JPS63118236U - - Google Patents
Info
- Publication number
- JPS63118236U JPS63118236U JP815587U JP815587U JPS63118236U JP S63118236 U JPS63118236 U JP S63118236U JP 815587 U JP815587 U JP 815587U JP 815587 U JP815587 U JP 815587U JP S63118236 U JPS63118236 U JP S63118236U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- outer end
- leads
- lead frame
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の第１の実施例を示す半導体装
置のフイルムテープ上のリードとリードフレーム
との接続部を示す要部平面図、第２図は従来の半
導体装置のリードとリードフレームの接続部を示
す要部断面図、第３図は第２図のリードとリード
フレームの接続部を示す断面図、第４図は第１図
のリードとリードフレームの接続部を示す断面図
、第５図〜第７図はそれぞれ本考案の第２〜第４
の実施例を示す半導体装置のリードとリードフレ
ームの接続部を示す断面図、第８図は本考案の実
施例の変形例を示すリードとリードフレームの斜
視図である。
１１……フイルムテープ、１２，２１，３１，
４１……リード、１３……内方端部、１４，２２
，３２，４２……外方端部、１５，２４，３４，
４４……リードフレーム、１６，２５，３５，４
５……インナーリード部、１７，２３，３６，４
３……凹部、１８……端部、３３，４６……凸部
。
FIG. 1 is a plan view of the main parts showing the connection between the leads on the film tape of a semiconductor device and the lead frame, showing the first embodiment of the present invention, and FIG. 2 shows the connection between the leads and the lead frame of a conventional semiconductor device. 3 is a sectional view showing the connection between the lead and lead frame in FIG. 2; FIG. 4 is a sectional view showing the connection between the lead and lead frame in FIG. 1; Figures 5 to 7 are the second to fourth figures of the present invention, respectively.
FIG. 8 is a cross-sectional view showing a connecting portion between a lead and a lead frame of a semiconductor device showing an embodiment of the present invention, and FIG. 8 is a perspective view of a lead and a lead frame showing a modification of the embodiment of the present invention. 11...Film tape, 12, 21, 31,
41...Lead, 13...Inner end, 14, 22
, 32, 42...outer end, 15, 24, 34,
44... Lead frame, 16, 25, 35, 4
5...Inner lead part, 17, 23, 36, 4
3... Concave portion, 18... End portion, 33, 46... Convex portion.
Claims (1)
子と接続された内方端部及び外部接続用の外方端
部を有する複数のリードと、前記外方端部と接続
される複数のインナーリード部を有するリードフ
レームとを備えた半導体装置において、 前記リードの外方端部と前記インナーリード部
との接続箇所に係合部を設けたことを特徴とする
半導体装置。[Claims for Utility Model Registration] A plurality of leads formed on an insulating film tape and having an inner end connected to a semiconductor element and an outer end for external connection, and a plurality of leads connected to the outer end. What is claimed is: 1. A semiconductor device comprising: a lead frame having a plurality of inner lead parts, wherein an engaging part is provided at a connection point between an outer end of the lead and the inner lead part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP815587U JPS63118236U (en) | 1987-01-23 | 1987-01-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP815587U JPS63118236U (en) | 1987-01-23 | 1987-01-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63118236U true JPS63118236U (en) | 1988-07-30 |
Family
ID=30792273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP815587U Pending JPS63118236U (en) | 1987-01-23 | 1987-01-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63118236U (en) |
-
1987
- 1987-01-23 JP JP815587U patent/JPS63118236U/ja active Pending