JP3693450B2 - Solid-state image sensor device - Google Patents

Solid-state image sensor device Download PDF

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Publication number
JP3693450B2
JP3693450B2 JP05293997A JP5293997A JP3693450B2 JP 3693450 B2 JP3693450 B2 JP 3693450B2 JP 05293997 A JP05293997 A JP 05293997A JP 5293997 A JP5293997 A JP 5293997A JP 3693450 B2 JP3693450 B2 JP 3693450B2
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Prior art keywords
image sensor
solid
substrate
state image
hole electrode
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JP05293997A
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JPH10256410A (en
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哲也 赤崎
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株式会社シチズン電子
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Description

【０００１】
【発明の属する技術分野】
本発明は、固体イメージセンサ装置に係り、特にパッケージの下面に設けた電極部分又は側面のスルーホール電極をマザーボードに直接半田等で固着する表面実装型タイプの固体イメージセンサ装置に関する。
【０００２】
【従来の技術】
本発明者は、表面実装型の固体イメージセンサ装置として図７及び図８に示したものを提案している（特願平８−１２９６９８号）。これは、長手方向の両側面に沿ってスルーホール電極２が形成された矩形状の絶縁基板３と、絶縁基板３の上面周縁に接着固定されたモールド枠４とで構成された箱形のパッケージ１の内部に固体イメージセンサチップ５をダイボンドし、この固体イメージセンサチップ５と絶縁基板３の上面に形成されたリード電極６とをボンディングワイヤ７によって接続すると共に、モールド枠４の上面に透明カバー８を被せてパッケージ１の内部を封止したものである。このように構成された固体イメージセンサ装置は、図８に示したように、マザーボード９の上にパッケージ１の下面を直接載置し、マザーボード電極１０ａ，１０ｂに両側面のスルーホール電極２を半田付けすることで実装される。
【０００３】
【発明が解決しようとする課題】
しかしながら、上記従来の固体イメージセンサ装置にあっては、絶縁基板３とモールド枠４とが同じ外形形状をしており、スルーホール電極２の上方にモールド枠４の下面が被さっているために、モールド枠４の下面に接着剤を塗布して絶縁基板３の上面に載置し、モールド枠４の上方向から加圧しながらキュア炉で加熱した場合に、図９及び図１０に示したように、モールド枠４の下面に塗布した接着剤１１がスルーホール電極２の周囲から漏れ出してスルーホール電極２内に流れ込んでしまい、スルーホール電極２の表面に付着したまま熱硬化してしまうことがあった。
【０００４】
そして、このようにスルーホール電極２の表面に接着剤１１が付着した状態で固体イメージセンサ装置をマザーボード９上に実装してしまうと、図１０に示したように、接着剤１１によって半田１２の濡れ性が妨げられて十分な高さ位置まで半田１２がせり上がらず、十分な接着強度が得られないという問題があった。そのため、従来にあっては接着力の信頼性を確保するために、パッケージングした後に、スルーホール電極２の表面に接着剤１１が付着しているか否かを一つ一つ確認し、付着している場合にはスルーホール電極２の表面から接着剤１１を剥がす必要があった。
【０００５】
そこで、本発明は、モールド枠を絶縁基板に接着する際に、モールド枠の下面に塗布した接着剤がスルーホール電極内に流れ出るのを防止して、信頼性の向上を図ると共に、後処理の面倒を回避することを目的とする。
【０００６】
【課題を解決するための手段】
上記課題を解決するために、本発明の請求項１に係る固体イメージセンサ装置は、両側面に沿って複数のスルーホール電極が形成された矩形状の基板と、この基板と同じ大きさの外形形状であって、前記スルーホール電極の上方を覆うようにして基板の上面に載置され下面が接着固定されるモールド枠とでパッケージを構成してなる固体イメージセンサ装置において、前記モールド枠の下面両側部には前記スルーホール電極に沿って長溝が設けられ、この長溝によって前記スルーホール電極の上方に空隙が形成され、この空隙内の基板の上面に設けられた棚部にスルーホール電極の上端を基板の上面から突出させた湾曲状の凸壁が設けられることを特徴とする。
【０００７】
また、本発明の請求項２に係る固体イメージセンサ装置は、両側面に沿って複数のスルーホール電極が形成された矩形状の基板と、この基板と同じ大きさの外形形状であって、前記スルーホール電極の上方を覆うようにして基板の上面に載置され下面が接着固定されるモールド枠とでパッケージを構成してなる固体イメージセンサ装置において、前記モールド枠の下面両側部には前記各スルーホール電極毎に仕切られた溝が設けられ、この溝によって前記スルーホール電極の上方にはスルーホール電極毎に仕切られた空隙が形成され、この空隙内の基板の上面に棚部が設けられることを特徴とする。
【０００８】
更に、本発明の請求項３に係る固体イメージセンサ装置は、前記棚部には、各スルーホール電極の上端を基板の上面から突出させた湾曲状の凸壁が設けられることを特徴とする。
【０００９】
【発明の実施の形態】
以下、添付図面に基づいて本発明に係る固体イメージセンサ装置の実施例を詳細に説明する。図１乃至図５に示した本発明の固体イメージセンサ装置は、従来例と同様、両側面に沿ってスルーホール電極２２が形成された矩形状の絶縁基板２３と、その上面周囲に接着固定されたモールド枠２４とでパッケージ２１を構成している。そして、パッケージ２１の内部には固体イメージセンサチップ２５がダイボンドされ、この固体イメージセンサチップ２５と絶縁基板２３の上面に形成されたリード電極２６とがボンディングワイヤ２７によって接続されると共に、モールド枠２４の上面には内部を封止する透明カバー２８が被せられている。
【００１０】
