JPH079381Y2 - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPH079381Y2 JPH079381Y2 JP10941890U JP10941890U JPH079381Y2 JP H079381 Y2 JPH079381 Y2 JP H079381Y2 JP 10941890 U JP10941890 U JP 10941890U JP 10941890 U JP10941890 U JP 10941890U JP H079381 Y2 JPH079381 Y2 JP H079381Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin case
- adhesive
- groove
- heat dissipation
- horizontal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Description
【考案の詳細な説明】 ［産業上の利用分野］ 本考案は、半導体装置に関し、特に半導体素子が取り付
けられている放熱板と、樹脂ケースとの接着構造に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a semiconductor device, and more particularly, to a bonding structure between a resin case and a heat dissipation plate to which a semiconductor element is attached.
［従来の技術］ 従来の半導体装置としては、例えば第５図に示すように
ものがあった。この半導体装置は、放熱板10を有し、こ
の放熱板10上には半導体素子12、12が取り付けられてい
る。これら半導体素子12、12を包囲するように放熱板10
の周面に沿って樹脂ケース14が配置され、この樹脂ケー
ス14の放熱板10との接触面は段部に形成され、この段部
の全域に接着剤16が塗布され、樹脂ケース14が放熱板10
に接着されている。そして、樹脂ケース14内には半導体
素子12、12を完全に覆うようにゲル状樹脂18が充填さ
れ、このゲル状樹脂18の上にエポキシ系樹脂20が充填さ
れている。[Prior Art] As a conventional semiconductor device, for example, there is one as shown in FIG. This semiconductor device has a heat dissipation plate 10, and semiconductor elements 12, 12 are mounted on the heat dissipation plate 10. The heat sink 10 surrounds these semiconductor elements 12, 12.
The resin case 14 is arranged along the peripheral surface of the resin case 14, and the contact surface of the resin case 14 with the heat dissipation plate 10 is formed in a step portion. Board 10
Is glued to. The resin case 14 is filled with a gel-like resin 18 so as to completely cover the semiconductor elements 12, 12, and an epoxy resin 20 is filled on the gel-like resin 18.
［考案が解決しようとする課題］ しかし、上記のような半導体装置では、ゲル状樹脂18を
樹脂ケース14内に充填する際に、ゲル状樹脂18が放熱板
10と樹脂ケース14との接触面から樹脂ケース14の外部に
漏れだすのを防止するために、樹脂ケース14と放熱板10
とを締付け治具で挟み込んで固定しているので、放熱板
10と樹脂ケース14との接触面から接着剤16が外部にはみ
だす。従って、この半導体装置の外観を良好にするた
め、接着剤16が固化後にはみだしている接着剤16を削り
とらねばならず、その作業だけ工程数が増加し、半導体
装置の製造が面倒になるという問題点があった。[Problems to be Solved by the Invention] However, in the semiconductor device as described above, when the gel-like resin 18 is filled in the resin case 14, the gel-like resin 18 causes
In order to prevent leakage from the contact surface between the resin case 14 and the resin case 14 to the outside of the resin case 14, the resin case 14 and the heat sink 10
And are fixed by sandwiching them with a tightening jig.
The adhesive 16 protrudes from the contact surface between the resin case 14 and the resin case 14. Therefore, in order to improve the appearance of this semiconductor device, it is necessary to scrape off the adhesive 16 protruding after the adhesive 16 is solidified, and the number of steps is increased only for the operation, which makes the manufacturing of the semiconductor device troublesome. There was a problem.
