JPH0623254U - PCB fixing structure - Google Patents
PCB fixing structureInfo
- Publication number
- JPH0623254U JPH0623254U JP060741U JP6074192U JPH0623254U JP H0623254 U JPH0623254 U JP H0623254U JP 060741 U JP060741 U JP 060741U JP 6074192 U JP6074192 U JP 6074192U JP H0623254 U JPH0623254 U JP H0623254U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- resin
- sealing material
- wall portion
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
Abstract
(57)【要約】 （修正有）
【目的】 基板を筐体に樹脂により接着固定する基板の
固定構造において、基板に対する放熱性の向上及び基板
の剥がれを防止するとともに、基板接着時における樹脂
の漏れを防止する。
【構成】 筐体に基板３の側面周囲を囲う壁部１２を設
け、該壁部内に樹脂２を流し込み、この樹脂の上に基板
を搭載する。
(57) [Summary] (Modified) [Purpose] In a board fixing structure in which the board is bonded and fixed to the housing with a resin, heat dissipation is improved for the board and peeling of the board is prevented. Prevent leaks. [Structure] A housing is provided with a wall portion 12 surrounding a side surface of a substrate 3, a resin 2 is poured into the wall portion, and the substrate is mounted on the resin.
Description
【０００１】[0001]
本考案は、樹脂により基板を筐体に接着固定する、基板の固定構造に関する。 The present invention relates to a board fixing structure in which a board is adhesively fixed to a housing with a resin.
【０００２】[0002]
基板を筐体、特に放熱板に固定するには、液体状の樹脂を放熱板に塗っておき 、この樹脂の上から基板を載せて基板を貼りつけ、樹脂を熱硬化させて基板を放 熱板に接着固定する場合がある。これを図４を用いて説明する。 図４は基板を収めた放熱板の断面図である。４１は放熱板、４２は樹脂、４３ は基板である。また基板４３上にはランド４４が搭載されており、放熱板４１上 にあるポスト４５とワイヤ４６を介して電気接続を行うものである。４７はポス ト４５と連なるリードである。４８は発熱性のある電子部品である。尚、放熱板 ４１内のリード４７と放熱板４１間は絶縁性のゴム４８が介入されており、この ゴム４８により、リード４７と放熱板４１とは絶縁されている。 To fix the board to the case, especially to the heat sink, apply liquid resin to the heat sink, put the board on top of this resin and stick the board, and heat cure the resin to heat the board. It may be adhesively fixed to the board. This will be described with reference to FIG. FIG. 4 is a cross-sectional view of a heat sink containing a substrate. Reference numeral 41 is a heat sink, 42 is a resin, and 43 is a substrate. A land 44 is mounted on the substrate 43, and is electrically connected to the post 45 on the heat dissipation plate 41 and the wire 46. Reference numeral 47 is a lead connected to the post 45. Reference numeral 48 is an electronic component having heat generation. An insulating rubber 48 is interposed between the lead 47 in the heat dissipation plate 41 and the heat dissipation plate 41, and the rubber 48 insulates the lead 47 and the heat dissipation plate 41.
【０００３】[0003]
樹脂４２の量（塗布量）が少ないと、基板４３の裏面の全面が完全に樹脂に接 触せずに、基板４３の裏面と樹脂４２との間に隙間を生ずることがある。基板４ ３からの熱は実際には樹脂４２を介して放熱板４１に伝え、この放熱板４１から 放熱させる必要があるが、隙間が生じると基板４３からの熱を完全に放熱板４１ に伝えることができず、放熱性が悪くなってしまうという問題を生じる。更に隙 間があると、この中に存在する空気が基板４３の発熱等の時に膨張し、樹脂４２ と基板４３間に圧力が発生することになり、基板４３が樹脂４２から剥がれてし まう。 If the amount of the resin 42 (application amount) is small, the entire back surface of the substrate 43 may not completely contact the resin, and a gap may be formed between the back surface of the substrate 43 and the resin 42. The heat from the substrate 43 is actually transferred to the heat dissipation plate 41 via the resin 42, and it is necessary to dissipate the heat from the heat dissipation plate 41. However, when a gap is created, the heat from the substrate 43 is completely transferred to the heat dissipation plate 41. However, there is a problem in that the heat dissipation becomes poor. If there is a gap, the air present therein expands when the substrate 43 generates heat, etc., and a pressure is generated between the resin 42 and the substrate 43, and the substrate 43 peels off from the resin 42.
