JPS6221549U - - Google Patents

Info

Publication number
JPS6221549U
JPS6221549U JP11385785U JP11385785U JPS6221549U JP S6221549 U JPS6221549 U JP S6221549U JP 11385785 U JP11385785 U JP 11385785U JP 11385785 U JP11385785 U JP 11385785U JP S6221549 U JPS6221549 U JP S6221549U
Authority
JP
Japan
Prior art keywords
semiconductor die
edge
resin
semiconductor device
bent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11385785U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11385785U priority Critical patent/JPS6221549U/ja
Publication of JPS6221549U publication Critical patent/JPS6221549U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の実施例にかかる樹脂封止形半
導体装置の半導体ダイ近傍の縦断面図、第2図は
従来の樹脂封止形半導体装置の半導体ダイ近傍の
縦断面図である。 1……アイランド、2……半導体ダイ、3……
金属細線、4……リードフレーム、5……封止用
樹脂。
FIG. 1 is a longitudinal cross-sectional view of the vicinity of the semiconductor die of a resin-molded semiconductor device according to an embodiment of the present invention, and FIG. 2 is a longitudinal cross-sectional view of the vicinity of the semiconductor die of a conventional resin-molded semiconductor device. 1...Island, 2...Semiconductor die, 3...
Fine metal wire, 4... Lead frame, 5... Sealing resin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ダイに隣接する側の端縁が折り曲げられ
、かつ該縁端は半導体ダイの主表面より突出した
形状を有することを特徴とするリードを用いた樹
脂封止形半導体装置。
1. A resin-sealed semiconductor device using a lead, characterized in that an edge on a side adjacent to a semiconductor die is bent, and the edge has a shape protruding from the main surface of the semiconductor die.
JP11385785U 1985-07-24 1985-07-24 Pending JPS6221549U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11385785U JPS6221549U (en) 1985-07-24 1985-07-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11385785U JPS6221549U (en) 1985-07-24 1985-07-24

Publications (1)

Publication Number Publication Date
JPS6221549U true JPS6221549U (en) 1987-02-09

Family

ID=30996053

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11385785U Pending JPS6221549U (en) 1985-07-24 1985-07-24

Country Status (1)

Country Link
JP (1) JPS6221549U (en)

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