JPS6439268U - - Google Patents
Info
- Publication number
- JPS6439268U JPS6439268U JP1987133683U JP13368387U JPS6439268U JP S6439268 U JPS6439268 U JP S6439268U JP 1987133683 U JP1987133683 U JP 1987133683U JP 13368387 U JP13368387 U JP 13368387U JP S6439268 U JPS6439268 U JP S6439268U
- Authority
- JP
- Japan
- Prior art keywords
- tape
- embossed
- taping structure
- embossed tape
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 2
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Packages (AREA)
- Packaging Frangible Articles (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Description
第１図は、本考案に係るテーピング構体を示す
もので、ａは平面図、ｂは断面図、第２図は、本
考案に係る他のテーピング構体を示すもので、ａ
は平面図、ｂは断面図、第３図は、従来のテーピ
ング構体の斜視図である。
１……キヤリアテープ、２……チツプ部品収容
部、３……エンボステープ、４……カバーテープ
、５……シール部。
Fig. 1 shows a taping structure according to the present invention, a is a plan view, b is a cross-sectional view, and Fig. 2 is a taping structure according to the present invention.
3 is a plan view, b is a sectional view, and FIG. 3 is a perspective view of a conventional taping structure. DESCRIPTION OF SYMBOLS 1...Carrier tape, 2...Chip parts storage part, 3...Embossed tape, 4...Cover tape, 5...Sealing part.
Claims (1)
ステープと、このエンボステープの収容面をシー
ルするカバーテープとよりなるキヤリアテープに
、チツプ部品を収容するようにしたテーピング構
体において、エンボステープとカバーテープのシ
ールを、局所的にしたことを特徴とするテーピン
グ構体。 In a taping structure in which chip parts are accommodated in a carrier tape consisting of an embossed tape having chip part accommodating portions at predetermined intervals and a cover tape that seals the accommodating surface of the embossed tape, the embossed tape and the cover tape are A taping structure characterized by localized sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987133683U JPS6439268U (en) | 1987-08-31 | 1987-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987133683U JPS6439268U (en) | 1987-08-31 | 1987-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6439268U true JPS6439268U (en) | 1989-03-08 |
Family
ID=31391773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987133683U Pending JPS6439268U (en) | 1987-08-31 | 1987-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6439268U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006182399A (en) * | 2004-12-27 | 2006-07-13 | Tdk Corp | Electronic component array |
-
1987
- 1987-08-31 JP JP1987133683U patent/JPS6439268U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006182399A (en) * | 2004-12-27 | 2006-07-13 | Tdk Corp | Electronic component array |
| JP4517856B2 (en) * | 2004-12-27 | 2010-08-04 | Ｔｄｋ株式会社 | Electronic components |
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