【０００４】 これに対処するには、樹脂の量を増やすことが考えられるが、逆に樹脂４２を 多くすると、樹脂４２のだれによって樹脂４２の一部がポスト４５にまで及んで 流れてしまい、樹脂がポスト４５上、即ちワイヤ４６と接続する部分を覆ってし まう場合がある。従って樹脂の量を増やしても、結局ワイヤ４６をポスト４５と ランド４４間で接続（ワイヤボンディング）することができず、ポスト４５上を 覆ってしまった樹脂をわざわざ削り落とさなくてはならないという問題を生ずる 。To cope with this, it is conceivable to increase the amount of resin, but if the amount of resin 42 is increased, a part of the resin 42 will reach the post 45 due to the drool of the resin 42, and The resin may cover the post 45, that is, the portion connected to the wire 46. Therefore, even if the amount of resin is increased, the wire 46 cannot be connected (wire bonding) between the post 45 and the land 44 after all, and the resin that has covered the post 45 must be scraped off. Cause
【０００５】 本考案は、放熱性の向上、及び基板の剥がれを防止するとともに基板外の外部 素子へ樹脂が流動してしまうことを防止するようにしたものである。The present invention is intended to improve heat dissipation, prevent the substrate from peeling, and prevent the resin from flowing to an external element outside the substrate.
【０００６】[0006]
上記課題を解決するために、本考案は、筐体に基板を樹脂により接着固定する 基板の固定構造において、前記筐体に前記基板の側面周囲を囲う壁部を設け、該 壁部内に前記樹脂を注入し、前記基板を前記樹脂上に搭載したことを特徴とし、 更に前記壁部は、前記筐体に形成される凹部の側壁からなることを特徴とし、更 に筐体に基板を樹脂により接着固定する基板の固定構造において、前記筐体に前 記基板の側面周囲を囲う壁部と、該壁部内における、前記基板と対向する前記筐 体の底面に、前記基板の前記底面と対向する面に搭載された電子部品の高さより も少なくとも大きい高さを持つ突起を設け、該壁部内に前記樹脂を注入し、前記 基板を前記樹脂上に搭載したことを特徴とする。 In order to solve the above-mentioned problems, the present invention provides a board fixing structure in which a board is adhered and fixed to a housing by providing a wall portion surrounding the side surface of the board in the housing, and the resin inside the wall portion. Is injected, and the substrate is mounted on the resin. Further, the wall portion is formed of a side wall of a recess formed in the housing. In a structure for fixing a substrate to be adhesively fixed, a wall portion surrounding a side surface of the substrate in the housing, and a bottom surface of the housing in the wall portion facing the substrate, which faces the bottom surface of the substrate. A protrusion having at least a height higher than the height of the electronic component mounted on the surface is provided, the resin is injected into the wall portion, and the substrate is mounted on the resin.
【０００７】[0007]
筐体の壁部内に樹脂を注入すると、壁部内に樹脂が溜まる。そこでこの樹脂上 に基板を搭載すると、基板の片面、即ち基板の樹脂と接着する面が樹脂内に沈む ことになり、基板の片面は少なくとも樹脂に覆われることになる。従って、基板 の片面は完全に樹脂と接触する状態になる。また樹脂の量は多くなるが、壁部を 設けているので、基板から余分に流れようとする樹脂は壁部の段差によって阻止 され、よって基板外の外部素子（アルミポスト）にまで樹脂が流れ込んでしまう ことはなくなる。 When the resin is injected into the wall of the housing, the resin accumulates in the wall. Therefore, when the substrate is mounted on this resin, one surface of the substrate, that is, the surface of the substrate to be bonded to the resin, is sunk in the resin, and at least one surface of the substrate is covered with the resin. Therefore, one side of the substrate is in complete contact with the resin. Also, although the amount of resin increases, since the wall is provided, the resin that tries to flow from the substrate excessively is blocked by the step on the wall, so that the resin flows into the external element (aluminum post) outside the substrate. It will not be lost.
