JPS62138455U - - Google Patents
Info
- Publication number
- JPS62138455U JPS62138455U JP2492786U JP2492786U JPS62138455U JP S62138455 U JPS62138455 U JP S62138455U JP 2492786 U JP2492786 U JP 2492786U JP 2492786 U JP2492786 U JP 2492786U JP S62138455 U JPS62138455 U JP S62138455U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- lead frame
- semiconductor
- mounting base
- element mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000725 suspension Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例を示す斜視図である
。
１…半導体素子搭載台部を支持する吊りリード
部、２…リードの段差部、３…穴である。
FIG. 1 is a perspective view showing an embodiment of the present invention. Reference numerals 1: Hanging lead portion supporting the semiconductor element mounting base; 2: Step portion of the lead; 3: Hole.
Claims (1)
て、半導体素子搭載台部を支持する吊りリードに
穴を有し、かつその穴の少なくとも１ケ所におい
て段差を有していることを特徴とする樹脂封止型
半導体装置用リードフレーム。 A resin-sealed lead frame for a semiconductor device, characterized in that a suspension lead supporting a semiconductor element mounting base has a hole, and the hole has a step at least in one place. Lead frame for semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2492786U JPS62138455U (en) | 1986-02-21 | 1986-02-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2492786U JPS62138455U (en) | 1986-02-21 | 1986-02-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62138455U true JPS62138455U (en) | 1987-09-01 |
Family
ID=30824599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2492786U Pending JPS62138455U (en) | 1986-02-21 | 1986-02-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62138455U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005311214A (en) * | 2004-04-26 | 2005-11-04 | Mitsubishi Electric Corp | Semiconductor device and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4918591U (en) * | 1972-05-19 | 1974-02-16 | ||
| JPS558924A (en) * | 1978-06-29 | 1980-01-22 | Shin Meiwa Ind Co Ltd | Boat |
| JPS5624375A (en) * | 1979-08-03 | 1981-03-07 | Xerox Corp | Developing unit for electrophotographic copying machine |
-
1986
- 1986-02-21 JP JP2492786U patent/JPS62138455U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4918591U (en) * | 1972-05-19 | 1974-02-16 | ||
| JPS558924A (en) * | 1978-06-29 | 1980-01-22 | Shin Meiwa Ind Co Ltd | Boat |
| JPS5624375A (en) * | 1979-08-03 | 1981-03-07 | Xerox Corp | Developing unit for electrophotographic copying machine |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005311214A (en) * | 2004-04-26 | 2005-11-04 | Mitsubishi Electric Corp | Semiconductor device and manufacturing method thereof |
| JP4515810B2 (en) * | 2004-04-26 | 2010-08-04 | 三菱電機株式会社 | Semiconductor device and manufacturing method thereof |