上記実施例におけるモールド枠２４は、絶縁基板２３と同じ大きさの外形形状をしているが、下面の両側部には絶縁基板２３のスルーホール電極２２に沿って長溝２９が形成されている。この長溝２９は、下面の両側角部を長手方向に沿って断面Ｌ形に切り欠いたもので、絶縁基板２３の上面にモールド枠２４を載置した時に、スルーホール電極２２の上方に空隙を形成する。即ち、図４及び図５に示したように、モールド枠２４に長溝２９を形成したことで、モールド枠２４を絶縁基板２３の上面に載置した時に、長溝２９の側壁２９ａと上壁２９ｂとで絶縁基板２３のスルーホール電極２２の上方に空隙を形成することになり、絶縁基板２３の上面にはスルーホール電極２２に沿って細長い棚部３０が形成されることになる。また、この棚部３０には各スルーホール電極２２の上端が２０〜５０μｍ程度突出して湾曲状の凸壁３１が形成され、この凸壁３１と絶縁基板２３上のリード電極２６とが接続されている。
【００１１】
なお、本実施例では、長溝２９の断面形状をＬ字状に形成してあるが、スルーホール電極２２の上方に所定の空隙が設けられるものであれば、上記実施例の形状に限定されない。また、上記実施例ではスルーホール電極２２に沿って長溝２９を形成しているが、図６に示したように、各スルーホール電極２２に対応した位置で、モールド枠２４の下面にスルーホール電極２２毎に区切られた溝３２を設けることによって、スルーホール電極２２の上方に空隙を形成しても良く、この場合にはモールド枠２４の下面の接着面積をより多く確保することができる。
【００１２】
従って、絶縁基板２３の上面にモールド枠２４を載置して固定する場合に、モールド枠２４の上方から加圧するとモールド枠２４の下面に塗布してある流動性の接着剤３３がモールド枠２４の下面から漏れ出すおそれがあるが、図４及び図５に示したように、漏れ出した接着剤３３は絶縁基板２３の棚部３０にはみ出して長溝２９内に溜まるだけでスルーホール電極２２には到達しない。また、仮に棚部３０にはみ出したとしても凸壁３１に遮られて、スルーホール電極２２内への流れ込みが妨げられる。更に、この実施例ではモールド枠２４に設けられた長溝２９の側壁２９ａと上壁２９ｂには接着剤３３が塗布されないので、その点でも空隙内に溜まる接着剤３３の量が少なくて済む。
【００１３】
それ故、上述のような構成からなるパッケージ２１にあっては、側面のスルーホール電極２２の表面に接着剤３３が付着するといったことがないので、図５に示したように、マザーボード３４上に固体イメージセンサ装置を実装する場合にも、従来のようなスルーホール電極２２の表面から接着剤３３を剥がすための工程が不要となる他、半田３５がスルーホール電極２２の表面を濡らしてせり上がり、スルーホール電極２２の上部まで盛り上がってしっかりと固着される。
【００１４】
【発明の効果】
以上説明したように、本発明に係る固体イメージセンサ装置によれば、基板の両側面に形成されたスルーホール電極に沿って、その上方に位置するモールド枠の下面両側部に切欠部を形成し、スルーホール電極に沿った基板の上面とモールド枠との間に空隙を設けたので、スルーホール電極とモールド枠の接着面とが接触することがなく、結果的にモールド枠の下面に塗布した接着剤がスルーホール電極内に流れ出るといったことがないため、基板とモールド枠とをパッケージングする際の不良品の発生をなくすことができ、信頼性の向上と共にスルーホール電極の表面に付着した接着剤を剥がすといった煩わしい工程も回避することができた。
【図面の簡単な説明】
【図１】本発明に係る固体イメージセンサ装置の一実施例を示す斜視図である。
【図２】上記固体イメージセンサ装置の分解斜視図である。
【図３】図１のＡ−Ａ線断面図である。
【図４】本発明に係る固体イメージセンサ装置のスルーホール電極付近の拡大斜視図である。
【図５】本発明に係る固体イメージセンサ装置をマザーボードに実装した時の、上記図４のＢ−Ｂ線断面図である。
【図６】モールド枠に形成した切欠部の他の実施例を示す図４と同様の斜視図である。
【図７】従来の固体イメージセンサ装置の一例を示す斜視図である。
【図８】上記図７のＣ−Ｃ線断面図である。
【図９】従来の固体イメージセンサ装置のスルーホール電極付近の拡大斜視図である。
【図１０】従来の固体イメージセンサ装置をマザーボードに実装した時の、上記図９のＤ−Ｄ線断面図である。
【符号の説明】
２１ パッケージ
２２ スルーホール電極
２３ 絶縁基板
２４ モールド枠
２９ 長溝（切欠部）
３２ 溝（切欠部）[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a solid-state image sensor device, and more particularly to a surface-mount type solid-state image sensor device in which an electrode portion provided on a lower surface of a package or a through-hole electrode on a side surface is directly fixed to a mother board with solder or the like.
[0002]
[Prior art]
The present inventor has proposed the surface-mount type solid-state image sensor device shown in FIGS. 7 and 8 (Japanese Patent Application No. 8-129698). This is a box-shaped package composed of a rectangular insulating substrate 3 in which through-hole electrodes 2 are formed along both side surfaces in the longitudinal direction, and a mold frame 4 that is bonded and fixed to the periphery of the upper surface of the insulating substrate 3. 1, a solid image sensor chip 5 is die-bonded, and the solid image sensor chip 5 and a lead electrode 6 formed on the upper surface of the insulating substrate 3 are connected by a bonding wire 7, and a transparent cover is formed on the upper surface of the mold frame 4. 8, the inside of the package 1 is sealed. As shown in FIG. 8, the solid-state image sensor device configured in this way places the lower surface of the package 1 directly on the mother board 9, and solders the through-hole electrodes 2 on both sides to the mother board electrodes 10a and 10b. It is implemented by attaching.
