JPH0221736U

JPH0221736U -

Info

Publication number: JPH0221736U
Application number: JP9949588U
Authority: JP
Priority date: 1988-07-27
Filing date: 1988-07-27
Publication date: 1990-02-14

Description

[Brief explanation of drawings]

第１図は、樹脂封止用金型を説明する斜視図、
第２図は、チエイスブロツクを示す斜視図、第３
図は、本考案のキヤビテイブロツクを示す平面図
、第４図は、同側面概略図、第５図は、同側面拡
大図、第６図は、従来のキヤビテイブロツクを示
す平面図、第７図は、同側面概略図、第８図は、
同側面拡大図である。１……上部ヒートプレート、１１……ポツト、
２……下部ヒートプレート、２５……キヤビテイ
ブロツク、２６……ランナブロツク、２７……キ
ヤビテイ、２９……ブロツクの表面、２９ａ……
面厚逃げ部、Ｂ，Ｃ……提部。 FIG. 1 is a perspective view illustrating a mold for resin sealing;
Figure 2 is a perspective view showing the chase block; Figure 3 is a perspective view showing the chase block;
4 is a schematic side view of the same side, FIG. 5 is an enlarged view of the same side, and FIG. 6 is a plan view showing a conventional cavity block. Figure 7 is a schematic diagram of the same side, and Figure 8 is a schematic diagram of the same side.
It is an enlarged view of the same side. 1... Upper heat plate, 11... Pot,
2... Lower heat plate, 25... Cavity block, 26... Runner block, 27... Cavity, 29... Block surface, 29a...
Face thickness relief part, B, C... ridge part.

Claims

[Claim for Utility Model Registration] A cavity block provided on the upper heat plate and a cavity block provided on the lower heat plate are brought into contact with each other, and a resin is filled in the cavity between the two cavity blocks to produce a semiconductor inside the cavity. A mold for manufacturing a semiconductor device by sealing a chip, and in any of the above cavity blocks,
A mold for resin-sealing a semiconductor device, characterized in that the periphery of the cavity is surrounded by a rib, and the upper surface of the rib protrudes beyond the other surface of the cavity block.