【０００８】 また前記壁部は、筐体に形成した凹部内の側壁でもよく、この側壁の段差によ って基板から余分に流れようとする樹脂を阻止できる。 また更に、前記基板と対向する前記筐体の底面に、前記基板の前記底面と対向 する面に搭載された電子部品の高さよりも少なくとも大きい高さを持つ突起を設 け、更に突起の位置が前記電子部品と対向しないようにすることで、前記基板の 前記底面と対向する面に搭載された電子部品が前記底面と接触しようとしても、 前記突起が基板のこの面と係止するので、前記基板をたとえ押し込んだとしても 、電子部品の破損を防止できる。Further, the wall portion may be a side wall inside the recess formed in the housing, and the step of the side wall can prevent the resin from flowing excessively from the substrate. Furthermore, a protrusion having a height at least larger than the height of the electronic component mounted on the surface of the substrate facing the bottom surface is provided on the bottom surface of the housing facing the substrate, and the position of the projection is further increased. By not facing the electronic component, even if the electronic component mounted on the surface of the substrate facing the bottom surface tries to contact the bottom surface, the protrusion locks with this surface of the substrate. Even if the board is pushed in, damage to electronic components can be prevented.
【０００９】[0009]
図１は本考案の一実施例を示す基板を収めた放熱板の断面図である。尚、本考 案における筐体を、本例ではセンサ（Ｇセンサ、非接触スロットルセンサ等）の 放熱板として適用している。１はアルミ製の放熱板、２はシリコン樹脂からなる シール材、３は厚さ０．５ミリ程度のセラミック基板である。セラミック基板３ 上には電子部品８（チップ等）やランド４が搭載されている。また放熱板１上に はポスト５が設けられており、ランド４とアルミワイヤ６を介して電気的に接続 されている。ポスト５は実際には、金からなるリード線の一部が放熱板１上面か ら突出したものであり、またこのリード線は放熱板１内を通過して、放熱板１下 面から外部に渡って延びている。この下面から外部へ延長したものがリード７と して形成され、図示せぬマザーボードとはんだ接続される。またリード線と放熱 板１との電気接触を防止するため、放熱板１内にあるリード線の周囲、及び外部 に突出したリード線の一部は絶縁性のゴム５１に覆われている。これにより、リ ード線と放熱板１とは絶縁される。 FIG. 1 is a cross-sectional view of a heat sink containing a substrate showing an embodiment of the present invention. The housing in the present proposal is used as a heat dissipation plate for a sensor (G sensor, non-contact throttle sensor, etc.) in this example. Reference numeral 1 is a heat sink made of aluminum, 2 is a sealing material made of silicon resin, and 3 is a ceramic substrate having a thickness of about 0.5 mm. Electronic components 8 (chips, etc.) and lands 4 are mounted on the ceramic substrate 3. A post 5 is provided on the heat dissipation plate 1 and is electrically connected to the land 4 via an aluminum wire 6. The post 5 is actually a part of a lead wire made of gold that protrudes from the upper surface of the heat sink 1, and this lead wire passes through the heat sink 1 to the outside from the lower surface of the heat sink 1. It extends across. The extension from the lower surface to the outside is formed as a lead 7 and is soldered to a mother board (not shown). In addition, in order to prevent electrical contact between the lead wire and the heat dissipation plate 1, the periphery of the lead wire inside the heat dissipation plate 1 and a part of the lead wire protruding to the outside are covered with an insulating rubber 51. As a result, the lead wire and the heat sink 1 are insulated.