[0003]
[Problems to be solved by the invention]
However, in the above-described conventional solid-state image sensor device, the insulating substrate 3 and the mold frame 4 have the same outer shape, and the lower surface of the mold frame 4 covers the through-hole electrode 2. As shown in FIG. 9 and FIG. 10, when an adhesive is applied to the lower surface of the mold frame 4 and placed on the upper surface of the insulating substrate 3 and heated in a curing furnace while pressing from above the mold frame 4. The adhesive 11 applied to the lower surface of the mold frame 4 leaks from the periphery of the through-hole electrode 2 and flows into the through-hole electrode 2, and is thermally cured while adhering to the surface of the through-hole electrode 2. there were.
[0004]
Then, when the solid-state image sensor device is mounted on the mother board 9 with the adhesive 11 attached to the surface of the through-hole electrode 2 as described above, as shown in FIG. There was a problem that the wettability was hindered and the solder 12 did not rise to a sufficiently high position, and sufficient adhesive strength could not be obtained. Therefore, in the past, in order to ensure the reliability of the adhesive force, after packaging, it is confirmed one by one whether or not the adhesive 11 is adhered to the surface of the through-hole electrode 2 and adhered. In such a case, it was necessary to peel off the adhesive 11 from the surface of the through-hole electrode 2.
[0005]
Therefore, the present invention prevents the adhesive applied to the lower surface of the mold frame from flowing out into the through-hole electrode when bonding the mold frame to the insulating substrate, thereby improving reliability and performing post-processing. The purpose is to avoid trouble.
[0006]
[Means for Solving the Problems]
In order to solve the above problems, a solid-state image sensor device according to claim 1 of the present invention includes a rectangular substrate having a plurality of through-hole electrodes formed along both side surfaces, and an outer shape having the same size as the substrate. In a solid-state image sensor device having a shape and a package comprising a mold frame which is placed on the upper surface of the substrate so as to cover the upper part of the through-hole electrode and whose lower surface is bonded and fixed , the lower surface of the mold frame On both sides, a long groove is provided along the through-hole electrode, and a gap is formed above the through-hole electrode by the long groove. A curved convex wall is provided by projecting from the upper surface of the substrate .
