JPH087639Y2 - Semiconductor module - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a semiconductor module.

[Conventional technology]

Conventionally, a semiconductor module in which a semiconductor chip (semiconductor element) is housed in a package has a structure shown in FIGS. 3 and 4. That is, the copper plate (substrate) 1 to which the semiconductor chip is attached and the frame body 2 are adhered with an adhesive, the inner coating material (insulating resin material) 3 and the mold resin material (insulating resin material) 4 made of gel are enclosed, and the A cover 5 is attached on the top. Further, an electrode plate 6 penetrates the inner coating material 3 and the mold resin material 4 and is taken out to the upper surface of the cover 5 in order to connect the semiconductor chip and the outside. Further, screw holes 7 and 8 for mounting with screws are provided at both ends of the copper plate 1 and the frame body 2.

[Problems to be solved by the device]

However, as shown in FIG. 5, when the copper plate 1 and the frame body 2 are bonded together, the adhesive does not spread evenly, so a gap δ is created between the copper plate 1 and the frame body 2, and this gap is a screw hole. There was a problem that the frame 2 would crack due to the pressure when tightening the screws if it was formed around 7,8.

An object of the present invention is to provide a semiconductor module capable of preventing damage around the screw holes of the frame body due to screw tightening.

[Means for solving the problem]

According to this invention, a semiconductor chip is bonded to an upper surface of the substrate, a substrate having a screw hole, a frame body that is bonded to the substrate so as to surround the semiconductor chip, and has a screw hole, and the semiconductor body inside the frame body. In a semiconductor module comprising an insulating resin material for covering a chip and attached by a screw penetrating the screw hole of the substrate and the screw hole of the frame, the periphery of the screw hole of the substrate or the screw hole of the frame The gist of the invention is a semiconductor module having a protrusion around the periphery of the semiconductor module.

[Action]

When mounting the module, when the substrate and the frame body are bonded via an adhesive, the periphery of the screw hole is closely attached by the protrusion. As a result, the frame body is not damaged even if the substrate and the frame body are tightened with a screw penetrating the screw hole of the substrate body and the screw hole of the frame body.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows a partial cross section of the semiconductor module, and FIG.
The figure shows a section AA of FIG. The external appearance is the same as that in FIG. 3 and the entire cross section is the same as that in FIG. 4, so a detailed description thereof will be omitted, and only the essential parts will be described.

As shown in FIG. 1 and FIG. 2, screw holes 7 and 8 for mounting by screws are formed at both ends of the copper plate 1 and the frame body 2, and an annular shape is formed around the screw hole 7 of the frame body 2. The protrusion 10 is provided. Then, the copper plate 1 with the protrusion 10 sandwiched therebetween.
A screw penetrating through the screw hole 7 and the screw hole 8 of the frame body 2 is arranged, and the semiconductor module is fixed to a predetermined place by this screw.

The assembly procedure of this semiconductor module is shown in Figs.
Explaining with reference to FIG. 4, first, a semiconductor chip is soldered to an insulating plate (not shown) having a wiring pattern, and the semiconductor chip and the wiring pattern are connected by an aluminum wire. Next, the insulating plate is soldered onto the copper plate 1, and the electrode plate 6 in the extended state is soldered to the wiring pattern of the insulating plate. Then, the electrode plate 6 is erected, and an adhesive is applied to the copper plate 1 to form screw holes 7 in the copper plate 1 and screw holes 8 in the frame body 2.
The copper plate 1 and the frame body 2 are adhered to each other at a position where they coincide with each other. At this time, the portion of the frame body 2 provided with the protrusion 10 is in close contact with the copper plate 1 and no gap is formed.

Subsequently, the inner coating material 3 made of gel is injected, and further the mold resin material 4 is injected and cured. Further, after the cover 5 is attached, the tip side of the electrode plate 6 is bent.

Next, the semiconductor module is fixed to a predetermined place (machine base) with a screw penetrating the screw hole 7 of the copper plate 1 and the screw hole 8 of the frame body 2. At this time, pressure is concentrated on the periphery of the screw holes 7 and 8 by tightening the screws, but the protrusion 10
Since the copper plate 1 and the frame body 2 are in close contact with each other in the peripheral portion of the screw hole even if the adhesive is not spread, the cracking of the frame body 2 is prevented even if pressure is applied during screw tightening.

In this way, in this embodiment, since the protrusions 10 are provided around the screw holes 8 of the frame body 2, when the copper plate 1 and the frame body 2 are bonded, even if the adhesive does not spread evenly, Frame 2
Since there is no gap between them and they can be closely attached, cracking of the frame body 2 due to pressure at the time of screwing is prevented. Therefore, a highly reliable semiconductor module can be obtained.

The present invention is not limited to the above embodiment, and a projection may be provided around the screw hole 7 of the copper plate 1, for example. Further, the projections around the screw holes 7 and 8 do not have to be circular, and may have any shape as long as they are provided in a portion where pressure is applied by screw tightening.

[Effect of device]

As described above in detail, according to the present invention, the excellent effect of preventing damage around the screw holes of the frame body due to screw tightening is exhibited.

[Brief description of drawings]

FIG. 1 is a partial sectional view of a semiconductor module of an embodiment, FIG.
1 is a sectional view taken along the line AA of FIG. 1, FIG. 3 is a perspective view of a semiconductor module, FIG. 4 is a partial sectional view of a semiconductor module, and FIG. 5 is a sectional view for explaining a conventional semiconductor module. is there. 1 is a copper plate as a substrate, 2 is a frame, 3 is an inner coating material as an insulating resin material, 4 is a mold resin material as an insulating resin material, 7 is a screw hole, 8 is a screw hole, and 10 is a protrusion.

Claims (1)

[Scope of utility model registration request] 1. A substrate having a semiconductor chip bonded to an upper surface thereof and having a screw hole; a frame body having a screw hole and being bonded to the substrate so as to surround the semiconductor chip; A semiconductor module, comprising: an insulating resin material for covering a semiconductor chip, which is attached by a screw penetrating a screw hole of the substrate and a screw hole of the frame body, in the periphery of the screw hole of the substrate or a screw of the frame body. A semiconductor module with protrusions around the holes.