【００１０】 放熱板１には、深さがセラミック基板３の厚さとほぼ同じ凹部１１が設けられ ており、この凹部１１によって形成された凹部１１の中の側壁１２（壁部）が基 板３の側面の外周を覆う。凹部１１内にはシール材２が注入されているが、この シール材２の厚さはセラミック基板３の厚さよりも小さいように設定される。こ の場合、シール材２のセラミック基板３の搭載以前の厚さは０．３ミリ程度であ る。このシール材２上にはセラミック基板３が搭載されているが、この基板３の 裏面全面、及び基板３の側面の一部はシール材２によって覆われている。この凹 部１１は金形にて形成される。The heat sink 1 is provided with a recess 11 having a depth substantially the same as the thickness of the ceramic substrate 3, and a side wall 12 (wall) in the recess 11 formed by the recess 11 is a base plate 3. Cover the outer periphery of the side surface of. The sealing material 2 is injected into the recess 11, but the thickness of the sealing material 2 is set to be smaller than the thickness of the ceramic substrate 3. In this case, the thickness of the sealing material 2 before mounting the ceramic substrate 3 is about 0.3 mm. The ceramic substrate 3 is mounted on the sealing material 2, and the entire back surface of the substrate 3 and a part of the side surface of the substrate 3 are covered with the sealing material 2. The recess 11 is formed in a metal mold.
【００１１】 次に本例の作用を説明する。 放熱板１の凹部１１内に液体状のシール材２を注入し、更に作業者がセラミッ ク基板３をこの注入されたシール材２の上に載せる。シール材２の厚さは大きく （量が多い）、後は手で基板３を押さずとも、自然に基板３の重みによって、基 板３はある程度の厚みまで沈みこむ（シール材２の粘性は比較的大きいので基板 ３は凹部１１底面まで完全には沈まない）。これによって、基板３の裏面は完全 にシール材２に覆われることになる。尚、この基板３の沈みによって、シール材 ２は上昇するが、シール材２の粘性により、その上昇度は微小であって、基板３ 上にまでシール材２が覆うことはない。Next, the operation of this example will be described. The liquid sealing material 2 is injected into the concave portion 11 of the heat dissipation plate 1, and an operator places the ceramic substrate 3 on the injected sealing material 2. The thickness of the sealing material 2 is large (the amount is large), and thereafter, even if the substrate 3 is not pushed by hand, the weight of the substrate 3 naturally causes the substrate 3 to sink to a certain thickness (the viscosity of the sealing material 2 is Since the substrate 3 is relatively large, it does not completely sink to the bottom of the recess 11. As a result, the back surface of the substrate 3 is completely covered with the sealing material 2. Although the sealant 2 rises due to the sinking of the substrate 3, the degree of increase is small due to the viscosity of the sealant 2 and the sealant 2 does not cover the substrate 3 as well.
【００１２】 シール材２の量は多く、シール材２が側方に流れようとするが、凹部１１の側 壁１２によって、これ以上シール材２が側方、即ちポスト５側へ流れ込むことは ない。その上、ポスト５は凹部１１の段差により、シール材２の上面よりも上方 に配置されているので、ポスト５上をシール材２が覆うことはない。 またシール材２は液体であるので、その上に搭載されている基板３は流動し、 左右に移動しようとするが、この側壁１２によってこれ以上基板３が側方に移動 することはなく、基板の位置決めが行い易くなる。The amount of the sealing material 2 is large, and the sealing material 2 tends to flow laterally, but the side wall 12 of the recess 11 prevents the sealing material 2 from flowing further to the lateral side, that is, the post 5 side. . Moreover, since the post 5 is arranged above the upper surface of the sealing material 2 due to the step of the recess 11, the sealing material 2 does not cover the post 5. Further, since the sealing material 2 is a liquid, the substrate 3 mounted on the sealing material 2 flows and tries to move to the left or right, but the side wall 12 does not move the substrate 3 further to the side. Will be easier to position.
【００１３】 このように、基板と放熱板間の空間をなくすことができ、放熱性の向上や基板 の剥がれ等の防止図ることができる。更にシール材２の量は多くなるが、凹部の 設置により、シール材２の流動を防止することができ、ポスト等の基板の外部素 子をシール材が覆ってしまうことを防止できる。 尚、この基板３を搭載した後は放熱板全体を加熱してシール材を熱硬化させ、 ランド４とポスト５とをワイヤボンディングにより電気接続する。In this way, the space between the substrate and the heat sink can be eliminated, and the heat dissipation can be improved and the substrate can be prevented from peeling off. Furthermore, although the amount of the sealing material 2 increases, the flow of the sealing material 2 can be prevented by installing the concave portion, and the sealing material can be prevented from covering the external elements of the substrate such as posts. After mounting the substrate 3, the entire radiator plate is heated to thermally cure the sealing material, and the land 4 and the post 5 are electrically connected by wire bonding.
