JPS6176967U - - Google Patents
Info
- Publication number
- JPS6176967U JPS6176967U JP16088584U JP16088584U JPS6176967U JP S6176967 U JPS6176967 U JP S6176967U JP 16088584 U JP16088584 U JP 16088584U JP 16088584 U JP16088584 U JP 16088584U JP S6176967 U JPS6176967 U JP S6176967U
- Authority
- JP
- Japan
- Prior art keywords
- bonding area
- semiconductor device
- inner lead
- uneven
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Description
第１図は本考案の一実施例による半導体装置で
あり、第２図は従来の半導体装置である。なお、
第１図、第２図においてＡは平面図、Ｂはボンデ
イングエリア部の拡大平面図、Ｃはボンデイング
エリア部の拡大断面図である。
１……外部導出リード、２……ボンデイングエ
リア部、１−１……インナーリード部、１−２…
…アウターリード部、３……凹部、４……樹脂封
止部、或はセラミツク封止部。
FIG. 1 shows a semiconductor device according to an embodiment of the present invention, and FIG. 2 shows a conventional semiconductor device. In addition,
In FIGS. 1 and 2, A is a plan view, B is an enlarged plan view of the bonding area, and C is an enlarged sectional view of the bonding area. 1... External lead-out lead, 2... Bonding area section, 1-1... Inner lead section, 1-2...
...Outer lead part, 3...Recessed part, 4...Resin sealing part or ceramic sealing part.
Claims (1)
凹凸状になつていることを特徴とする半導体装置
。 A semiconductor device characterized in that a bonding area surface of an inner lead portion is uneven.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16088584U JPS6176967U (en) | 1984-10-24 | 1984-10-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16088584U JPS6176967U (en) | 1984-10-24 | 1984-10-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6176967U true JPS6176967U (en) | 1986-05-23 |
Family
ID=30718798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16088584U Pending JPS6176967U (en) | 1984-10-24 | 1984-10-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6176967U (en) |
-
1984
- 1984-10-24 JP JP16088584U patent/JPS6176967U/ja active Pending