[0007]
According to a second aspect of the present invention, there is provided a solid-state image sensor device having a rectangular substrate in which a plurality of through-hole electrodes are formed along both side surfaces, and an outer shape having the same size as the substrate. In a solid-state image sensor device comprising a mold frame which is placed on the upper surface of the substrate so as to cover the upper part of the through-hole electrode and whose lower surface is adhesively fixed, A groove partitioned for each through-hole electrode is provided, and by this groove, a space partitioned for each through-hole electrode is formed above the through-hole electrode, and a shelf is provided on the upper surface of the substrate in the space. It is characterized by that.
[0008]
Furthermore, the solid-state image sensor device according to claim 3 of the present invention, the shelf is characterized Rukoto curved convex wall is provided which projects the top end of the through-hole electrodes from the top surface of the substrate .
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the solid-state image sensor device according to the present invention will be described in detail with reference to the accompanying drawings. The solid-state image sensor device of the present invention shown in FIGS. 1 to 5 is bonded and fixed around a rectangular insulating substrate 23 in which through-hole electrodes 22 are formed along both side surfaces, as in the conventional example. The package 21 is constituted by the mold frame 24. A solid-state image sensor chip 25 is die-bonded inside the package 21, and the solid-state image sensor chip 25 and a lead electrode 26 formed on the upper surface of the insulating substrate 23 are connected by a bonding wire 27 and a mold frame 24. A transparent cover 28 for sealing the inside is covered on the upper surface of the cover.
[0010]
The mold frame 24 in the above embodiment has the same outer shape as the insulating substrate 23, but long grooves 29 are formed along the through-hole electrodes 22 of the insulating substrate 23 on both sides of the lower surface. The long groove 29 is formed by notching both side corners of the lower surface along the longitudinal direction into an L-shaped cross section. When the mold frame 24 is placed on the upper surface of the insulating substrate 23, a gap is formed above the through-hole electrode 22. Form. That is, as shown in FIGS. 4 and 5, by forming the long groove 29 in the mold frame 24, when the mold frame 24 is placed on the upper surface of the insulating substrate 23, the side wall 29a and the upper wall 29b of the long groove 29 Thus, a gap is formed above the through-hole electrode 22 of the insulating substrate 23, and an elongated shelf 30 is formed on the upper surface of the insulating substrate 23 along the through-hole electrode 22. In addition, the shelf 30 has a curved convex wall 31 projecting from the upper end of each through-hole electrode 22 by about 20 to 50 μm, and the convex wall 31 and the lead electrode 26 on the insulating substrate 23 are connected. Yes.
[0011]
In the present embodiment, the cross-sectional shape of the long groove 29 is formed in an L shape. However, the shape is not limited to the shape of the above embodiment as long as a predetermined gap is provided above the through-hole electrode 22. In the above embodiment, the long groove 29 is formed along the through-hole electrode 22, but as shown in FIG. 6, the through-hole electrode is formed on the lower surface of the mold frame 24 at a position corresponding to each through-hole electrode 22. By providing the groove 32 divided every 22, a gap may be formed above the through-hole electrode 22, and in this case, a larger bonding area of the lower surface of the mold frame 24 can be secured.
[0012]
Therefore, when the mold frame 24 is placed and fixed on the upper surface of the insulating substrate 23, the fluid adhesive 33 applied to the lower surface of the mold frame 24 is applied to the lower surface of the mold frame 24 when pressed from above the mold frame 24. 4 and FIG. 5, the leaked adhesive 33 protrudes into the shelf portion 30 of the insulating substrate 23 and accumulates in the long groove 29 to form the through-hole electrode 22. Will not reach. Even if it protrudes from the shelf 30, it is blocked by the convex wall 31, and the flow into the through-hole electrode 22 is prevented. Furthermore, in this embodiment, since the adhesive 33 is not applied to the side wall 29a and the upper wall 29b of the long groove 29 provided in the mold frame 24, the amount of the adhesive 33 that accumulates in the gap can be reduced.
[0013]
Therefore, in the package 21 having the above-described structure, the adhesive 33 does not adhere to the surface of the through-hole electrode 22 on the side surface. Even when a solid-state image sensor device is mounted, a conventional process for peeling the adhesive 33 from the surface of the through-hole electrode 22 is not required, and the solder 35 wets the surface of the through-hole electrode 22 and rises. The top of the through-hole electrode 22 rises and is firmly fixed.