［課題を解決するための手段］ 上記の問題点を解決するために、本考案は、一方の面に
半導体素子が取り付けられた放熱板を有し、この放熱板
の上記一方の面側で上記半導体素子を包囲した状態に樹
脂ケースが設けられている。この樹脂ケースは、上記一
方の面への接触面である水平面と、上記一方の面に対し
て直角な側面への接触面である垂直面とを有する段を、
全周に備えている。上記樹脂ケースの水平面全周に溝が
形成され、この溝は、上記水平面と垂直面との接合縁に
一致した一縁を有し、上記水平面のほぼ中央付近に他方
の縁を有している。水平面に接着剤が塗布され、上記樹
脂ケースと上記放熱板とを接着している。[Means for Solving the Problems] In order to solve the above-mentioned problems, the present invention has a radiator plate having a semiconductor element attached to one surface thereof, and the radiator plate is provided on the one surface side of the radiator plate. A resin case is provided so as to surround the semiconductor element. This resin case has a step having a horizontal surface which is a contact surface to the one surface and a vertical surface which is a contact surface to a side surface perpendicular to the one surface.
Prepared for the entire circumference. A groove is formed on the entire circumference of the horizontal surface of the resin case, and the groove has one edge that coincides with a joining edge of the horizontal surface and a vertical surface, and has the other edge in the vicinity of substantially the center of the horizontal surface. . An adhesive is applied to the horizontal surface to bond the resin case and the heat dissipation plate.
［作用］ 本考案によれば、樹脂ケースの水平面に形成した溝は、
水平面と垂直面との接合縁に一致した一開口縁を有し、
他方の開口縁は水平面のほぼ中央に位置しているので、
水平面に塗布された接着剤のうち余分なものは、大部分
が溝の中に入り、最もはみだしたとしても、放熱板の側
面側までであり、溝の上記他方の開口縁から樹脂ケース
の内方端までの距離は長いので、樹脂ケースの内方側に
接着剤がはみだすこともない。[Operation] According to the present invention, the groove formed on the horizontal surface of the resin case is
It has one opening edge that coincides with the joining edge of the horizontal plane and the vertical plane,
Since the other opening edge is located almost in the center of the horizontal plane,
Most of the excess adhesive applied to the horizontal surface goes into the groove, and even if it is the most protruding, it reaches up to the side surface of the heat sink, and from the other opening edge of the groove to the inside of the resin case. Since the distance to the end is long, the adhesive does not stick out inside the resin case.
［実施例］ 第１図及び第２図に第１の実施例を示す。この実施例も
従来のものと同様に放熱板110を有し、この放熱板110の
上面には半導体素子112、112が設けられている。[Embodiment] FIG. 1 and FIG. 2 show a first embodiment. This embodiment also has a heat radiating plate 110 like the conventional one, and semiconductor elements 112, 112 are provided on the upper surface of the heat radiating plate 110.
この半導体素子112、112を包囲するように放熱板110上
には樹脂ケース114が配置されている。この樹脂ケース1
14は、第２図に示すように横断面形状が矩形である周壁
114aを有し、上面に半導体素子112、112の各電極に接続
される端子金具（図示せず）を有するもので、その周壁
114aの下面が第１図に示すように段部に形成され、その
段部の水平面が放熱板110の上面に接触している。ま
た、水平面と直角な垂直面が、放熱板110の側面に接触
している。この水平面には、その全周にわたって第２図
に示すように溝115が放熱板110側に開口して形成されて
いる。この溝115は、２つの開口縁を有し、第１図から
明らかなように、その一方の開口縁は、樹脂ケース114
の周壁114aの段部の水平面と垂直面との接合縁と一致し
ている。また、他方の開口縁は、第１図から明らかなよ
うに水平面のほぼ中央付近に位置している。なお、この
溝115は、樹脂ケース114を金型によって成型する際に、
同時に形成される。周壁114aの段部の水平面には接着剤
116が塗布され、この接着剤116が樹脂ケース114を放熱
板110に接着している。なお、第２図に示すように周壁1
14aの内面には突部122、122が突設され、これら突部12
2、122の下面から内部に向ってめねじ124、124が削設さ
れている。これらめねじ124、124は、樹脂ケース114を
放熱板110に接着した上で、ボルト（図示せず）によっ
て樹脂ケース114を放熱板110に固定するためのものであ
る。また、これら突部122、122の下面にも接着剤116が
塗布される。A resin case 114 is arranged on the heat dissipation plate 110 so as to surround the semiconductor elements 112. This resin case 1
14 is a peripheral wall having a rectangular cross section as shown in FIG.
