JPS55126649U - - Google Patents

Info

Publication number
JPS55126649U
JPS55126649U JP1979026619U JP2661979U JPS55126649U JP S55126649 U JPS55126649 U JP S55126649U JP 1979026619 U JP1979026619 U JP 1979026619U JP 2661979 U JP2661979 U JP 2661979U JP S55126649 U JPS55126649 U JP S55126649U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1979026619U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1979026619U priority Critical patent/JPS55126649U/ja
Publication of JPS55126649U publication Critical patent/JPS55126649U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16152Cap comprising a cavity for hosting the device, e.g. U-shaped cap
JP1979026619U 1979-03-01 1979-03-01 Pending JPS55126649U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1979026619U JPS55126649U (en) 1979-03-01 1979-03-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979026619U JPS55126649U (en) 1979-03-01 1979-03-01

Publications (1)

Publication Number Publication Date
JPS55126649U true JPS55126649U (en) 1980-09-08

Family

ID=28869217

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1979026619U Pending JPS55126649U (en) 1979-03-01 1979-03-01

Country Status (1)

Country Link
JP (1) JPS55126649U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0465451U (en) * 1990-10-18 1992-06-08

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0465451U (en) * 1990-10-18 1992-06-08

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