[0014]
【The invention's effect】
As described above, according to the solid-state image sensor device according to the present invention, the notch portions are formed on both sides of the lower surface of the mold frame located above the through-hole electrodes formed on both sides of the substrate. Since the air gap is provided between the upper surface of the substrate along the through-hole electrode and the mold frame, the through-hole electrode and the adhesive surface of the mold frame do not come into contact with each other, and as a result, it is applied to the lower surface of the mold frame. Since the adhesive does not flow into the through-hole electrode, it is possible to eliminate the occurrence of defective products when packaging the substrate and the mold frame, and to improve the reliability and adhere to the surface of the through-hole electrode. The troublesome process of peeling off the agent could also be avoided.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an embodiment of a solid-state image sensor device according to the present invention.
FIG. 2 is an exploded perspective view of the solid-state image sensor device.
FIG. 3 is a cross-sectional view taken along line AA in FIG.
FIG. 4 is an enlarged perspective view of the vicinity of the through-hole electrode of the solid-state image sensor device according to the present invention.
5 is a cross-sectional view taken along the line BB of FIG. 4 when the solid-state image sensor device according to the present invention is mounted on a mother board.
6 is a perspective view similar to FIG. 4 showing another embodiment of the notch formed in the mold frame. FIG.
FIG. 7 is a perspective view showing an example of a conventional solid-state image sensor device.
8 is a cross-sectional view taken along the line CC of FIG.
FIG. 9 is an enlarged perspective view of the vicinity of a through-hole electrode of a conventional solid-state image sensor device.
10 is a cross-sectional view taken along the line DD of FIG. 9 when a conventional solid-state image sensor device is mounted on a mother board.
[Explanation of symbols]
21 Package 22 Through-hole electrode 23 Insulating substrate 24 Mold frame 29 Long groove (notch)
32 groove (notch)

Claims (3)

両側面に沿って複数のスルーホール電極が形成された矩形状の基板と、この基板と同じ大きさの外形形状であって、前記スルーホール電極の上方を覆うようにして基板の上面に載置され下面が接着固定されるモールド枠とでパッケージを構成してなる固体イメージセンサ装置において、
前記モールド枠の下面両側部には前記スルーホール電極に沿って長溝が設けられ、この長溝によって前記スルーホール電極の上方に空隙が形成され、この空隙内の基板の上面に設けられた棚部にスルーホール電極の上端を基板の上面から突出させた湾曲状の凸壁が設けられることを特徴とする固体イメージセンサ装置。A rectangular substrate in which a plurality of through-hole electrodes are formed along both side surfaces, and an outer shape of the same size as the substrate , and is placed on the upper surface of the substrate so as to cover the through-hole electrodes. In a solid-state image sensor device comprising a package with a mold frame whose lower surface is bonded and fixed,
A long groove is provided along the through-hole electrode on both sides of the lower surface of the mold frame, and a gap is formed above the through-hole electrode by the long groove, and a shelf provided on the upper surface of the substrate in the gap is formed. A solid-state image sensor device comprising a curved convex wall having an upper end of a through-hole electrode protruding from an upper surface of a substrate . 両側面に沿って複数のスルーホール電極が形成された矩形状の基板と、この基板と同じ大きさの外形形状であって、前記スルーホール電極の上方を覆うようにして基板の上面に載置され下面が接着固定されるモールド枠とでパッケージを構成してなる固体イメージセンサ装置において、
前記モールド枠の下面両側部には前記各スルーホール電極毎に仕切られた溝が設けられ、この溝によって前記スルーホール電極の上方にはスルーホール電極毎に仕切られた空隙が形成され、この空隙内の基板の上面に棚部が設けられることを特徴とする固体イメージセンサ装置。 A rectangular substrate in which a plurality of through-hole electrodes are formed along both side surfaces, and an outer shape of the same size as the substrate, and is placed on the upper surface of the substrate so as to cover the through-hole electrodes. In a solid-state image sensor device comprising a package with a mold frame whose lower surface is bonded and fixed,
A groove partitioned for each through-hole electrode is provided on both sides of the lower surface of the mold frame, and a space partitioned for each through-hole electrode is formed above the through-hole electrode by the groove. A solid-state image sensor device , wherein a shelf is provided on an upper surface of an inner substrate . 前記棚部には、各スルーホール電極の上端を基板の上面から突出させた湾曲状の凸壁が設けられる請求項２記載の固体イメージセンサ装置。 The solid-state image sensor device according to claim 2, wherein the shelf is provided with a curved convex wall in which an upper end of each through-hole electrode protrudes from an upper surface of the substrate .
JP05293997A 1997-03-07 1997-03-07 Solid-state image sensor device Expired - Fee Related JP3693450B2 (en)

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