JPS62196356U - - Google Patents
Info
- Publication number
- JPS62196356U JPS62196356U JP8495086U JP8495086U JPS62196356U JP S62196356 U JPS62196356 U JP S62196356U JP 8495086 U JP8495086 U JP 8495086U JP 8495086 U JP8495086 U JP 8495086U JP S62196356 U JPS62196356 U JP S62196356U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- wire
- inner lead
- circuit element
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第１図は、本考案の集積回路装置の断面図、第
２図は従来の集積回路の断面図を表わす。
１ａ，１…リード、２…ワイヤー、３…集積回
路素子、４…封止樹脂。
FIG. 1 is a sectional view of an integrated circuit device according to the present invention, and FIG. 2 is a sectional view of a conventional integrated circuit. 1a, 1... Lead, 2... Wire, 3... Integrated circuit element, 4... Sealing resin.
Claims (1)
路素子とインナーリードとを接続するワイヤーが
樹脂封止された集積回路装置において、外部リー
ドと前記のワイヤー接続する際のステツチ部とに
段差を設けたことを特徴とする集積回路装置。 In an integrated circuit device in which an integrated circuit element, an inner lead, and a wire connecting the integrated circuit element and the inner lead are sealed with resin, a step is provided between the external lead and the stitching part when connecting the wire. Features of integrated circuit devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8495086U JPS62196356U (en) | 1986-06-03 | 1986-06-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8495086U JPS62196356U (en) | 1986-06-03 | 1986-06-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62196356U true JPS62196356U (en) | 1987-12-14 |
Family
ID=30939910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8495086U Pending JPS62196356U (en) | 1986-06-03 | 1986-06-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62196356U (en) |
-
1986
- 1986-06-03 JP JP8495086U patent/JPS62196356U/ja active Pending