JPH0268114U

JPH0268114U -

Info

Publication number: JPH0268114U
Application number: JP14776888U
Authority: JP
Priority date: 1988-11-11
Filing date: 1988-11-11
Publication date: 1990-05-23
Anticipated expiration: 2003-03-01
Also published as: JPH058106Y2

Description

[Brief explanation of drawings]

第１図は、電子部品の樹脂封止成形用金型にお
ける下型要部の平面図である。第２図は、第１図
の―線における金型要部の概略縦断正面図で
ある。第３図は従来の金型構成例を示す下型要部
の平面図である。第４図は、従来の他の金型構成
例を示す下型要部の平面図である。第５図は第４
図の―線における金型要部の概略縦断正面図
である。符号の説明、１１……上型、１２……下型、１
３……キヤビテイ、１４……キヤビテイ、１５…
…移送用通路、１５_１……ランナ、１５_２……ゲ
ート、１６……リードフレーム、１６_１……外部
リード、１６_２……タイバー、１６_３……タイバ
ー、１７……圧接手段、１７_１……突条面、１７
_２……突条面、１７_３……突条面、１８……エア
ベント、Ｒ，Ｒ_１……溶融樹脂材料。 FIG. 1 is a plan view of a main part of a lower mold in a mold for resin-sealing electronic components. FIG. 2 is a schematic longitudinal sectional front view of the main part of the mold taken along the line - in FIG. 1. FIG. 3 is a plan view of a main part of a lower mold showing an example of a conventional mold configuration. FIG. 4 is a plan view of the main part of the lower mold showing another example of the conventional mold configuration. Figure 5 is the 4th
FIG. 2 is a schematic longitudinal sectional front view of the main part of the mold taken along line - in the figure. Explanation of symbols, 11...upper mold, 12...lower mold, 1
3... Cavity, 14... Cavity, 15...
...transfer passage, 15 ₁ ... runner, 15 ₂ ... gate, 16 ... lead frame, 16 ₁ ... external lead, 16 ₂ ... tie bar, 16 ₃ ... tie bar, 17 ... pressure welding means, 17 ₁ ...Protruding surface, 17
₂ ... Protruding surface, 17 ₃ ... Protruding surface, 18... Air vent, R, R ₁ ... Molten resin material.

Claims

[Scope of utility model registration request]

a fixed mold; a movable mold disposed opposite to the fixed mold;
A required number of pots arranged on either side of both the fixed and movable molds, a required number of cavities arranged opposite to the mold surfaces of both the molds, and a required number of cavities formed on at least one mold surface of the both molds. An air vent that communicates between the cavity and the outside, a passage for transferring molten resin material that communicates between the pot and a predetermined cavity, a required peripheral edge of the cavity on the mold surface of both molds, and a passage for transferring molten resin material. In a mold for resin sealing of electronic components, the lead frame surface pressure contact means is provided with a lead frame surface pressure contact means consisting of a protrusion surface of a predetermined width provided opposite to a predetermined peripheral edge of the lead frame surface. A mold for resin-sealing electronic components, characterized in that only the strips are extended to a required length.