JPH0276838U - - Google Patents
Info
- Publication number
- JPH0276838U JPH0276838U JP15702888U JP15702888U JPH0276838U JP H0276838 U JPH0276838 U JP H0276838U JP 15702888 U JP15702888 U JP 15702888U JP 15702888 U JP15702888 U JP 15702888U JP H0276838 U JPH0276838 U JP H0276838U
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- protrusion
- lead frame
- mold
- molding device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 2
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案に係る樹脂モールド装置及びリ
ードフレームの要部断面斜視図、第２図は同じく
部分平面図、第３図は同じく縦断面側面図である
。第４図は樹脂封止型半導体装置の全体斜視図、
第５図は従来のリードフレームの平面図、第６図
は従来の樹脂モールド装置及びリードフレームの
要部断面斜視図、第７図は同じく部分平面図、第
８図は同じく縦断側面図、第９図は樹脂封止型半
導体装置の平面図である。
５……外装樹脂材、１１……放熱板、１１……
切欠部、１３……リード、１６……リードフレー
ム、１７……下金型、１７ａ……下キヤビテイ、
１７ｃ……突出部、１８……上金型、１８ａ……
上キヤビテイ、１８ｃ……サブランナ。
FIG. 1 is a sectional perspective view of a main part of a resin molding device and a lead frame according to the present invention, FIG. 2 is a partial plan view, and FIG. 3 is a vertical sectional side view. FIG. 4 is an overall perspective view of a resin-sealed semiconductor device;
FIG. 5 is a plan view of a conventional lead frame, FIG. 6 is a cross-sectional perspective view of main parts of a conventional resin molding device and lead frame, FIG. 7 is a partial plan view, and FIG. 8 is a longitudinal side view, FIG. 9 is a plan view of the resin-sealed semiconductor device. 5... Exterior resin material, 11... Heat sink, 11...
Notch, 13...Lead, 16...Lead frame, 17...Lower mold, 17a...Lower cavity,
17c...Protrusion part, 18...Upper mold, 18a...
Upper cavity, 18c...subrunner.
Claims (1)
フレームを収納配置し、上記放熱板を含む主要部
分をモールドする外装樹脂材が充填されるキヤビ
テイを形成した上下金型を具備する樹脂モールド
装置において、 上下金型の一方に、リードフレームの放熱板間
に設けた切欠部と嵌合する突出部を形成し、他方
の金型に、前記突出部と対向してキヤビテイと連
通してキヤビテイ内に溶融樹脂を供給するサブラ
ンナを凹設したことを特徴とする樹脂モールド装
置。[Scope of Claim for Utility Model Registration] Upper and lower metal plates that house and arrange a band-shaped lead frame in which a heat sink and a lead are integrally formed, and form a cavity that is filled with an exterior resin material that molds the main parts including the heat sink. In a resin molding device equipped with a mold, one of the upper and lower molds is formed with a protrusion that fits into a notch provided between the heat dissipation plates of the lead frame, and the other mold is provided with a protrusion that is opposite to the protrusion. A resin molding device characterized by having a recessed sub-runner that communicates with a cavity and supplies molten resin into the cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15702888U JPH0276838U (en) | 1988-11-30 | 1988-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15702888U JPH0276838U (en) | 1988-11-30 | 1988-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0276838U true JPH0276838U (en) | 1990-06-13 |
Family
ID=31436105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15702888U Pending JPH0276838U (en) | 1988-11-30 | 1988-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0276838U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008258455A (en) * | 2007-04-06 | 2008-10-23 | Citizen Electronics Co Ltd | Light emitting diode |
-
1988
- 1988-11-30 JP JP15702888U patent/JPH0276838U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008258455A (en) * | 2007-04-06 | 2008-10-23 | Citizen Electronics Co Ltd | Light emitting diode |