JPS6032800Y2 - Encapsulation structure of electrical parts - Google Patents
Encapsulation structure of electrical partsInfo
- Publication number
- JPS6032800Y2 JPS6032800Y2 JP7591180U JP7591180U JPS6032800Y2 JP S6032800 Y2 JPS6032800 Y2 JP S6032800Y2 JP 7591180 U JP7591180 U JP 7591180U JP 7591180 U JP7591180 U JP 7591180U JP S6032800 Y2 JPS6032800 Y2 JP S6032800Y2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- cover
- terminal plate
- plate
- gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Description
【考案の詳細な説明】
本考案は作業容易で封入特性の良い小形電気部品の封入
構造に関するものである。[Detailed Description of the Invention] The present invention relates to an encapsulation structure for small electrical components that is easy to work with and has good encapsulation characteristics.
第１図は従来の封入構造の一例を説明するための電気部
品の断面図である。FIG. 1 is a sectional view of an electrical component for explaining an example of a conventional enclosure structure.
１は内蔵される電気部品２は端子板、３は電気部品の外
出端子で、内蔵される電気部品１と外出端子３が一体的
に構成され端子板２が外出端子３と遊合している場合も
あり、端子板２と外出端子３とが一体的に構成されてい
る場合もある。1 is a built-in electrical component 2 is a terminal board; 3 is an outgoing terminal of the electrical component; the built-in electrical component 1 and the outgoing terminal 3 are integrally constructed, and the terminal board 2 is loosely connected to the outgoing terminal 3. In some cases, the terminal board 2 and the outgoing terminal 3 may be integrally constructed.
４は力、バーで５はカバーに設けられた端子板２を受け
る段部である。4 is a force, a bar, and 5 is a stepped portion for receiving the terminal plate 2 provided on the cover.
第１図の例においてはカバー４の裾部６を延長し、その
内面と端子板２の底面で構成する凹部に絶縁封入剤７を
注入し、カバ一端子板間および端子板間を密封すると共
に端子３を固定する。In the example shown in FIG. 1, the skirt 6 of the cover 4 is extended, and an insulating encapsulant 7 is injected into the recess formed by its inner surface and the bottom of the terminal board 2 to seal between the cover and the terminal board and between the terminal boards. Terminal 3 is also fixed.
このような従来の構造においてはこれら電気部品を例え
ばプリント板８に実装する場合、ハンダのフローソルダ
一工程における熱が直接カバー４に伝導され、カバー４
が熱可塑性のプラスチック材料のような場合にはカバー
が変形し、カバーと端子板間の密封度が悪化する事があ
った。In such a conventional structure, when these electrical components are mounted on the printed circuit board 8, for example, the heat in the flow soldering process of solder is directly conducted to the cover 4,
If the cover is made of a thermoplastic material, the cover may deform and the seal between the cover and the terminal board may deteriorate.
本考案はこれらの欠点を解決するため、カバーと取付面
との間に端子板を介在させて密封すると共にカバーへの
熱伝導を減殺しようとするものである。In order to solve these drawbacks, the present invention attempts to interpose a terminal plate between the cover and the mounting surface to seal the cover and reduce heat conduction to the cover.
以下図面について詳細に説明する。第２図は本考案の一
実施例を示す斜視図で、第２図ａは端子板９に板状シー
ル剤１０を被せた状態、第２図すは板状シール剤１０を
除いた場合である。The drawings will be explained in detail below. Fig. 2 is a perspective view showing an embodiment of the present invention, in which Fig. 2a shows a state in which the terminal plate 9 is covered with a plate-shaped sealant 10, and Fig. 2 shows a state in which the plate-shaped sealant 10 is removed. be.
端子板９は第４図の如く外周に枠部１１があり、連結部
１２により端子板９と連結され端子板９と枠部１１との
間の空隙１３はシール剤の流入孔となる。As shown in FIG. 4, the terminal plate 9 has a frame portion 11 on its outer periphery, which is connected to the terminal plate 9 by a connecting portion 12, and a gap 13 between the terminal plate 9 and the frame portion 11 serves as an inflow hole for the sealant.
端子板９と枠部１１は耐熱温度の高い材料で一体成形さ
れ熱には強い。The terminal plate 9 and the frame portion 11 are integrally molded from a material with high heat resistance and are resistant to heat.
枠部１１の端面ばカバー１４の端面と対接して端子板９
を支え、端子板９には外出端子１５が貫通している。The end face of the frame portion 11 is in contact with the end face of the cover 14, and the terminal plate 9
An outgoing terminal 15 penetrates through the terminal plate 9.
第３図は封入固定構造を説明する部分断面図で、第３図
ａ、 ｂはＡ −Ａ’断面で前者は半硬化形の板状シー
ル剤１０を端子板９上に載置した状態で、後者は板状シ
ール剤１０を加熱して溶融したシール剤が空隙１３から
流入しカバー１４と端子板９との間隙を塞ぎ端子孔９ｂ
と外出端子１５との間隙にも流入して硬化し、端子板９
とカバー１４間を密閉し外出端子１５を固定したことを
示している。FIG. 3 is a partial sectional view illustrating the sealing and fixing structure, and FIGS. 3a and 3b are A-A' cross-sections, and the former shows the semi-cured plate-shaped sealant 10 placed on the terminal plate 9. In the latter case, the plate-shaped sealant 10 is heated and the melted sealant flows in from the gap 13, closes the gap between the cover 14 and the terminal plate 9, and closes the terminal hole 9b.
