cover unit for airtightly sealing container for semiconductor device |
JPS5718372A (en) * | 1980-07-08 | 1982-01-30 | Fujitsu Ltd | Semiconductor photoreceiving element |
JPS6053054A (en) * | 1983-09-02 | 1985-03-26 | Hitachi Ltd | Semiconductor device |
JPS60241236A (en) * | 1984-05-16 | 1985-11-30 | Hitachi Micro Comput Eng Ltd | Semiconductor device |
JPS636741B2 (en) * | 1981-10-02 | 1988-02-12 | Nissan Motor |
-
1990
- 1990-06-18 JP JP1990064359U patent/JPH0423326U/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5598845A (en) * | 1979-01-19 | 1980-07-28 | Hascoe Norman | Cover unit for airtightly sealing container for semiconductor device |
JPS5718372A (en) * | 1980-07-08 | 1982-01-30 | Fujitsu Ltd | Semiconductor photoreceiving element |
JPS636741B2 (en) * | 1981-10-02 | 1988-02-12 | Nissan Motor | |
JPS6053054A (en) * | 1983-09-02 | 1985-03-26 | Hitachi Ltd | Semiconductor device |
JPS60241236A (en) * | 1984-05-16 | 1985-11-30 | Hitachi Micro Comput Eng Ltd | Semiconductor device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011250227A (en) * | 2010-05-28 | 2011-12-08 | Nippon Dempa Kogyo Co Ltd | Piezoelectric device |
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