【００１４】 図２（ａ）は本考案の第二実施例を示す、基板を収めた放熱板の断面図である 。尚、図１と同等なものには同一符号を付し、その説明を省略する。図１の例と 異なるのは、図１のように放熱板１に凹部１１を設けるのではなく、セラミック 基板３の側面周囲を取り囲む凸状の外壁部１３（壁部）を設けたことである。尚 、本例の放熱板の上面図を図２（ｂ）に示しておく。FIG. 2A is a cross-sectional view of a heat sink containing a substrate, showing a second embodiment of the present invention. The same parts as those in FIG. 1 are designated by the same reference numerals and the description thereof will be omitted. The difference from the example of FIG. 1 is that the heat dissipation plate 1 is not provided with the concave portion 11 as shown in FIG. 1, but is provided with a convex outer wall portion 13 (wall portion) surrounding the side surface periphery of the ceramic substrate 3. . A top view of the heat sink of this example is shown in FIG. 2 (b).
【００１５】 本例の外壁部１３も図１と同じく、その外壁部１３の高さは図１の凹部１１の 厚さと同じである。またシール材２の量も図１と同じとする。 以上の構成により、本例においても、シール材２の厚さのある分（量が多い分 ）セラミック基板３の裏面全面がシール材２に接触する。またシール材２がポス ト５に流れようとするが、外壁部１３により、シール材２はこれ以上側方、即ち ポスト５側へ流れ込むことはない。The outer wall portion 13 of the present example also has the same height as the outer wall portion 13 of FIG. 1 as the thickness of the concave portion 11 of FIG. The amount of the sealing material 2 is also the same as in FIG. With the above configuration, also in this example, the entire back surface of the ceramic substrate 3 is in contact with the sealing material 2 due to the thickness (the amount is large) of the sealing material 2. Further, the sealing material 2 tries to flow into the post 5, but the outer wall portion 13 prevents the sealing material 2 from flowing further to the side, that is, the post 5 side.
【００１６】 図３は本考案の第三実施例を示す、基板を収めた放熱板の断面図である。尚、 図１と同等なものには同一符号を付した。本例では基板の固定に両面基板を適用 した場合を示すものである。 両面基板３１の裏面には電子部品８１が搭載されているが、この電子部品８１ と表面の電子部品８との電気的接続はスルーホール（図示せぬ）にて基板内部で 行われる。FIG. 3 is a cross-sectional view of a heat sink containing a substrate showing a third embodiment of the present invention. The same components as those in FIG. 1 are designated by the same reference numerals. In this example, a double-sided board is used for fixing the board. An electronic component 81 is mounted on the back surface of the double-sided substrate 31, and electrical connection between the electronic component 81 and the electronic component 8 on the front surface is made inside the substrate through through holes (not shown).
【００１７】 本例では図１と同様、放熱板１に凹部１１を設けて、シール材２を厚く（深く ）することができるので、基板裏面は完全にシール材２と接触する。しかも基板 の裏面と凹部１１の底面とに間隔（余裕）を持たせることができる。従って、前 記間隔がある分、基板裏面に電子部品８１を搭載することができる。またシール 材２を厚くすればする程、基板の裏面と凹部１１の底面との間隔を大きくするこ とができる。In this example, as in FIG. 1, since the heat sink 1 is provided with the recess 11 to make the sealing material 2 thick (deep), the back surface of the substrate is completely in contact with the sealing material 2. Moreover, a space (margin) can be provided between the back surface of the substrate and the bottom surface of the recess 11. Therefore, the electronic component 81 can be mounted on the back surface of the substrate due to the above-mentioned spacing. Also, the thicker the sealing material 2 is, the larger the distance between the back surface of the substrate and the bottom surface of the recess 11 can be.
