JPH029442U - - Google Patents
Info
- Publication number
- JPH029442U JPH029442U JP8767588U JP8767588U JPH029442U JP H029442 U JPH029442 U JP H029442U JP 8767588 U JP8767588 U JP 8767588U JP 8767588 U JP8767588 U JP 8767588U JP H029442 U JPH029442 U JP H029442U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- power semiconductor
- pellet
- semiconductor pellet
- concave groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000008188 pellet Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Description
第１図は本考案の一実施例にかかるパワー用の
半導体装置の斜視図、第２図は同実施例における
第１図―断面図、第３図は本考案の他の実施
例にかかる斜視図、第４図は本考案のさらに他の
実施例にかかる斜視図、第５図は従来のパワー用
の半導体装置を示す斜視図である。
２……放熱板、６，６１，６２……凹溝。
FIG. 1 is a perspective view of a power semiconductor device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of the same embodiment as shown in FIG. 1, and FIG. 3 is a perspective view of another embodiment of the present invention. 4 is a perspective view of still another embodiment of the present invention, and FIG. 5 is a perspective view of a conventional power semiconductor device. 2... Heat sink, 6, 61, 62... Concave groove.
Claims (1)
ペレツトを含む主要部を樹脂にて外装した電力用
半導体装置において、 上記放熱板露出面に凹溝を形成したことを特徴
とする電力用半導体装置。[Scope of Claim for Utility Model Registration] A power semiconductor device in which a semiconductor pellet is mounted on a heat sink and the main part including the semiconductor pellet is covered with resin, characterized in that a concave groove is formed on the exposed surface of the heat sink. power semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8767588U JPH029442U (en) | 1988-06-30 | 1988-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8767588U JPH029442U (en) | 1988-06-30 | 1988-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH029442U true JPH029442U (en) | 1990-01-22 |
Family
ID=31312276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8767588U Pending JPH029442U (en) | 1988-06-30 | 1988-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH029442U (en) |
-
1988
- 1988-06-30 JP JP8767588U patent/JPH029442U/ja active Pending