JPH0451582A - Hybrid integrated circuit device - Google Patents

Hybrid integrated circuit device

Info

Publication number
JPH0451582A
JPH0451582A JP2161601A JP16160190A JPH0451582A JP H0451582 A JPH0451582 A JP H0451582A JP 2161601 A JP2161601 A JP 2161601A JP 16160190 A JP16160190 A JP 16160190A JP H0451582 A JPH0451582 A JP H0451582A
Authority
JP
Japan
Prior art keywords
electronic
component mounting
parts
bonded
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2161601A
Other languages
Japanese (ja)
Inventor
Hideto Nitta
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Priority to JP2161601A priority Critical patent/JPH0451582A/en
Publication of JPH0451582A publication Critical patent/JPH0451582A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01028Nickel [Ni]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19041Component type being a capacitor
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191Disposition
    • H01L2924/19101Disposition of discrete passive components
    • H01L2924/19105Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Abstract

PURPOSE: To set the heating temperature for a wire bonding process irrespective of the glass transition point of an adhesive and to enhance the bonding strength of a wire-bonded part by a method wherein a reinforcement sheet in which an opening part has been made in a part corresponding to an electronic-component mounting part on a flexible wiring board is bonded to a part around at least the electronic- component mounting part.
CONSTITUTION: The following are bonded and fixed to parts around at least electronic- component mounting parts by using an adhesive 4: a flexible wiring board in which a copper foil is formed and patterned on a polyimide resin film 1, in which a nickel- plated layer and a partially gold-plated layer are formed and which is provided with wiring parts 2; and a reinforcement sheet 6 such as a glass epoxy sheet in which opening parts 5a, 5b are formed in the parts corresponding to the electronic-component mounting parts of the flexible wiring board. Then, a semiconductor chip 7 is die-bonded to the electronic-component mounting part of the opening part 5a; electrodes of the semiconductor chip 7 are wire-bonded and connected to pads formed on the gold-plated layer of the wiring part 2 by using gold wires 8; the opening 5a is filled and covered with a resin body 9. A chip capacitor 10 is soldered and mounted on the wiring part 2 in the electronic-component mounting part of the opening part 5b.
COPYRIGHT: (C)1992,JPO&Japio
JP2161601A 1990-06-20 1990-06-20 Hybrid integrated circuit device Pending JPH0451582A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2161601A JPH0451582A (en) 1990-06-20 1990-06-20 Hybrid integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2161601A JPH0451582A (en) 1990-06-20 1990-06-20 Hybrid integrated circuit device

Publications (1)

Publication Number Publication Date
JPH0451582A true JPH0451582A (en) 1992-02-20

Family

ID=15738258

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2161601A Pending JPH0451582A (en) 1990-06-20 1990-06-20 Hybrid integrated circuit device

Country Status (1)

Country Link
JP (1) JPH0451582A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0607929A2 (en) * 1993-01-19 1994-07-27 Canon Kabushiki Kaisha Flexible printed circuit board and ink jet recording head using the same
EP0594427A3 (en) * 1992-10-21 1995-06-21 Nippon Electric Co A printed circuit board mounted with electric elements thereon.
JPH09283889A (en) * 1996-04-09 1997-10-31 Rohm Co Ltd Reinforcing method of flexible substrate and flexible substrate
JP2008085340A (en) * 2006-09-27 2008-04-10 Samsung Electronics Co Ltd Circuit board for preventing warpage, and method for manufacturing the same
JP2010103516A (en) * 2008-09-29 2010-05-06 Ngk Spark Plug Co Ltd Wiring board with reinforcement
JP2012104557A (en) * 2010-11-08 2012-05-31 Ngk Spark Plug Co Ltd Wiring board with electronic component and manufacturing method of the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6054364B2 (en) * 1979-11-07 1985-11-29 Mitsubishi Metal Corp

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6054364B2 (en) * 1979-11-07 1985-11-29 Mitsubishi Metal Corp

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0594427A3 (en) * 1992-10-21 1995-06-21 Nippon Electric Co A printed circuit board mounted with electric elements thereon.
EP0607929A2 (en) * 1993-01-19 1994-07-27 Canon Kabushiki Kaisha Flexible printed circuit board and ink jet recording head using the same
EP0607929A3 (en) * 1993-01-19 1996-03-13 Canon Kk Flexible printed circuit board and ink jet recording head using the same.
US6328427B1 (en) 1993-01-19 2001-12-11 Canon Kabushiki Kaisha Method of producing a wiring substrate
JPH09283889A (en) * 1996-04-09 1997-10-31 Rohm Co Ltd Reinforcing method of flexible substrate and flexible substrate
JP2008085340A (en) * 2006-09-27 2008-04-10 Samsung Electronics Co Ltd Circuit board for preventing warpage, and method for manufacturing the same
JP2010103516A (en) * 2008-09-29 2010-05-06 Ngk Spark Plug Co Ltd Wiring board with reinforcement
JP2012104557A (en) * 2010-11-08 2012-05-31 Ngk Spark Plug Co Ltd Wiring board with electronic component and manufacturing method of the same

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