JPS638130Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a mold for a semiconductor resin sealing device that seals semiconductor elements with resin to protect them.

Semiconductor devices are encapsulated to protect them from the atmosphere and external physical pressure. In general, for encapsulation of semiconductor elements, parts and material costs are low and the shape can be designed freely, so the semiconductor element is held in a mold, the mold is filled with resin material, and after cooling, the molded product is Resin sealing is used to take out the product.

Conventionally, as shown in FIG. 1, a lead frame 1 has been used as a semiconductor resin encapsulation device to perform this type of resin encapsulation. A semiconductor element (not shown) is placed on the island 3 thus formed. Next, this semiconductor element is attached to the inner lead 4.
After the lead frame 1 is connected to the lower mold cavity block 8, the lead frame 1 is attached to the lower mold cavity block 8 so that the positioning holes 5 correspond to the positioning pins 7 of the lower mold 6 shown in FIG. Then, the upper mold cavity block 11 is attached to the lower mold cavity block 8 so that the positioning pin hole 10 of the upper mold 9 shown in FIG. 3 corresponds to the positioning pin 7, and the mold is clamped. After that,
When the resin material is injected from the pot 12, the resin material passes through the pot receiving part 13 and the lunch 14 of the lower mold 6.
Through gate 15, upper and lower mold cavities 1
6,17 is filled. In this way, the semiconductor element is encapsulated with resin by molding a portion of the lead frame 1.

However, in the mold of the conventional semiconductor resin encapsulation device, as shown in FIG. 4, since the gate 15 is formed wide, the lead frame 1 covers part of the hanging lead 2 with the gate when the mold is clamped. It is held between the upper mold and the lower mold with facing the 15 side. Moreover, the gate 15 has an upward slope as it goes from the runner 14 side to the cavity 17 side.
Since the depth of the resin inlet portion 15a of No. 7 is small, the gate 1 of the suspension lead 2 is
There was an inconvenience that air bubbles remained in the portion located on the opposite side of No. 5, and sufficient resin sealing was not performed.

The present invention was developed in view of these circumstances, and has an extremely simple structure in which the resin inlet on the cavity side is formed in a part separated from the suspension lead by using a gate provided on the template. To provide a mold for a semiconductor resin sealing device that allows resin to be filled into a cavity without generating bubbles in a portion of a hanging lead located on the opposite side of a gate. Hereinafter, the configuration and the like will be explained in detail by referring to embodiments shown in the drawings.

FIG. 5 is a perspective view showing the main parts of the mold of the semiconductor resin encapsulation device according to the present invention, and in the figure, reference numeral 21
What is shown by is a part of the lower mold to which the lead frame 1 is mounted, and this lower mold 21 has a pot receiving part (not shown) as in the conventional case, a runner 22 communicating with this pot receiving part, and a gate 2 on this runner 22.
A cavity 24 is provided which communicates with the housing via the cavity 3 . This cavity 24 and the cavity 16 of the upper mold 9 are formed in such a shape that the island 3, which is held from both sides at the center of the lead frame 1 by the suspension lead 2, faces inside when the mold is clamped. There is. Further, the lower mold 21 is provided with positioning pins 25 for positioning the lead frame 1 and the upper mold (not shown). The gate 23 has a funnel shape, that is, the runner 22
The resin injection part 23a on the side is formed to be wide, and as it goes toward the cavity 24 side, the lower mold 21
The resin inlet portion 23b on the side of the cavity 24 is formed to have the narrowest width. Thereby, the gate 23 is positioned at a portion where the resin inlet portion 23b is separated from the suspension lead 2 when the lead frame 1 is attached to the lower mold 21. Further, the gate 23 has a resin inlet portion 23b formed deeply in the thickness direction of the lower mold 21, similar to the resin injection portion 23a.

Therefore, when the resin material is injected from the pot after the lead frame 1 is mounted between the upper mold and the lower mold 21 using the lower mold 21 according to the present invention and the molds are clamped, this resin material will be poured into the pot receiving part, The resin flows through the runner 22, passes through the resin injection part 23a of the gate 23, and is injected into the cavity 24 from the resin inlet part 23b. In this case, since the resin inlet portion 23b of the gate 23 is provided in a part separated from the suspension lead 2, when the resin material passes through the gate 23, it does not come into contact with the suspension lead 2 as in the conventional case. The cavity 24 is filled without generating bubbles.

In addition, in this embodiment, the resin inlet portion 23b on the side of the cavity 24 is narrowly formed in a part separated from the suspension lead 2, and the lower mold 21 is provided with a gate 23 formed deeply in the thickness direction of the mold plate. Although the present invention is not limited to this, it goes without saying that the gate 23 may be provided on the upper mold or on both sides of the upper mold and the lower mold 21.

As explained above, according to the present invention, in the gate provided in the template, the resin inlet on the cavity side is formed narrowly in the part separated from the suspension lead, and is deep in the thickness direction of the template. Since it was formed,
There is no longer any interference between the suspension lead and the gate when the mold is clamped, unlike in the past. Therefore, the injection of the resin material into the cavity is not hindered by the generation of bubbles, and good resin sealing can be performed.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a semiconductor resin encapsulation device, and FIGS. 2 and 3 show molds of a conventional semiconductor resin encapsulation device.
This figure is a perspective view showing the main part of FIG. 2, and FIG. 5 is a perspective view showing the main part of the mold for the semiconductor resin sealing device according to the present invention. 1...Lead frame, 2...Hanging lead, 3
... Island, 21 ... Lower mold, 23 ... Gate, 23b ... Resin inlet, 24 ... Cavity.

Claims (1)

[Scope of utility model registration request] The central part of the lead frame is provided with two upper and lower mold plates for resin-sealing a semiconductor element on an island held from both sides by hanging leads, and a gate provided on at least one of these two mold plates. The resin inlet on the cavity side is formed in a part closer to one side away from the suspension lead so that it is narrower than the runner side and as deep as the runner side in the thickness direction of the template. 1. A mold for a semiconductor resin encapsulating device, characterized in that the flow is caused to flow along the inner peripheral surface of a cavity.