114a and a terminal metal fitting (not shown) connected to each electrode of the semiconductor elements 112 and 112 on the upper surface, and its peripheral wall
The lower surface of 114a is formed in a step as shown in FIG. 1, and the horizontal surface of the step is in contact with the upper surface of the heat dissipation plate 110. Further, a vertical surface perpendicular to the horizontal surface is in contact with the side surface of the heat dissipation plate 110. As shown in FIG. 2, a groove 115 is formed on the horizontal surface so as to open toward the heat radiating plate 110 over the entire circumference. The groove 115 has two opening edges, and as is clear from FIG. 1, one opening edge has a resin case 114.
Coincides with the joining edge between the horizontal surface and the vertical surface of the stepped portion of the peripheral wall 114a. The other opening edge is located near the center of the horizontal plane, as is apparent from FIG. Incidentally, this groove 115, when molding the resin case 114 by a mold,
Formed at the same time. Adhesive is applied to the horizontal surface of the stepped portion of the peripheral wall 114a.
116 is applied, and this adhesive 116 adheres the resin case 114 to the heat dissipation plate 110. As shown in FIG. 2, the peripheral wall 1
Protrusions 122 and 122 are provided on the inner surface of 14a.
Female screws 124, 124 are cut inward from the lower surface of 2, 122. These female screws 124 and 124 are for fixing the resin case 114 to the heat sink 110 with bolts (not shown) after the resin case 114 is bonded to the heat sink 110. The adhesive 116 is also applied to the lower surfaces of the protrusions 122, 122.
樹脂ケース114内には、半導体素子112、112を覆うよう
にゲル状樹脂118が充填され、このゲル状樹脂118の上面
にエポキシ樹脂120が充填されている。A gel resin 118 is filled in the resin case 114 so as to cover the semiconductor elements 112, 112, and an epoxy resin 120 is filled on the upper surface of the gel resin 118.
この半導体装置の製造は、例えば次のようにして行なわ
れる。まず放熱板110の上面に半導体素子112、112を取
り付ける。次に樹脂ケース114の周壁114aの水平面に接
着剤116を塗布して、周壁114aの水平面を放熱板110の上
面に、垂直面を放熱板110の側面にそれぞれ接触させ
る。そして、めねじ124、124にボルトを螺合させて固定
する。さらに、樹脂ケース114と放熱板110とを治具によ
って締めつけ、固定する。この際、水平面の余分な接着
剤116の大部分は、溝115の中に入る。また溝115から接
着剤が流出したとしても、溝115の一方の開口縁が、水
平面と垂直面との接合縁に一致しているので、即ち放熱
板110の上面と側面との接合縁上に位置しているので、
接着剤は殆ど放熱板の側面側に流出することはない。ま
た、溝115の他方の開口縁は、水平面のほぼ中央に位置
しているので、周壁114aの内周縁までの距離が長く、溝
115から流出した接着剤が樹脂ケース114の内側にはみだ
すこともない。この状態において、ゲル状樹脂118を充
填し、さらにこのゲル状樹脂118の上にエポキシ樹脂120
を充填する。This semiconductor device is manufactured, for example, as follows. First, the semiconductor elements 112, 112 are attached to the upper surface of the heat sink 110. Next, the adhesive 116 is applied to the horizontal surface of the peripheral wall 114a of the resin case 114 so that the horizontal surface of the peripheral wall 114a contacts the upper surface of the heat dissipation plate 110 and the vertical surface contacts the side surface of the heat dissipation plate 110, respectively. Then, bolts are screwed onto the female screws 124, 124 to be fixed. Further, the resin case 114 and the heat sink 110 are tightened and fixed by a jig. At this time, most of the extra adhesive 116 on the horizontal surface enters the groove 115. Even if the adhesive flows out from the groove 115, one opening edge of the groove 115 coincides with the joint edge between the horizontal surface and the vertical surface, that is, on the joint edge between the upper surface and the side surface of the heat dissipation plate 110. Because it is located
The adhesive hardly flows out to the side surface of the heat sink. Further, since the other opening edge of the groove 115 is located substantially in the center of the horizontal plane, the distance to the inner peripheral edge of the peripheral wall 114a is long,
The adhesive that has flowed out of 115 does not overflow inside the resin case 114. In this state, the gel resin 118 is filled, and the epoxy resin 120 is placed on the gel resin 118.
