JPS61146956U

JPS61146956U -

Info

Publication number: JPS61146956U
Application number: JP2957085U
Authority: JP
Priority date: 1985-02-28
Filing date: 1985-02-28
Publication date: 1986-09-10

Description

[Brief explanation of drawings]

第１図乃至第６図は本考案リードフレームの実
施例を示すものであり、第１図は半導体素子の樹
脂封止成形後のリードフレームを示す一部切欠平
面図、第２図はその正面図、第３図及び第４図は
本考案リードフレームの他の実施例を示すもので
あり、第３図は樹脂封止成形後のリードフレーム
を示す一部切欠平面図、第４図はその正面図であ
る。第５図はリードフレームと樹脂成形体及び固
化樹脂との付着状態を示す一部切欠拡大斜視図、
第６図はタイバーと固化樹脂との付着状態を示す
一部切欠拡大端面図である。第７図は従来のリー
ドフレームを用いた場合における樹脂封止成形作
用の説明図である。１，１ａ…リードフレーム、３…縁枠、４…外
部用リード、５…タイバー、８…粗面部、１０，
１０ａ…ゲート、１１，１１ａ…キヤビテイ、１
２…樹脂材料、１２_１，１２_２，１２_３…固化樹
脂、１３…ダム部。 Figures 1 to 6 show examples of the lead frame of the present invention. Figure 1 is a partially cutaway plan view showing the lead frame after molding the semiconductor element with resin, and Figure 2 is its front view. 3 and 4 show other embodiments of the lead frame of the present invention, FIG. 3 is a partially cutaway plan view showing the lead frame after resin molding, and FIG. It is a front view. FIG. 5 is a partially cutaway enlarged perspective view showing the state of adhesion between the lead frame, the resin molding, and the solidified resin;
FIG. 6 is an enlarged partially cutaway end view showing the state of adhesion between the tie bar and the solidified resin. FIG. 7 is an explanatory diagram of the resin sealing molding effect when a conventional lead frame is used. 1, 1a...Lead frame, 3...Edge frame, 4...External lead, 5...Tie bar, 8...Rough surface portion, 10,
10a...Gate, 11, 11a...Cavity, 1
2... Resin material, 12 ₁ , 12 ₂ , 12 ₃ ... Solidified resin, 13... Dam portion.

Claims

[Scope of Claim for Utility Model Registration] (1) A lead frame for resin encapsulation of a semiconductor device, which is equipped with a required number of external leads, an edge frame for supporting the leads, and a tie bar, in which the required number of external leads are provided at required locations on the tie bar. A semiconductor lead frame characterized in that a rough surface portion having a predetermined shape to which a resin material is fixed is formed. (2) The semiconductor lead frame according to claim (1) of the utility model registration, in which a rough surface portion is formed only on the joint surface of the tie bar with the mold parting line. (3) The semiconductor lead frame according to claim (1) of the utility model registration, in which a rough surface portion is formed on both the front and back surfaces of the tie bar.