JPH0316361U - - Google Patents
Info
- Publication number
- JPH0316361U JPH0316361U JP7722789U JP7722789U JPH0316361U JP H0316361 U JPH0316361 U JP H0316361U JP 7722789 U JP7722789 U JP 7722789U JP 7722789 U JP7722789 U JP 7722789U JP H0316361 U JPH0316361 U JP H0316361U
- Authority
- JP
- Japan
- Prior art keywords
- led
- lead frame
- sealed
- positions
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005538 encapsulation Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は本考案の第１の実施例のＬＥＤ用リー
ドフレームの平面図、第２図ａ，ｂは第１図のＬ
ＥＤ用リードフレームの使用方法を説明する斜視
図、第３図は本考案の第２実施例のＬＥＤ用リー
ドフレームの平面図、第４図ａ〜ｃは第３図のＬ
ＥＤ用リードフレームの使用方法を説明する斜視
図、第５図は従来のＬＥＤ用リードフレームの一
例の平面図、第６図は第５図のＬＥＤ用リードフ
レームの使用方法の一例を説明する斜視図である
。
１，１１，２１……ＬＥＤ用リードフレーム、
２，１２，２２……第１位置決め穴、３，１３…
…第２位置決め穴、１４……第３位置決め穴、４
，１５，２３……トランスフアーモールド下型、
５，１６，２４……封入寸法位置決めピン。
Fig. 1 is a plan view of the LED lead frame according to the first embodiment of the present invention, and Fig. 2 a and b are L of Fig. 1.
A perspective view illustrating how to use an ED lead frame, FIG. 3 is a plan view of the LED lead frame according to the second embodiment of the present invention, and FIGS.
FIG. 5 is a perspective view illustrating how to use the lead frame for ED, FIG. 5 is a plan view of an example of a conventional lead frame for LED, and FIG. 6 is a perspective view illustrating an example of how to use the lead frame for LED shown in FIG. It is a diagram. 1, 11, 21...Lead frame for LED,
2, 12, 22...first positioning hole, 3, 13...
...Second positioning hole, 14...Third positioning hole, 4
, 15, 23...transfer mold lower mold,
5, 16, 24...Enclosed dimension positioning pin.
Claims (1)
外装樹脂封止されるＬＥＤ用リードフレームにお
いて、封入金型本体の一種類のピン配置で複数の
位置決めが可能なことを特徴とするＬＥＤ用リー
ドフレーム。 1. A lead frame for an LED in which the exterior resin of an LED is sealed by a transfer mold sealing method, characterized in that a plurality of positions can be performed with one type of pin arrangement of the encapsulation mold body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7722789U JPH0316361U (en) | 1989-06-29 | 1989-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7722789U JPH0316361U (en) | 1989-06-29 | 1989-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0316361U true JPH0316361U (en) | 1991-02-19 |
Family
ID=31619417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7722789U Pending JPH0316361U (en) | 1989-06-29 | 1989-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0316361U (en) |
-
1989
- 1989-06-29 JP JP7722789U patent/JPH0316361U/ja active Pending
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