To fill.
第２の実施例を第３図及び第４図に示す。この実施例
は、第３図に示すように樹脂ケース214の接触面の面積
が、第１の実施例と比較してかなり広いもので、この接
触面の全域にわたって溝215を設けた上で、放熱板（図
示せず）との固定に用いるために接触面に削設されため
ねじ224の周囲にも、めねじと同心状に環状の溝226を設
けたものである。A second embodiment is shown in FIGS. 3 and 4. In this embodiment, as shown in FIG. 3, the area of the contact surface of the resin case 214 is considerably larger than that of the first embodiment, and after the groove 215 is provided over the entire area of this contact surface, An annular groove 226 is provided concentrically with the female screw around the screw 224 because it is cut on the contact surface for use in fixing to a heat sink (not shown).
この第２の実施例でも、接触面に塗布された接着剤のう
ち余分なものは、放熱板に接触させた際に溝215、226内
に侵入し、樹脂ケースの外部にはみだすことはない。Also in the second embodiment, the excess adhesive applied to the contact surface does not enter the grooves 215 and 226 when it comes into contact with the heat dissipation plate and does not overflow to the outside of the resin case.
［考案の効果］ 以上のように、本考案によれば、樹脂ケースの段の水平
面と垂直面との接合縁に、溝の一方の開口縁が一致する
ように溝を形成しているので、即ち、溝の一方の開口縁
は、放熱板の一方の面と側面との接合縁上に位置してい
る。余分な接着剤は、溝内に収容されており、たとえ接
着剤が溝からその自重によって流出しようとしても、溝
の垂直面と放熱板の側面との隙間は非常に小さく、この
隙間から大量の接着剤が外部に流出することはない。従
って、半導体装置の外観が良好になる上に、接着剤の固
化後に、はみだした接着剤を除去する作業が不要にな
り、工程数を削減することができる。さらに、溝の他方
の開口縁を水平面のほぼ中央に設けているので、樹脂ケ
ースの内方にも接着剤は、殆ど流出しない。仮に、溝を
水平面のほぼ中央に設けた場合、該溝における樹脂ケー
スの内方端側の開口縁と内方端との距離は短く、溝から
流出した接着剤が樹脂ケースの内方端よりも内側に流出
することがある。しかし、本考案では、溝の他方の開口
縁は水平面のほぼ中央にあるので、樹脂ケースの内方端
までの距離が長く、樹脂ケースの内方端よりも内側に接
着剤が流出することはない。従って、接着剤が半導体素
子に付着することはなく、接着剤の付着により半導体素
子が誤動作することもない。[Effect of the Invention] As described above, according to the present invention, the groove is formed so that one opening edge of the groove coincides with the joining edge between the horizontal surface and the vertical surface of the step of the resin case. That is, one opening edge of the groove is located on the joining edge between one surface and the side surface of the heat dissipation plate. The excess adhesive is contained in the groove, and even if the adhesive tries to flow out from the groove due to its own weight, the gap between the vertical surface of the groove and the side surface of the heat sink is very small, and a large amount of this gap is provided. The adhesive does not flow out. Therefore, the appearance of the semiconductor device is improved, and the work of removing the protruding adhesive after the adhesive is solidified is unnecessary, and the number of steps can be reduced. Further, since the other opening edge of the groove is provided substantially at the center of the horizontal plane, the adhesive hardly flows into the inside of the resin case. If the groove is provided approximately in the center of the horizontal surface, the distance between the opening edge on the inner end side of the resin case and the inner end of the groove is short, and the adhesive flowing out from the groove is closer to the inner end of the resin case. May also flow inward. However, in the present invention, since the other opening edge of the groove is approximately in the center of the horizontal plane, the distance to the inner end of the resin case is long, and the adhesive does not flow out to the inside of the inner end of the resin case. Absent. Therefore, the adhesive does not adhere to the semiconductor element, and the adhesion of the adhesive does not cause the semiconductor element to malfunction.
