JPS6240842U - - Google Patents
Info
- Publication number
- JPS6240842U JPS6240842U JP12990785U JP12990785U JPS6240842U JP S6240842 U JPS6240842 U JP S6240842U JP 12990785 U JP12990785 U JP 12990785U JP 12990785 U JP12990785 U JP 12990785U JP S6240842 U JPS6240842 U JP S6240842U
- Authority
- JP
- Japan
- Prior art keywords
- tab
- lead
- interval
- lead frame
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の平面図、第２図は
第１図に示すリードフレームを使用した樹脂封止
型半導体装置の断面図、第３図は第１図における
タブ側面下端部に発生する熱応力とタブとリード
間距離の関係図、第４図は本考案の他の実施例の
平面図である。
１…封止樹脂、２…半導体素子、３…タブ、４
…ボンデイングワイヤ、５…リード。
FIG. 1 is a plan view of an embodiment of the present invention, FIG. 2 is a sectional view of a resin-sealed semiconductor device using the lead frame shown in FIG. 1, and FIG. 3 is the lower end of the tab side surface in FIG. 1. FIG. 4 is a plan view of another embodiment of the present invention. 1... Sealing resin, 2... Semiconductor element, 3... Tab, 4
...Bonding wire, 5...Lead.
Claims (1)
めのタブから形成される半導体装置用リードフレ
ームにおいて、タブとリードの間隔が一定である
かあるいはタブ側面中央部付近のタブとリードの
間隔がタブ側面周辺部のタブとリードの間隔より
短いことを特徴とするリードフレーム。 ２ 少くともタブ側面中央部付近のタブとリード
の間隔が０．３mm以下であることを特徴とする実
用新案登録請求の範囲第１項記載のリードフレー
ム。[Claims for Utility Model Registration] 1. In a lead frame for a semiconductor device formed from an assembly of lead wires and a tab for mounting a semiconductor element, the interval between the tabs and the leads is constant or near the center of the side surface of the tab. A lead frame characterized in that the interval between the tab and the lead is shorter than the interval between the tab and the lead at the periphery of the side surface of the tab. 2. The lead frame according to claim 1, wherein the interval between the tab and the lead at least near the central portion of the side surface of the tab is 0.3 mm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12990785U JPS6240842U (en) | 1985-08-28 | 1985-08-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12990785U JPS6240842U (en) | 1985-08-28 | 1985-08-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6240842U true JPS6240842U (en) | 1987-03-11 |
Family
ID=31026903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12990785U Pending JPS6240842U (en) | 1985-08-28 | 1985-08-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6240842U (en) |
-
1985
- 1985-08-28 JP JP12990785U patent/JPS6240842U/ja active Pending