【００１８】 これにより、両面基板に対しても放熱板１への固定を可能にすることができる 。この両面基板の固定は、第二実施例の外壁部１３を設けるものにおいても可能 である。 しかしながら、作業者が基板３１をシール材２に載せる際に、そのまま基板３ １を放熱板底面に対して押し込んでしまった場合、基板３１が沈み、基板裏面の 電子部品８１が凹部底面に当接してしまうことになる。このようになると、作業 者の押圧力によって電子部品８１が破損してしまう。This makes it possible to fix the double-sided board to the heat sink 1. This fixing of the double-sided board is also possible in the case where the outer wall portion 13 of the second embodiment is provided. However, if the operator pushes the substrate 31 into the bottom surface of the heat dissipation plate when placing the substrate 31 on the sealing material 2, the substrate 31 sinks and the electronic component 81 on the back surface of the substrate abuts on the bottom surface of the recess. Will be lost. If this happens, the electronic component 81 will be damaged by the pressing force of the operator.
【００１９】 本例ではこれを防止するために、基板３１に対する突起１１１を凹部１１の底 面に設けている。この突起１１１は、基板３１裏面の部品が搭載されていない部 分と対向する場所（２箇所）に設置される。そしてこの突起１１１の高さは、基 板裏面に搭載されている電子部品の中で最も高さの大きい部品の高さよりも少な くとも大きいように設定される。従って、作業者が基板３１を放熱板１に対して 押し込んでしまった場合、基板裏面の電子部品８１が凹部底面に当接しようとす るが、基板裏面と突起１１１とが当接するので、基板３１はこれ以上下方には移 動せず、電子部品８１は凹部底面と接触することはなく、部品の破損を防止する ことができる。In this example, in order to prevent this, the projection 111 for the substrate 31 is provided on the bottom surface of the recess 11. The protrusions 111 are installed at the locations (two locations) facing the parts on the back surface of the substrate 31 where the components are not mounted. The height of the protrusion 111 is set to be at least larger than the height of the largest component among the electronic components mounted on the back surface of the substrate. Therefore, when the operator pushes the board 31 against the heat sink 1, the electronic component 81 on the back surface of the board tries to contact the bottom surface of the recess, but the back surface of the board and the projection 111 contact each other. 31 does not move further downward, and the electronic component 81 does not come into contact with the bottom surface of the recess, so that damage to the component can be prevented.
【００２０】 尚、本例においては突起を凹部の底面に設けたが、これに限らず、第二実施例 で示した放熱板の底面、すなわち、基板と対向する放熱板自体の底面に設けても よい。 更に各実施例においては、基板を固定するものとして放熱板を例にしているが 、放熱板に限らず、電子制御回路のケース（筐体）にも適用できる。In this example, the projection is provided on the bottom surface of the recess, but the present invention is not limited to this, and it may be provided on the bottom surface of the heat dissipation plate shown in the second embodiment, that is, the bottom surface of the heat dissipation plate itself facing the substrate. Good too. Further, in each of the embodiments, the heat sink is used as an example for fixing the substrate, but the invention is not limited to the heat sink and can be applied to the case (housing) of the electronic control circuit.
【００２１】[0021]
以上、本考案によれば、放熱性の向上や基板の剥がれ等の防止図ることができ る。これと共に樹脂の基板外への流動を防止することができ、ポスト等の基板外 の外部素子をシール材が覆ってしまうことを防止できる。また両面基板搭載時に 発生する電子部品の破損も防止できる。 As described above, according to the present invention, it is possible to improve heat dissipation and prevent the substrate from peeling off. At the same time, it is possible to prevent the resin from flowing out of the substrate and prevent the sealing material from covering the external elements such as posts outside the substrate. In addition, it is possible to prevent damage to electronic components that occurs when mounting a double-sided board.
【図１】本考案の第一実施例を示す、基板を収めた放熱
板の断面図である。FIG. 1 is a cross-sectional view of a heat sink containing a substrate according to a first embodiment of the present invention.
【図２】本考案の第二実施例を示し、（ａ）は基板を収
めた放熱板の断面図、（ｂ）はその上面図である。2A and 2B show a second embodiment of the present invention, wherein FIG. 2A is a sectional view of a heat sink containing a substrate, and FIG. 2B is a top view thereof.
