JPH01130549U - - Google Patents
Info
- Publication number
- JPH01130549U JPH01130549U JP2778188U JP2778188U JPH01130549U JP H01130549 U JPH01130549 U JP H01130549U JP 2778188 U JP2778188 U JP 2778188U JP 2778188 U JP2778188 U JP 2778188U JP H01130549 U JPH01130549 U JP H01130549U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealed
- chip
- elastic
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
本考案の他の実施例の断面図、第３図は従来のＩ
Ｃパツケージの断面図である。
第１図において、１１……導電性ゴム、１２…
…チツプ、１３……端子、１４……本体、１５…
…パツケージ、１６……端子封止部である。第２
図において、２１……接続部、２２……チツプ、
２３……端子、２４……本体である。第３図にお
いて、３１……接続線、３２……チツプ、３３…
…端子、３４……本体である。
Fig. 1 is a sectional view of one embodiment of the present invention, Fig. 2 is a sectional view of another embodiment of the invention, and Fig. 3 is a sectional view of a conventional I.
It is a sectional view of the C package. In FIG. 1, 11... conductive rubber, 12...
...Chip, 13...Terminal, 14...Body, 15...
. . . package, 16 . . . terminal sealing portion. Second
In the figure, 21...connection part, 22...chip,
23...terminal, 24...main body. In FIG. 3, 31... connection line, 32... chip, 33...
...terminal, 34...main body.
Claims (1)
る第２の樹脂でその外側をさらに封止したことを
特徴とするＩＣパツケージ。 An IC package characterized in that an IC chip is sealed with a first resin, and the outside thereof is further sealed with an elastic second resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2778188U JPH01130549U (en) | 1988-03-01 | 1988-03-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2778188U JPH01130549U (en) | 1988-03-01 | 1988-03-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01130549U true JPH01130549U (en) | 1989-09-05 |
Family
ID=31250575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2778188U Pending JPH01130549U (en) | 1988-03-01 | 1988-03-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01130549U (en) |
-
1988
- 1988-03-01 JP JP2778188U patent/JPH01130549U/ja active Pending
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