JPH0472639U - - Google Patents
Info
- Publication number
- JPH0472639U JPH0472639U JP11519290U JP11519290U JPH0472639U JP H0472639 U JPH0472639 U JP H0472639U JP 11519290 U JP11519290 U JP 11519290U JP 11519290 U JP11519290 U JP 11519290U JP H0472639 U JPH0472639 U JP H0472639U
- Authority
- JP
- Japan
- Prior art keywords
- package
- mounting part
- metal base
- storing
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 claims 1
- 229910052863 mullite Inorganic materials 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
Landscapes
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
第１図は本考案にかかる半導体素子収納用パツ
ケージの一実施例を示す断面図である。
１……金属基体、１ａ……凸状載置部、２……
絶縁枠体。
FIG. 1 is a sectional view showing an embodiment of a package for housing semiconductor elements according to the present invention. 1...Metal base, 1a...Convex mounting part, 2...
Insulated frame.
Claims (1)
有する金属基体に、前記載置部を囲繞するように
して絶縁枠体を取着して成る半導体素子収納用パ
ツケージにおいて、前記金属基体をタングステン
で、絶縁枠体をムライト質焼結体で形成したこと
を特徴とする半導体素子収納用パツケージ。 A package for storing a semiconductor element, which is formed by attaching an insulating frame to a metal base having a mounting part on which a semiconductor element is mounted in the center of the upper surface so as to surround the mounting part, wherein the metal base is A package for storing semiconductor elements, which is made of tungsten and whose insulating frame is made of a mullite sintered body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990115192U JP2515671Y2 (en) | 1990-10-31 | 1990-10-31 | Package for storing semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990115192U JP2515671Y2 (en) | 1990-10-31 | 1990-10-31 | Package for storing semiconductor devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0472639U true JPH0472639U (en) | 1992-06-26 |
| JP2515671Y2 JP2515671Y2 (en) | 1996-10-30 |
Family
ID=31862936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990115192U Expired - Lifetime JP2515671Y2 (en) | 1990-10-31 | 1990-10-31 | Package for storing semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2515671Y2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5956746A (en) * | 1982-09-24 | 1984-04-02 | Kyocera Corp | Semiconductor package |
| JPS61220444A (en) * | 1985-03-27 | 1986-09-30 | Hitachi Micro Comput Eng Ltd | Semiconductor device |
| JPS6489350A (en) * | 1987-09-29 | 1989-04-03 | Kyocera Corp | Package for containing semiconductor element |
-
1990
- 1990-10-31 JP JP1990115192U patent/JP2515671Y2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5956746A (en) * | 1982-09-24 | 1984-04-02 | Kyocera Corp | Semiconductor package |
| JPS61220444A (en) * | 1985-03-27 | 1986-09-30 | Hitachi Micro Comput Eng Ltd | Semiconductor device |
| JPS6489350A (en) * | 1987-09-29 | 1989-04-03 | Kyocera Corp | Package for containing semiconductor element |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2515671Y2 (en) | 1996-10-30 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |