JPS5837692B2 - Handout Taisouchino Seizouhouhou - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a semiconductor device called a minimod.

In the conventional manufacturing method of this type of semiconductor device, as shown in FIG. 1 and FIG. 2, a film (thin plate) 1 made of polyimide or the like laminated with a foil metal such as copper is first etched to form a pattern. A frame including a lead portion 2 having a shape is formed.

Next, the semiconductor element 4 is mounted on the lead part 2 extending into the hole 3 of the film 1, the semiconductor element mounting part is surrounded by a plastic frame 5 and a partition plate 6, and an epoxy resin 7 or the like is injected. It is molded by casting.

However, according to the above-mentioned manufacturing method, it takes a lot of time to accurately install the partition plate 6 and the frame body 5 on the jig.

In the case of mass production, a frame body 5 and a partition plate 6 are installed at each semiconductor element mounting portion of the film 1, but this requires a lot of time, and resin is sequentially placed inside each frame body 5. It takes a lot of time and a lot of time to perform the injection.

If the frame 5 and the shield plate 6 are not accurately fixed to the element mount section, a gap will be created between the frame and the frame 1 or the shield plate, and resin will flow out from this gap, causing unnecessary resin burrs. In addition, resin protrusions are formed, and dents 8 are formed on the surface of the resin 70, causing problems in use.

The present invention has been made in order to improve the various drawbacks of the above-mentioned conventional methods, and it is an object of the present invention to provide a method for manufacturing a semiconductor device that is easy to work with and does not cause problems in use.

An embodiment of the present invention will be described below with reference to the drawings.

In Fig. 3, 11 is a semiconductor device that performs resin molding;
12 and 13 show a pair of molds for resin molding.

The semiconductor device 11 is the same as that shown in FIGS. 1 and 2, and has a patterned metal foil lead portion 15 laminated on a flexible insulating film 14. A part of the lead portion 15 extends into a hole 16 provided in the thin plate 14, and a semiconductor element 1 is inserted into the extended lead portion 15.
7 is mounted via a gold ball 18.

The molds 12 and 13 are used to inject resin into the element mount portion of the semiconductor device 11 to form a mold.For example, the mold 1
3 is provided with a resin injection groove 20 communicating with the chamber 19 of the molds 12 and 13 in a portion facing the thin plate surface where the lead portion 15 is not formed.

Although not shown, this groove 20 communicates with a resin injection path from the outside.

As shown in FIG. 3, both sides of the film 140 are sandwiched between the molds 12 and 13, the semiconductor element mounting portion is accommodated in the chamber 19, and a resin 2 made of epoxy or the like is poured into the resin injection groove 20.
1 is injected and the element mounting portion is molded with resin at low pressure.

After the molding of the resin is completed, the entire mold is removed from the molds 12 and 13, and the resin molded at the injection groove 200 is also removed.

In this case, since the epoxy resin 21 contains a mold release agent, it does not adhere to the polyimide film 14.
Can be easily removed.

First, in the present invention, resin is injected into the mold from a resin injection groove provided on the surface of the mold facing the insulating thin plate surface opposite to the surface on which the leads are formed.

The thin resin injection groove 20 is provided under the thin insulating plate 15, not on the insulating thin plate 15 where the leads 15 are provided.

Therefore, since the lower surface of the thin plate 15 is the side where the adhesive between the adhesive 15 and the thin plate is not placed, there is an advantage that the resin formed in the injection groove 20 can be easily removed.

1. As described above, in the present invention, the injection groove 20 is provided under the thin plate, so no matter how complicated the leads 15 are arranged (for example, radially) on the thin plate 15, the leads will not get in the way of the resin pourer. Therefore, there is an advantage that resin injection is facilitated.

Although the case in which the number of semiconductor devices is one has been described above, mass production is usually performed.

In this case, naturally, the chamber 19 in the molds 12 and 13 is
By providing a large number of similar chambers, and by providing a resin injection groove similar to the groove 20 in association with each of these chambers, a large number of semiconductor products can be obtained at once as shown in FIG.

As explained above, according to the present invention, it is only necessary to place the insulating thin plate provided with the semiconductor element mounting part in the mold and inject the molding resin, so it is easy to work, suitable for mass production, and Since the insulating thin plate is pressed down by the mold, there is no risk of unnecessary resin burrs being produced, and since sufficient resin can be injected into the mold, semiconductor devices can be manufactured without creating the dents 8 as shown in Figure 2. The manufacturing method can be provided.

[Brief explanation of drawings]

1 and 2 are perspective views and cross-sectional views for explaining a conventional method of manufacturing a semiconductor device, FIG. 3 is a cross-sectional view for explaining an embodiment of the present invention, and FIG. 4 is a cross-sectional view for explaining an embodiment of the present invention. FIG. 3 is a perspective view of the obtained semiconductor device. 12.13... Mold, 14... Film, 15...
- Lead portion, 16... Hole portion, 17... Semiconductor element, 20... Resin injection groove, 21... Prescription resin.

Claims (1)

[Claims] 1 A 79-tone metal foil lead is laminated on a flexible insulating thin plate, and a part of this lead extends into a hole provided in the thin plate. sandwiching both sides of the thin plate with a mold and accommodating the mounting part of the semiconductor element in the mold, in order to cover the semiconductor device with resin, in which the semiconductor element is mounted on the lead, A resin is injected into the mold from a resin injection groove provided on a surface of the mold opposite to the thin plate surface opposite to the surface on which the leads are formed, and the element mount portion is molded at low pressure with the resin. A method for manufacturing a semiconductor device, characterized in that: