JPH0231129U - - Google Patents
Info
- Publication number
- JPH0231129U JPH0231129U JP1988110291U JP11029188U JPH0231129U JP H0231129 U JPH0231129 U JP H0231129U JP 1988110291 U JP1988110291 U JP 1988110291U JP 11029188 U JP11029188 U JP 11029188U JP H0231129 U JPH0231129 U JP H0231129U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin material
- molten resin
- lead frame
- passage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims 2
- 238000005538 encapsulation Methods 0.000 claims 1
- 238000003466 welding Methods 0.000 claims 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Reinforced Plastic Materials (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図は、電子部品の樹脂封止成形用金型にお
ける下型要部の平面図である。第２図は、第１図
の―線における金型要部の概略縦断正面図で
ある。第３図の１，２，３は、いずれも溶融樹脂
材料の移送用通路部における圧接手段の形状例を
示す縦断正面図である。第４図の１，２，３は、
いずれも溶融樹脂材料の移送用通路部における他
の実施例を示す縦断正面図である。
〔符号の説明〕１……固定上型、２……可動下
型、３……リードフレーム、４……キヤビテイ、
５……キヤビテイ、６……移送用通路、６１……
ランナ、６２……ゲート、７……圧接手段、８…
…圧接手段、９……圧接手段。
FIG. 1 is a plan view of a main part of a lower mold in a mold for resin-sealing electronic components. FIG. 2 is a schematic longitudinal sectional front view of the main part of the mold taken along the line - in FIG. 1. 1, 2, and 3 in FIG. 3 are longitudinal sectional front views showing examples of the shape of the pressure contact means in the passage section for transferring molten resin material. 1, 2, and 3 in Figure 4 are
Both are longitudinal sectional front views showing other embodiments of the passage section for transferring molten resin material. [Explanation of symbols] 1... Fixed upper mold, 2... Movable lower mold, 3... Lead frame, 4... Cavity,
5...Cavity, 6...Transfer passage, 6 1 ...
Runner, 6 2 ... Gate, 7... Pressing means, 8...
... Pressing means, 9... Pressing means.
Claims (1)
と、該固定及び可動両型のいずれか一方側に配置
した所要数個のポツトと、該両型の型面に対設し
た所要数個のキヤビテイと、上記ポツトと所定の
キヤビテイとの間を連通させる溶融樹脂材料移送
用通路と、上記キヤビテイの周縁部及び溶融樹脂
材料移送用通路の周縁部に突条体から成るリード
フレーム面の圧接手段を配設して構成した電子部
品の樹脂封止成形用金型において、上記溶融樹脂
材料移送用通路に対向配置される型面側に、所要
の突条体から成るリードフレーム面の圧接手段を
配設して構成したことを特徴とする電子部品の樹
脂封止成形用金型。 (2) 固定型と、該固定型に対向配設した可動型
と、該固定及び可動両型のいずれか一方側に配置
した所要数個のポツトと、該両型の型面に対設し
た所要数個のキヤビテイと、上記ポツトと所定の
キヤビテイとの間を連通させる溶融樹脂材料移送
用通路と、上記キヤビテイの周縁部及び溶融樹脂
材料移送用通路の周縁部に突条体から成るリード
フレーム面の圧接手段を配設して構成した電子部
品の樹脂封止成形用金型において、上記溶融樹脂
材料移送用通路に対向配置される型面側に、所要
の突条体から成るリードフレーム面の圧接手段を
配設すると共に、上記溶融樹脂材料移送用通路部
に配設した圧接手段によるリードフレーム面の圧
接力が、上記キヤビテイ部に配設した圧接手段に
よるリードフレーム面の圧接力よりも稍弱くなる
ように設定して構成したことを特徴とする電子部
品の樹脂封止成形用金型。 (3) 溶融樹脂材料移送用通路に対向配置される
型面側に設けたリードフレーム面の圧接手段を、
上記溶融樹脂材料移送用通路の範囲内に配設して
構成したことを特徴とする請求項(1)及び請求項(
2)に記載の電子部品の樹脂封止成形用金型。[Scope of Claim for Utility Model Registration] (1) A fixed mold, a movable mold arranged opposite to the fixed mold, a required number of pots arranged on either side of both the fixed and movable molds, and both the fixed mold and the movable mold. A required number of cavities arranged opposite to the mold surface of the mold, a passage for transferring molten resin material that communicates between the pot and a predetermined cavity, a periphery of the cavity and a periphery of the passage for transferring molten resin material. In a mold for resin-sealing electronic components, which is constructed by arranging a pressure contact means for the lead frame surface made of a protruding strip on the mold surface, the mold surface side facing the passage for transferring the molten resin material is provided with the required amount. A mold for