第１図は本考案による半導体装置の第１の実施例の縦断
面図、第２図は第１の実施例の使用する樹脂ケースの底
面図、第３図は第２の実施例に使用する樹脂ケースの部
分省略縦断面図、第４図は同樹脂ケースの部分省略底面
図、第５図は従来の半導体装置の縦断面図である。 110……放熱板、112……半導体素子、114、214……樹脂
ケース、115、215……溝、116……接着剤。FIG. 1 is a vertical sectional view of a first embodiment of a semiconductor device according to the present invention, FIG. 2 is a bottom view of a resin case used in the first embodiment, and FIG. 3 is used in a second embodiment. FIG. 4 is a partially omitted vertical sectional view of the resin case, FIG. 4 is a partially omitted bottom view of the same resin case, and FIG. 5 is a vertical sectional view of a conventional semiconductor device. 110 ... Heat sink, 112 ... Semiconductor element, 114, 214 ... Resin case, 115, 215 ... Groove, 116 ... Adhesive.
Claims (1)
熱板と、この放熱板の上記一方の面側で上記半導体素子
を包囲した状態に設けられ上記一方の面への接触面であ
る水平面と上記一方の面に対して直角な側面への接触面
である垂直面とを有する段を全周に備えた樹脂ケース
と、上記樹脂ケースの水平面全周に形成され上記水平面
と垂直面との接合縁に一致した一開口縁を有し上記水平
面のほぼ中央付近に他方の開口縁を有する溝と、上記水
平面に塗布され上記樹脂ケースと上記放熱板とを接着す
る接着剤とを、具備する半導体装置。1. A heat dissipation plate having a semiconductor element attached to one surface thereof, and a horizontal plane which is provided so as to surround the semiconductor element on the one surface side of the heat dissipation plate and which is a contact surface to the one surface. And a resin case having a step having a vertical surface that is a contact surface to a side surface perpendicular to the one surface, and a horizontal surface and a vertical surface formed on the entire horizontal surface of the resin case. A groove having one opening edge that coincides with the joining edge and having the other opening edge near the center of the horizontal surface, and an adhesive that is applied to the horizontal surface and bonds the resin case and the heat dissipation plate to each other are provided. Semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10941890U JPH079381Y2 (en) | 1990-10-18 | 1990-10-18 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10941890U JPH079381Y2 (en) | 1990-10-18 | 1990-10-18 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0465451U JPH0465451U (en) | 1992-06-08 |
| JPH079381Y2 true JPH079381Y2 (en) | 1995-03-06 |
Family
ID=31856619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10941890U Expired - Fee Related JPH079381Y2 (en) | 1990-10-18 | 1990-10-18 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH079381Y2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006310381A (en) * | 2005-04-26 | 2006-11-09 | Toyota Industries Corp | Electronic apparatus |
| JP5310660B2 (en) * | 2010-07-01 | 2013-10-09 | 富士電機株式会社 | Semiconductor device |
| JP6766744B2 (en) * | 2017-05-10 | 2020-10-14 | 株式会社豊田自動織機 | Semiconductor module |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62108545A (en) * | 1985-11-06 | 1987-05-19 | Shinko Electric Ind Co Ltd | Printed substrate type package |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55126649U (en) * | 1979-03-01 | 1980-09-08 | ||
| JPS58166045U (en) * | 1982-04-28 | 1983-11-05 | 日本電気株式会社 | semiconductor equipment |
-
1990
- 1990-10-18 JP JP10941890U patent/JPH079381Y2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62108545A (en) * | 1985-11-06 | 1987-05-19 | Shinko Electric Ind Co Ltd | Printed substrate type package |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0465451U (en) | 1992-06-08 |
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