JPS63124111U - - Google Patents
Info
- Publication number
- JPS63124111U JPS63124111U JP1676487U JP1676487U JPS63124111U JP S63124111 U JPS63124111 U JP S63124111U JP 1676487 U JP1676487 U JP 1676487U JP 1676487 U JP1676487 U JP 1676487U JP S63124111 U JPS63124111 U JP S63124111U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- cavity
- mold
- resin molding
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 4
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案に係る樹脂モールド装置の実施
例を示す縦断側面図、第２図は本考案装置による
完成品の一例を示す斜視図、第３図は従来の樹脂
モールド装置の縦断側面図、第４図は従来装置に
よる完成品の一例を示す斜視図である。
１ａ……上金型、１ｂ……下金型、２ａ，２ｂ
……キヤビテイ、３……リードフレーム、４……
ゲート、５……エアベント、６……電子部品、７
……ボイド、８……リード、９……完成品、１０
……リード識別部、１１……リード識別部形成用
突起。
Fig. 1 is a vertical side view showing an embodiment of the resin molding device according to the present invention, Fig. 2 is a perspective view showing an example of a finished product produced by the device of the present invention, and Fig. 3 is a longitudinal side view of a conventional resin molding device. , FIG. 4 is a perspective view showing an example of a completed product produced by a conventional device. 1a... Upper mold, 1b... Lower mold, 2a, 2b
...Cavity, 3...Lead frame, 4...
Gate, 5...Air vent, 6...Electronic component, 7
...Void, 8...Lead, 9...Finished product, 10
...Lead identification part, 11...Protrusion for forming lead identification part.
Claims (1)
の樹脂モールド予定部を分割可能な金型のキヤビ
テイ内に配置し、上記キヤビテイ内への樹脂の加
圧充填により上記リードフレームを樹脂モールド
する装置において、 電子部品実装部側の金型のエアベントに近接し
てリード識別部形成用突起を設けたことを特徴と
する樹脂モールド装置。[Scope of Claim for Utility Model Registration] The resin-molded portion of a lead frame with electronic components mounted on one side is placed in the cavity of a splittable mold, and the lead frame is filled with resin under pressure into the cavity. A resin molding apparatus for resin molding a frame, characterized in that a protrusion for forming a lead identification part is provided close to an air vent of a mold on an electronic component mounting part side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1676487U JPS63124111U (en) | 1987-02-06 | 1987-02-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1676487U JPS63124111U (en) | 1987-02-06 | 1987-02-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63124111U true JPS63124111U (en) | 1988-08-12 |
Family
ID=30808914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1676487U Pending JPS63124111U (en) | 1987-02-06 | 1987-02-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63124111U (en) |
-
1987
- 1987-02-06 JP JP1676487U patent/JPS63124111U/ja active Pending
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