JPS6157538U - - Google Patents
Info
- Publication number
- JPS6157538U JPS6157538U JP14342884U JP14342884U JPS6157538U JP S6157538 U JPS6157538 U JP S6157538U JP 14342884 U JP14342884 U JP 14342884U JP 14342884 U JP14342884 U JP 14342884U JP S6157538 U JPS6157538 U JP S6157538U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- hanging
- lead frame
- frame
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案に係る樹脂封止半導体装置用リ
ードフレームを示す斜視説明図、第２図は同リー
ドフレームにおける吊りリード部を示す上面説明
図、第３図Ａ、第３図Ｂ並びに第３図Ｃはそれぞ
れ本考案リードフレームにおける吊りリード部の
穴形状を示す説明図である。
図において、１は外枠部、４は半導体素子塔載
部、５，５は吊りリード、６１，６２は穴である
。
FIG. 1 is a perspective explanatory view showing a lead frame for a resin-sealed semiconductor device according to the present invention, FIG. 2 is an explanatory top view showing a hanging lead portion of the lead frame, and FIGS. FIG. 3C is an explanatory diagram showing the hole shape of the hanging lead portion in the lead frame of the present invention. In the figure, 1 is an outer frame part, 4 is a semiconductor element mounting part, 5 and 5 are hanging leads, and 61 and 62 are holes.
Claims (1)
ードにより支持してなるリードフレームにおいて
、吊りリードに穴を設けたことを特徴とする樹脂
封止半導体装置用リードフレーム。 (2) 穴の内径が吊りリード巾の１／２〜１／３
であることを特徴とする実用新案登録請求の範囲
第１項記載の樹脂封止半導体装置用リードフレー
ム。[Claims for Utility Model Registration] (1) A lead frame in which a semiconductor element mounting part is supported by a hanging lead within an outer frame, and the resin sealing is characterized in that a hole is provided in the hanging lead. Lead frame for semiconductor devices. (2) The inner diameter of the hole is 1/2 to 1/3 of the hanging lead width.
A lead frame for a resin-sealed semiconductor device according to claim 1, which is characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14342884U JPS6157538U (en) | 1984-09-20 | 1984-09-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14342884U JPS6157538U (en) | 1984-09-20 | 1984-09-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6157538U true JPS6157538U (en) | 1986-04-17 |
Family
ID=30701724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14342884U Pending JPS6157538U (en) | 1984-09-20 | 1984-09-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6157538U (en) |
-
1984
- 1984-09-20 JP JP14342884U patent/JPS6157538U/ja active Pending