JPH0428252A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To prevent a trouble that adhesive agent overflows to attach to an unnecessary part by a method wherein a step is provided to the edge of a heat sink extending from the end face to the outer surface to hold adhesive agent. CONSTITUTION:At the assembly of a hybrid integrated circuit device, a semiconductor element 1 and a wiring board 2 are previously mounted on a heat sink 3 by soldering or bonding, and the edge 3a of the heat sink 3 and the edge 4a of a package 4 are bonded together into one piece with adhesive agent 5. At bonding, the adhesive agent 5 is made to protrude outwards from the edges 3a and 4a of the heat sink 3 and the package 4. As a step 6 is provided to the edge 3a of the heat sink 3, the protuberant adhesive agent 5 is made to flow to the step 6 and kept there, and the adhesive agent 5 adhering the inner face of the step 6 is cured as it is, so that it is prevented from overflowing to the outside.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a hybrid integrated circuit device, and more particularly to an integrated adhesive structure of a heat sink and a package constituting the hybrid integrated circuit device.

[Conventional technology]

Conventionally, as an example of a hybrid integrated circuit device, as shown in FIG.
and a wiring board 2 on which the wiring board 2 is mounted, and a flat heat sink (radiator plate) 3 to which the wiring board 2 is bonded on the inner surface, and a heat sink 3 that is fitted into the heat sink to seal the semiconductor element 1. There is a box-shaped package 4 that is equipped with a box-like package 4. The heat sink 3 and the package 4 are integrated by bonding their end edges 3a and 4a to each other with an adhesive 5 such as epoxy resin.

[Problem to be solved by the invention]

However, in the conventional hybrid integrated circuit device, the heat sink 3 and the edge portion 3a of the pan cage 4,
When 4a are bonded together with adhesive 5, as shown in FIG. It may stick. If such adhesive 5 protrudes and adheres, it not only causes a poor appearance of the product, but also causes the adhesive 5 that protrudes and adheres to the product when it is attached to a required device (not shown). The attachment to the outer surface of the heat sink 3 has caused problems such as preventing close contact with the surface.

The present invention has been devised in view of these inconveniences, and it prevents the adhesive from extruding and adhering to the outer surfaces of the heat sink and package when bonding the heat sink and the pan cage. It is an object of the present invention to provide a hybrid integrated circuit device that can prevent problems caused by sticking out and sticking.

[Means to solve the problem]

In order to achieve such an object, the present invention provides a hybrid integrated circuit device in which an edge of a heat sink and an edge of a package fitted thereto are bonded together with an adhesive. A stepped portion for holding the adhesive is formed at a position extending from the outer end face to the outer surface of the edge portion.

[Function] According to the above configuration, when the edges of the heat sink and the package are bonded together with adhesive, even if the adhesive may ooze out from between them, the oozing adhesive will not be attached to the heat sink. The liquid flows into and is held in the stepped portion pre-formed on the edge, and is prevented from flowing further outward.

〔Example〕

Hereinafter, one embodiment of the present invention will be described based on the drawings.

FIG. 1 is a longitudinal sectional side view showing the configuration of a hybrid integrated circuit device according to the present invention. Note that the overall configuration of this hybrid integrated circuit device is basically the same as the conventional example described above, so the first
In the figure, parts that are the same or equivalent to those in Figure 2,
The same reference numerals are given to the parts, and detailed explanation thereof will be omitted here.

The hybrid integrated circuit device according to this embodiment has a flip chip r
The device includes a semiconductor element 1 such as C, a wiring board 2, a flat heat sink 3, and a box-like package 4. A stepped portion 6 is formed over the entire periphery at a position extending from the outer end surface 3b to the outer surface 3c of the edge portion 3a of the heat sink 3, and the heat sink 3 and the package 4 are formed at the edge portion 3a of each other. , 4a are bonded to each other with an adhesive 5 such as epoxy resin to be integrated. In FIG. 1, the cross-sectional shape of the stepped portion 6 is a single-stage rectangular notch, but the present invention is not limited to this. For example, the cross-sectional shape may be Trapezoidal shape with inclined bottom surface 6a or 2
It may be in the shape of a step or more.

By the way, when assembling the hybrid integrated circuit device having the above configuration, the semiconductor element 1 and the wiring board 2 are mounted on the heat sink 3 by soldering or adhesive, and then
The edge portion 3a of the heat sink 3 and the edge portion 4a of the package 4 are bonded together with the adhesive 5. When bonding them together, the edges 3a and 4a of the heat sink 3 and the package 4 are bonded together. The adhesive 5 will protrude outward. However, since the edge portion 3a of the heat sink 3 is formed with a stepped portion 6, the adhesive 5 that has protruded flows into the stepped portion 6 and is held there, and adheres to the inner surface of the stepped portion 6. It will harden if you leave it on.

〔Effect of the invention〕

As explained above, according to the present invention, the stepped portion that holds the adhesive is located at a position extending from the outer end surface to the outer surface of the edge portion of the heat sink to which the edge portion of the pan cage is fitted and bonded. , so even if the adhesive does not ooze out when bonding the heat sink and package,
The overflowing adhesive flows into and is held in the stepped portions pre-formed at the edge of the heat sink, and is prevented from flowing further outwards by the stepped portions.

Therefore, when bonding the heat sink and package together, the adhesive no longer protrudes and adheres to the outer surfaces of the heat sink and package, as in the conventional case, and this eliminates the inconvenience caused by the adhesive protruding and adhering. This has the effect of being able to prevent this.

[Brief explanation of the drawing]

FIG. 1 is a vertical side view showing the configuration of a hybrid integrated circuit device according to the present invention, and FIG. 2 is a vertical side view showing the configuration of a conventional hybrid integrated circuit device. In the figure, numeral 3 is a heat sink, 3a is an edge portion, 3b
3c is an outer surface, 4 is a package, 4a is an edge portion, 5 is an adhesive, and 6 is a stepped portion. Note that the same reference numerals in the drawings indicate parts and portions that are the same or correspond to each other.

Claims (1)

[Claims] (1) In a hybrid integrated circuit device in which an edge of a heat sink and an edge of a package fitted thereto are integrally bonded together with an adhesive, the edge of the heat sink is exposed from the outer end surface of the edge of the heat sink. 1. A hybrid integrated circuit device, characterized in that a stepped portion for holding an adhesive is formed at a position extending over the surface.