JPS6416635U - - Google Patents
Info
- Publication number
- JPS6416635U JPS6416635U JP11147087U JP11147087U JPS6416635U JP S6416635 U JPS6416635 U JP S6416635U JP 11147087 U JP11147087 U JP 11147087U JP 11147087 U JP11147087 U JP 11147087U JP S6416635 U JPS6416635 U JP S6416635U
- Authority
- JP
- Japan
- Prior art keywords
- pin
- lead frame
- movable
- lower mold
- relative
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案に係る樹脂モールド装置を示す
要部断面図、第２図は第１図のＡ―Ａ線矢視図、
第３図は上記モールド装置の動作時での要部断面
図である。第４図はリードフレームの一例を示す
平面図、第５図は従来の樹脂モールド装置を示す
要部断面図である。
１……リードフレーム、８……上金型、２１…
…樹脂モールド装置、２２……下金型、２３……
キヤビテイ、２４……ノツクアウトピン、２６…
…リードフレーム位置決め用ゲージピン（ゲージ
ピン）、２８……連動機構。
FIG. 1 is a sectional view of a main part showing a resin molding device according to the present invention, FIG. 2 is a view taken along the line AA in FIG. 1,
FIG. 3 is a sectional view of the main part of the molding device during operation. FIG. 4 is a plan view showing an example of a lead frame, and FIG. 5 is a sectional view of a main part showing a conventional resin molding device. 1...Lead frame, 8...Upper mold, 21...
... Resin molding device, 22 ... Lower mold, 23 ...
Cavity, 24... Knockout pin, 26...
...Gauge pin for lead frame positioning (gauge pin), 28...Interlocking mechanism.
Claims (1)
と相対上下動可能に配設されてキヤビテイ内に入
退するノツクアウトピンを備えた下型と、上型と
でリードフレームを挟持して樹脂モールドする装
置において、 上記ゲージピンをノツクアウトピンの相対上下
動と逆方向に連動して上下動自在に配設したこと
を特徴とする樹脂モールド装置。[Scope of Claim for Utility Model Registration] A lead frame is held between a lower mold and an upper mold, which are equipped with a gauge pin for positioning the lead frame and a knock-out pin that is arranged to be movable up and down relative to the lower mold and enters and retreats into the cavity. A resin molding apparatus characterized in that the gauge pin is arranged to be movable up and down in conjunction with the relative up and down movement of the knockout pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11147087U JPH0543475Y2 (en) | 1987-07-20 | 1987-07-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11147087U JPH0543475Y2 (en) | 1987-07-20 | 1987-07-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6416635U true JPS6416635U (en) | 1989-01-27 |
| JPH0543475Y2 JPH0543475Y2 (en) | 1993-11-02 |
Family
ID=31349543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11147087U Expired - Lifetime JPH0543475Y2 (en) | 1987-07-20 | 1987-07-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0543475Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108604578B (en) | 2016-02-09 | 2021-07-16 | 三菱电机株式会社 | Power semiconductor device and method for manufacturing the same |
-
1987
- 1987-07-20 JP JP11147087U patent/JPH0543475Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0543475Y2 (en) | 1993-11-02 |
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