resin-sealing electronic components, characterized in that it is constructed by disposing a pressure contact means for a lead frame surface made of a protruding strip. (2) A fixed mold, a movable mold placed opposite to the fixed mold, a required number of pots placed on either side of both the fixed and movable molds, and a required number of pots placed opposite to the mold surfaces of both molds. A lead frame comprising a required number of cavities, a passage for transferring molten resin material that communicates between the pot and a predetermined cavity, and protruding stripes on the peripheral edge of the cavity and the peripheral edge of the passage for transferring the molten resin material. In a mold for resin-sealing electronic components, which is configured with surface pressure-welding means, a lead frame surface consisting of a required protrusion is provided on the mold surface side facing the molten resin material transfer passage. In addition, the pressure contact force on the lead frame surface by the pressure contact means disposed in the molten resin material transfer passage section is greater than the pressure contact force on the lead frame surface by the pressure contact means disposed in the cavity section. A mold for resin encapsulation of electronic components, characterized in that the mold is configured to be slightly weak. (3) Pressing means for the lead frame surface provided on the mold surface side facing the molten resin material transfer passage,
Claims (1) and (1) characterized in that the structure is arranged within the range of the molten resin material transfer passage.
A mold for resin sealing of electronic components as described in 2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988110291U JPH0510361Y2 (en) | 1988-08-22 | 1988-08-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988110291U JPH0510361Y2 (en) | 1988-08-22 | 1988-08-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0231129U true JPH0231129U (en) | 1990-02-27 |
| JPH0510361Y2 JPH0510361Y2 (en) | 1993-03-15 |
Family
ID=31347317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988110291U Expired - Lifetime JPH0510361Y2 (en) | 1988-08-22 | 1988-08-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0510361Y2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0470112U (en) * | 1990-10-23 | 1992-06-22 | ||
| JPH07156207A (en) * | 1993-12-10 | 1995-06-20 | Nec Corp | Resin sealing mold |
| JP2008149677A (en) * | 2006-12-20 | 2008-07-03 | Sumitomo Heavy Ind Ltd | Resin sealing mold |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS501662A (en) * | 1973-05-07 | 1975-01-09 | ||
| JPS61146517A (en) * | 1984-12-20 | 1986-07-04 | Sanyo Electric Co Ltd | Mold for resin sealing of semiconductor device |
-
1988
- 1988-08-22 JP JP1988110291U patent/JPH0510361Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS501662A (en) * | 1973-05-07 | 1975-01-09 | ||
| JPS61146517A (en) * | 1984-12-20 | 1986-07-04 | Sanyo Electric Co Ltd | Mold for resin sealing of semiconductor device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0470112U (en) * | 1990-10-23 | 1992-06-22 | ||
| JPH07156207A (en) * | 1993-12-10 | 1995-06-20 | Nec Corp | Resin sealing mold |
| JP2008149677A (en) * | 2006-12-20 | 2008-07-03 | Sumitomo Heavy Ind Ltd | Resin sealing mold |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0510361Y2 (en) | 1993-03-15 |