JPH0463127U - - Google Patents
Info
- Publication number
- JPH0463127U JPH0463127U JP10422490U JP10422490U JPH0463127U JP H0463127 U JPH0463127 U JP H0463127U JP 10422490 U JP10422490 U JP 10422490U JP 10422490 U JP10422490 U JP 10422490U JP H0463127 U JPH0463127 U JP H0463127U
- Authority
- JP
- Japan
- Prior art keywords
- layer ceramic
- ceramic
- laminated
- layer
- shape around
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 19
Landscapes
- Die Bonding (AREA)
Description
第１図は、本考案の一実施例の断面図、第２図
は第１図の第１層セラミツクスの平面図、第３図
は第１図の第２層セラミツクスの平面図、第４図
は第１図の第３層セラミツクスの平面図、第５図
は第１図の第４層セラミツクスの平面図、第６図
は従来型積層セラミツクパツケージの一例の断面
図、第７図は第６図の平面図である。
１……第１層セラミツクス、２……第２層セラ
ミツクス、３……第３層セラミツクス、４……第
４層セラミツクス、５……ダイボンデイング用メ
タライズパターン、６……外部導出用メタライズ
パターン。
FIG. 1 is a sectional view of an embodiment of the present invention, FIG. 2 is a plan view of the first layer ceramic of FIG. 1, FIG. 3 is a plan view of the second layer ceramic of FIG. 1, and FIG. 4 is a plan view of the second layer ceramic of FIG. is a plan view of the third layer ceramic in FIG. 1, FIG. 5 is a plan view of the fourth layer ceramic in FIG. 1, FIG. 6 is a sectional view of an example of a conventional laminated ceramic package, and FIG. FIG. 1... First layer ceramics, 2... Second layer ceramics, 3... Third layer ceramics, 4... Fourth layer ceramics, 5... Metallized pattern for die bonding, 6... Metallized pattern for external lead-out.
Claims (1)
ボンデイング用メタライズパターンを施した底部
の第１層セラミツクスと、該第１層セラミツクス
の上部周辺に壁状に積層された幅の狭い第２層セ
ラミツクスと、該第２層セラミツクス上部に積層
された外部導出用メタライズパターンを施した第
３層セラミツクスとを有することを特徴とするセ
ラミツクパツケージ。 In a laminated ceramic package, a first layer ceramic at the bottom is provided with a metallized pattern for die bonding, a narrow second layer ceramic is laminated in a wall shape around the top of the first layer ceramic, and the second layer ceramic is laminated in a wall shape around the top of the first layer ceramic. 1. A ceramic package comprising: a third layer ceramic laminated on top of the layer ceramic and provided with a metallized pattern for leading to the outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10422490U JPH0463127U (en) | 1990-10-03 | 1990-10-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10422490U JPH0463127U (en) | 1990-10-03 | 1990-10-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0463127U true JPH0463127U (en) | 1992-05-29 |
Family
ID=31849427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10422490U Pending JPH0463127U (en) | 1990-10-03 | 1990-10-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0463127U (en) |
-
1990
- 1990-10-03 JP JP10422490U patent/JPH0463127U/ja active Pending