【図３】本考案の三実施例を示す、基板を収めた放熱板
の断面図である。FIG. 3 is a cross-sectional view of a heat sink containing a substrate according to a third embodiment of the present invention.
【図４】従来例を示す、基板を収めた放熱板の断面図で
ある。FIG. 4 is a cross-sectional view of a heat sink containing a substrate, showing a conventional example.
１・・・放熱板 ２・・・シール材 ３・・・基板 １１・・・凹部 １２・・・側壁 １１１・・突起 DESCRIPTION OF SYMBOLS 1 ... Heat sink 2 ... Seal material 3 ... Substrate 11 ... Recess 12 ... Side wall 111 ...
Claims (3)
の固定構造において、前記筐体に前記基板の側面周囲を
囲う壁部を設け、該壁部内に前記樹脂を注入し、前記基
板を前記樹脂上に搭載したことを特徴とする基板の固定
構造。1. A substrate fixing structure in which a substrate is adhered and fixed to a housing by a resin, a wall portion surrounding a side surface of the substrate is provided in the housing, and the resin is injected into the wall portion to fix the substrate. A structure for fixing a substrate, which is mounted on the resin.
側壁からなることを特徴とする請求項１記載の基板の固
定構造。2. The fixing structure for a substrate according to claim 1, wherein the wall portion comprises a side wall of a recess formed in the housing.
の固定構造において、前記筐体に前記基板の側面周囲を
囲う壁部と、該壁部内における、前記基板と対向する前
記筐体の底面に、前記基板の前記底面と対向する面に搭
載された電子部品の高さよりも少なくとも大きい高さを
持つ突起を設け、該壁部内に前記樹脂を注入し、前記基
板を前記樹脂上に搭載したことを特徴とする基板の固定
構造。3. A substrate fixing structure in which a substrate is adhered and fixed to a housing with a resin, wherein a wall portion surrounding a side surface of the substrate is provided in the housing, and the housing in the wall portion faces the substrate. The bottom surface is provided with a protrusion having a height at least larger than the height of the electronic component mounted on the surface of the substrate facing the bottom surface, and the resin is injected into the wall portion to mount the substrate on the resin. A structure for fixing a substrate, characterized in that
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP060741U JPH0623254U (en) | 1992-08-28 | 1992-08-28 | PCB fixing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP060741U JPH0623254U (en) | 1992-08-28 | 1992-08-28 | PCB fixing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0623254U true JPH0623254U (en) | 1994-03-25 |
Family
ID=13150994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP060741U Withdrawn JPH0623254U (en) | 1992-08-28 | 1992-08-28 | PCB fixing structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0623254U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003289191A (en) * | 2002-03-28 | 2003-10-10 | Denso Corp | Electronic control device |
| JP2007180141A (en) * | 2005-12-27 | 2007-07-12 | Nippon Seiki Co Ltd | Display apparatus |
| JP2012084708A (en) * | 2010-10-13 | 2012-04-26 | Mitsubishi Electric Corp | Semiconductor device |
| JP2016096263A (en) * | 2014-11-14 | 2016-05-26 | 三菱電機株式会社 | Power semiconductor device and method of manufacturing the same, and insulation substrate part |
-
1992
- 1992-08-28 JP JP060741U patent/JPH0623254U/en not_active Withdrawn
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003289191A (en) * | 2002-03-28 | 2003-10-10 | Denso Corp | Electronic control device |
| US7031165B2 (en) | 2002-03-28 | 2006-04-18 | Denso Corporation | Electronic control unit |
| JP2007180141A (en) * | 2005-12-27 | 2007-07-12 | Nippon Seiki Co Ltd | Display apparatus |
| JP4706839B2 (en) * | 2005-12-27 | 2011-06-22 | 日本精機株式会社 | Display device |
| JP2012084708A (en) * | 2010-10-13 | 2012-04-26 | Mitsubishi Electric Corp | Semiconductor device |
| JP2016096263A (en) * | 2014-11-14 | 2016-05-26 | 三菱電機株式会社 | Power semiconductor device and method of manufacturing the same, and insulation substrate part |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
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