It also flows into the gap between the terminal board 9 and the external terminal 15 and hardens.
This shows that the space between the and cover 14 is sealed and the outgoing terminal 15 is fixed.
第３図Ｃは第４図ａのＤ部分における端子板９とカバー
１４の嵌合構造を示す。FIG. 3C shows the fitting structure between the terminal plate 9 and the cover 14 in the D portion of FIG. 4a.
端子板９をカバー１４内に挿入すれば端子板の突起９ａ
はカバーの嵌合部１４ａに嵌合して固定される。When the terminal board 9 is inserted into the cover 14, the protrusion 9a of the terminal board
is fitted into and fixed to the fitting portion 14a of the cover.
１６は内蔵される電気部品である。第４図（ｂ）及び（
Ｃ）はそれぞれ９−Ｂ’断面及びＣ−Ｃ′断面を示し、
端子板９と枠部１１の間に空隙１３があり、端子板９と
枠部１１とは連結部１２により連結されている事を示し
ている。16 is a built-in electrical component. Figure 4(b) and (
C) shows the 9-B' cross section and the C-C' cross section, respectively,
It is shown that there is a gap 13 between the terminal plate 9 and the frame part 11, and the terminal plate 9 and the frame part 11 are connected by the connecting part 12.
第５図は他の実施例で、第５図ａは枠部構造を示す端子
板断面図、第５図すは連結部構造を示す端子板断面図で
ある。FIG. 5 shows another embodiment, in which FIG. 5a is a cross-sectional view of the terminal plate showing the frame structure, and FIG. 5 is a cross-sectional view of the terminal plate showing the connecting structure.
端子板１７と枠部１Ｂとは連結部１９により連結され、
枠部１８にはガイド壁２０が設けてありカバー２１に挿
入する作業を容易とし且つ封入特性を良好にしている。The terminal plate 17 and the frame portion 1B are connected by a connecting portion 19,
The frame portion 18 is provided with a guide wall 20 to facilitate the operation of inserting it into the cover 21 and to improve the sealing characteristics.
端子板１７と枠部１８との間には空隙２２がありシール
剤の流入用として働く事は前例と同様である。As in the previous example, there is a gap 22 between the terminal plate 17 and the frame 18, which serves as a space for the sealant to flow.
以上説明したように本考案によれば熱に強い端子板がカ
バーと取付ける可きプリント基板との間に介在している
ためハンダ工程による熱は直接カバーが変形したり密封
性を損うことがない。As explained above, according to the present invention, a heat-resistant terminal board is interposed between the cover and the attached printed circuit board, so the heat from the soldering process does not directly deform the cover or impair its sealing performance. do not have.
第１図は従来の封入構造の一例を示す断面図、第２図ａ
、 ｂは本考案の一実施例を示す斜視図、第３図は封入
固定構造を説明する部分断面図でａｔ ｂはＡ−Ａ’断
面Ｃは第４図り部分における断面、第４図ａは端子板９
の斜視図、ｂ及びＣはＢ−Ｂ’断面及びＣ−Ｃ’断面、
第５図ａ、ｂは他の実施例を示す端子板断面図である。
１，１６・・・・・・内蔵される電気部品、２，９，１
７・・・・・・端子板、３，１５・・・・・・外出端子
、４，１４．２１・・・・・・カバー、７・・・・・・
シール剤、１０・・・・・・板状シール剤、１１．１８
・・・・・・枠部、１２，１９・・・・・・連結部、１
３，２２・・・・・・空隙。Figure 1 is a sectional view showing an example of a conventional enclosure structure, Figure 2a
, b is a perspective view showing an embodiment of the present invention, FIG. 3 is a partial sectional view illustrating the enclosing and fixing structure, at b is the A-A' cross section C is a cross section at the fourth drawing part, and FIG. Terminal board 9
perspective view, b and C are B-B' cross section and C-C' cross section,
FIGS. 5a and 5b are sectional views of a terminal plate showing another embodiment. 1, 16... Built-in electrical parts, 2, 9, 1
7...Terminal board, 3,15...Outgoing terminal, 4,14.21...Cover, 7...
Sealing agent, 10... Plate sealing agent, 11.18
...Frame part, 12, 19...Connection part, 1
3,22... void.
Claims (1)
に形威し、該枠部の端面とカバーの端面とを係合させ、
端子板と枠部とで構成する凹部および端子板とカバーの
間隙に封入剤を注入硬化させて密封した事を特徴とする
電気部品の封入構造。A frame portion having a gap with the outer periphery of the terminal plate is formed integrally with the terminal plate, and an end surface of the frame portion and an end surface of the cover are engaged,
An electrical component encapsulation structure characterized by injecting and hardening an encapsulant into a recess formed by a terminal plate and a frame and a gap between the terminal plate and a cover to seal it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7591180U JPS6032800Y2 (en) | 1980-05-30 | 1980-05-30 | Encapsulation structure of electrical parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7591180U JPS6032800Y2 (en) | 1980-05-30 | 1980-05-30 | Encapsulation structure of electrical parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57985U JPS57985U (en) | 1982-01-06 |
| JPS6032800Y2 true JPS6032800Y2 (en) | 1985-09-30 |
Family
ID=29438576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7591180U Expired JPS6032800Y2 (en) | 1980-05-30 | 1980-05-30 | Encapsulation structure of electrical parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6032800Y2 (en) |
-
1980
- 1980-05-30 JP JP7591180U patent/JPS6032800Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57985U (en) | 1982-01-06 |
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