JPH0465451U - - Google Patents
Info
- Publication number
- JPH0465451U JPH0465451U JP10941890U JP10941890U JPH0465451U JP H0465451 U JPH0465451 U JP H0465451U JP 10941890 U JP10941890 U JP 10941890U JP 10941890 U JP10941890 U JP 10941890U JP H0465451 U JPH0465451 U JP H0465451U
- Authority
- JP
- Japan
- Prior art keywords
- resin case
- heat sink
- semiconductor element
- contact
- contact surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Description
第１図は本考案による半導体装置の第１の実施
例の縦断面図、第２図は第１の実施例の使用する
樹脂ケースの底面図、第３図は第２の実施例に使
用する樹脂ケースの部分省略縦断面図、第４図は
同樹脂ケースの部分省略底面図、第５図は従来の
半導体装置の縦断面図である。
１１０……放熱板、１１２……半導体素子、１
１４，２１４……樹脂ケース、１１５，２１５…
…溝、１１６……接着剤。
FIG. 1 is a vertical sectional view of a first embodiment of a semiconductor device according to the present invention, FIG. 2 is a bottom view of a resin case used in the first embodiment, and FIG. 3 is a bottom view of a resin case used in the second embodiment. FIG. 4 is a partially omitted longitudinal cross-sectional view of the resin case, FIG. 4 is a partially omitted bottom view of the resin case, and FIG. 5 is a longitudinal cross-sectional view of a conventional semiconductor device. 110... Heat sink, 112... Semiconductor element, 1
14,214...Resin case, 115,215...
...Groove, 116...adhesive.
Claims (1)
と、この放熱基板の上記一方の面に接触した状態
にかつ上記半導体素子を包囲した状態に設けられ
た樹脂ケースと、この樹脂ケースにおける上記放
熱板との接触面の全周に設けられた溝と、上記樹
脂ケースと上記放熱板とを接着するように上記接
触面に塗布された接着剤とを、具備する半導体装
置。 a heat sink having a semiconductor element attached to one surface; a resin case provided in contact with the one surface of the heat sink and surrounding the semiconductor element; and the heat sink in the resin case. A semiconductor device comprising: a groove provided around the entire circumference of a contact surface with the resin case; and an adhesive applied to the contact surface to bond the resin case and the heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10941890U JPH079381Y2 (en) | 1990-10-18 | 1990-10-18 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10941890U JPH079381Y2 (en) | 1990-10-18 | 1990-10-18 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0465451U true JPH0465451U (en) | 1992-06-08 |
| JPH079381Y2 JPH079381Y2 (en) | 1995-03-06 |
Family
ID=31856619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10941890U Expired - Fee Related JPH079381Y2 (en) | 1990-10-18 | 1990-10-18 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH079381Y2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006310381A (en) * | 2005-04-26 | 2006-11-09 | Toyota Industries Corp | Electronic apparatus |
| JP2012015349A (en) * | 2010-07-01 | 2012-01-19 | Fuji Electric Co Ltd | Semiconductor device |
| JP2018190894A (en) * | 2017-05-10 | 2018-11-29 | 株式会社豊田自動織機 | Semiconductor module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55126649U (en) * | 1979-03-01 | 1980-09-08 | ||
| JPS58166045U (en) * | 1982-04-28 | 1983-11-05 | 日本電気株式会社 | semiconductor equipment |
| JPS62108545A (en) * | 1985-11-06 | 1987-05-19 | Shinko Electric Ind Co Ltd | Printed substrate type package |
-
1990
- 1990-10-18 JP JP10941890U patent/JPH079381Y2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55126649U (en) * | 1979-03-01 | 1980-09-08 | ||
| JPS58166045U (en) * | 1982-04-28 | 1983-11-05 | 日本電気株式会社 | semiconductor equipment |
| JPS62108545A (en) * | 1985-11-06 | 1987-05-19 | Shinko Electric Ind Co Ltd | Printed substrate type package |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006310381A (en) * | 2005-04-26 | 2006-11-09 | Toyota Industries Corp | Electronic apparatus |
| JP2012015349A (en) * | 2010-07-01 | 2012-01-19 | Fuji Electric Co Ltd | Semiconductor device |
| JP2018190894A (en) * | 2017-05-10 | 2018-11-29 | 株式会社豊田自動織機 | Semiconductor module |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH079381Y2 (en) | 1995-03-06 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |